JPS6190835U - - Google Patents
Info
- Publication number
- JPS6190835U JPS6190835U JP17522184U JP17522184U JPS6190835U JP S6190835 U JPS6190835 U JP S6190835U JP 17522184 U JP17522184 U JP 17522184U JP 17522184 U JP17522184 U JP 17522184U JP S6190835 U JPS6190835 U JP S6190835U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- electronic components
- utility
- scope
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 description 1
Landscapes
- Adhesive Tapes (AREA)
Description
第１図は本考案の一実施例による電子部品搭載
用テープの部分平面図である。
１……キヤリアテープ、２……ガイドホール、
３，３′……開孔、４……ミシン目、５……粘着
テープ。
FIG. 1 is a partial plan view of an electronic component mounting tape according to an embodiment of the present invention. 1...Carrier tape, 2...Guide hole,
3, 3'...opening, 4...perforation, 5...adhesive tape.
Claims (1)
れたことを特徴とする電子部品搭載用テープ。 A tape for mounting electronic components that features perforations in the tape that adhesively fixes electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17522184U JPS6190835U (en) | 1984-11-19 | 1984-11-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17522184U JPS6190835U (en) | 1984-11-19 | 1984-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6190835U true JPS6190835U (en) | 1986-06-12 |
Family
ID=30732825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17522184U Pending JPS6190835U (en) | 1984-11-19 | 1984-11-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6190835U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001051580A1 (en) * | 2000-01-13 | 2001-07-19 | Nitto Denko Corporation | Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof |
-
1984
- 1984-11-19 JP JP17522184U patent/JPS6190835U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001051580A1 (en) * | 2000-01-13 | 2001-07-19 | Nitto Denko Corporation | Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof |
| US7056406B2 (en) | 2000-01-13 | 2006-06-06 | Nitto Denko Corporation | Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof |
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