JPS62118460U - - Google Patents
Info
- Publication number
- JPS62118460U JPS62118460U JP1986005303U JP530386U JPS62118460U JP S62118460 U JPS62118460 U JP S62118460U JP 1986005303 U JP1986005303 U JP 1986005303U JP 530386 U JP530386 U JP 530386U JP S62118460 U JPS62118460 U JP S62118460U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- resin
- receiving device
- lead frame
- light receiving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986005303U JPS62118460U (da) | 1986-01-17 | 1986-01-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986005303U JPS62118460U (da) | 1986-01-17 | 1986-01-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62118460U true JPS62118460U (da) | 1987-07-28 |
Family
ID=30786759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986005303U Pending JPS62118460U (da) | 1986-01-17 | 1986-01-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62118460U (da) |
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1986
- 1986-01-17 JP JP1986005303U patent/JPS62118460U/ja active Pending