JPS62107444U - - Google Patents

Info

Publication number
JPS62107444U
JPS62107444U JP1985200115U JP20011585U JPS62107444U JP S62107444 U JPS62107444 U JP S62107444U JP 1985200115 U JP1985200115 U JP 1985200115U JP 20011585 U JP20011585 U JP 20011585U JP S62107444 U JPS62107444 U JP S62107444U
Authority
JP
Japan
Prior art keywords
semiconductor pellet
wiring board
semiconductor
adhesive
terminal portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985200115U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985200115U priority Critical patent/JPS62107444U/ja
Publication of JPS62107444U publication Critical patent/JPS62107444U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP1985200115U 1985-12-25 1985-12-25 Pending JPS62107444U (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985200115U JPS62107444U (de) 1985-12-25 1985-12-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985200115U JPS62107444U (de) 1985-12-25 1985-12-25

Publications (1)

Publication Number Publication Date
JPS62107444U true JPS62107444U (de) 1987-07-09

Family

ID=31162326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985200115U Pending JPS62107444U (de) 1985-12-25 1985-12-25

Country Status (1)

Country Link
JP (1) JPS62107444U (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0340445A (ja) * 1989-07-07 1991-02-21 Oki Electric Ind Co Ltd 異方性導電接着剤を用いた集積回路の実装方法
JPH0766286A (ja) * 1991-07-01 1995-03-10 At & T Corp 集積回路と基板との電気的接続方法及び集積回路組立体
WO2000074023A1 (fr) * 1999-05-31 2000-12-07 Citizen Watch Co., Ltd. Structure de connexions electriques et ecran plat

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0340445A (ja) * 1989-07-07 1991-02-21 Oki Electric Ind Co Ltd 異方性導電接着剤を用いた集積回路の実装方法
JPH0766286A (ja) * 1991-07-01 1995-03-10 At & T Corp 集積回路と基板との電気的接続方法及び集積回路組立体
WO2000074023A1 (fr) * 1999-05-31 2000-12-07 Citizen Watch Co., Ltd. Structure de connexions electriques et ecran plat

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