JPS61909B2 - - Google Patents

Info

Publication number
JPS61909B2
JPS61909B2 JP16925082A JP16925082A JPS61909B2 JP S61909 B2 JPS61909 B2 JP S61909B2 JP 16925082 A JP16925082 A JP 16925082A JP 16925082 A JP16925082 A JP 16925082A JP S61909 B2 JPS61909 B2 JP S61909B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP16925082A
Other versions
JPS5959870A (ja
Inventor
Akishi Nakaso
Kyoshi Yamanoi
Toshiro Okamura
Yoshuki Tsuru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP16925082A priority Critical patent/JPS5959870A/ja
Priority to US06/535,057 priority patent/US4548644A/en
Priority to EP83109644A priority patent/EP0107087B1/en
Priority to DE8383109644T priority patent/DE3367940D1/de
Priority to KR1019830004572A priority patent/KR880000471B1/ko
Publication of JPS5959870A publication Critical patent/JPS5959870A/ja
Publication of JPS61909B2 publication Critical patent/JPS61909B2/ja
Priority to SG49087A priority patent/SG49087G/en
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP16925082A 1982-09-28 1982-09-28 無電解銅めつき液 Granted JPS5959870A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP16925082A JPS5959870A (ja) 1982-09-28 1982-09-28 無電解銅めつき液
US06/535,057 US4548644A (en) 1982-09-28 1983-09-23 Electroless copper deposition solution
EP83109644A EP0107087B1 (en) 1982-09-28 1983-09-27 Electroless copper deposition solution
DE8383109644T DE3367940D1 (en) 1982-09-28 1983-09-27 Electroless copper deposition solution
KR1019830004572A KR880000471B1 (ko) 1982-09-28 1983-09-28 무전해 구리 용착액
SG49087A SG49087G (en) 1982-09-28 1987-06-03 Electroless copper deposition solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16925082A JPS5959870A (ja) 1982-09-28 1982-09-28 無電解銅めつき液

Publications (2)

Publication Number Publication Date
JPS5959870A JPS5959870A (ja) 1984-04-05
JPS61909B2 true JPS61909B2 (ja) 1986-01-11

Family

ID=15883022

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16925082A Granted JPS5959870A (ja) 1982-09-28 1982-09-28 無電解銅めつき液

Country Status (1)

Country Link
JP (1) JPS5959870A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0586507U (ja) * 1992-04-28 1993-11-22 日工株式会社 コンクリートミキサの軸封装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5255015B2 (ja) * 2010-04-28 2013-08-07 名古屋メッキ工業株式会社 高分子繊維の無電解銅めっき方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0586507U (ja) * 1992-04-28 1993-11-22 日工株式会社 コンクリートミキサの軸封装置

Also Published As

Publication number Publication date
JPS5959870A (ja) 1984-04-05

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