JPS6196439U - - Google Patents

Info

Publication number
JPS6196439U
JPS6196439U JP18088484U JP18088484U JPS6196439U JP S6196439 U JPS6196439 U JP S6196439U JP 18088484 U JP18088484 U JP 18088484U JP 18088484 U JP18088484 U JP 18088484U JP S6196439 U JPS6196439 U JP S6196439U
Authority
JP
Japan
Prior art keywords
contact piece
fixed contact
electromagnetic relay
movable contact
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18088484U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18088484U priority Critical patent/JPS6196439U/ja
Publication of JPS6196439U publication Critical patent/JPS6196439U/ja
Pending legal-status Critical Current

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  • Contacts (AREA)
JP18088484U 1984-11-30 1984-11-30 Pending JPS6196439U (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18088484U JPS6196439U (2) 1984-11-30 1984-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18088484U JPS6196439U (2) 1984-11-30 1984-11-30

Publications (1)

Publication Number Publication Date
JPS6196439U true JPS6196439U (2) 1986-06-20

Family

ID=30738443

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18088484U Pending JPS6196439U (2) 1984-11-30 1984-11-30

Country Status (1)

Country Link
JP (1) JPS6196439U (2)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7566635B2 (en) 2002-03-12 2009-07-28 Hamamatsu Photonics K.K. Substrate dividing method
US8927900B2 (en) 2000-09-13 2015-01-06 Hamamatsu Photonics K.K. Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
US8969752B2 (en) 2003-03-12 2015-03-03 Hamamatsu Photonics K.K. Laser processing method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8927900B2 (en) 2000-09-13 2015-01-06 Hamamatsu Photonics K.K. Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
US8933369B2 (en) 2000-09-13 2015-01-13 Hamamatsu Photonics K.K. Method of cutting a substrate and method of manufacturing a semiconductor device
US8946589B2 (en) 2000-09-13 2015-02-03 Hamamatsu Photonics K.K. Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device
US8969761B2 (en) 2000-09-13 2015-03-03 Hamamatsu Photonics K.K. Method of cutting a wafer-like object and semiconductor chip
US7566635B2 (en) 2002-03-12 2009-07-28 Hamamatsu Photonics K.K. Substrate dividing method
US8969752B2 (en) 2003-03-12 2015-03-03 Hamamatsu Photonics K.K. Laser processing method

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