JPS6210501U - - Google Patents
Info
- Publication number
- JPS6210501U JPS6210501U JP10210885U JP10210885U JPS6210501U JP S6210501 U JPS6210501 U JP S6210501U JP 10210885 U JP10210885 U JP 10210885U JP 10210885 U JP10210885 U JP 10210885U JP S6210501 U JPS6210501 U JP S6210501U
- Authority
- JP
- Japan
- Prior art keywords
- dielectric substrate
- dielectric
- conductor
- coated
- inner conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims 2
- 239000012783 reinforcing fiber Substances 0.000 claims 1
Landscapes
- Combinations Of Printed Boards (AREA)
- Waveguide Connection Structure (AREA)
- Waveguides (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図は従来の実施例を示す断面図である。
図において、１は誘電体基板、２は外部導体、
３は内部導体、４は端子、５は構造部材、６は端
子固定用ネジ、７は誘電基板固定用ネジ、８は導
電体、９はブツシユである。なお、図中同一ある
いは相当部分には同一符号を付して示してある。
FIG. 1 is a sectional view showing an embodiment of this invention, and FIG. 2 is a sectional view showing a conventional embodiment. In the figure, 1 is a dielectric substrate, 2 is an external conductor,
3 is an internal conductor, 4 is a terminal, 5 is a structural member, 6 is a terminal fixing screw, 7 is a dielectric board fixing screw, 8 is a conductor, and 9 is a bush. It should be noted that the same or corresponding parts in the figures are indicated by the same reference numerals.
Claims (1)
体基板と、前記第１の誘電体基板の外部導体に垂
直に設けた第１の端子と、各々の外部導体が外側
になるよう前記第１の誘電体基板に重ね合せた一
面に外部導体を被着しかつ他の一面に内部導体を
被着した平板状の第２の誘電体基板と、前記第２
の誘電体基板の外部導体に垂直でかつ内部導体に
接続するよう設けた第２の端子と、前記第１の端
子と前記第２の誘電体基板の内部導体とを接続す
る導電体とよりなるトリプレート線路形マイクロ
波回路において、誘電体コアと誘電体の強化繊維
からなる表皮材とにより形成されたサンドイツチ
構造の材料で前記第１、第２の誘電体基板を形成
したことを特徴とするトリプレート線路形マイク
ロ波回路。 a flat first dielectric substrate having an external conductor coated on one surface; a first terminal provided perpendicularly to the external conductor of the first dielectric substrate; a flat second dielectric substrate overlaid on the first dielectric substrate and having an outer conductor coated on one side and an inner conductor coated on the other side;
a second terminal provided perpendicular to the outer conductor of the dielectric substrate and connected to the inner conductor; and a conductor connecting the first terminal and the inner conductor of the second dielectric substrate. In the tri-plate line type microwave circuit, the first and second dielectric substrates are formed of a material having a sandwich structure formed of a dielectric core and a skin material made of dielectric reinforcing fibers. Tri-plate line type microwave circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10210885U JPS6210501U (en) | 1985-07-04 | 1985-07-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10210885U JPS6210501U (en) | 1985-07-04 | 1985-07-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6210501U true JPS6210501U (en) | 1987-01-22 |
Family
ID=30973451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10210885U Pending JPS6210501U (en) | 1985-07-04 | 1985-07-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6210501U (en) |
-
1985
- 1985-07-04 JP JP10210885U patent/JPS6210501U/ja active Pending
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