JPS62145848A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS62145848A
JPS62145848A JP60288284A JP28828485A JPS62145848A JP S62145848 A JPS62145848 A JP S62145848A JP 60288284 A JP60288284 A JP 60288284A JP 28828485 A JP28828485 A JP 28828485A JP S62145848 A JPS62145848 A JP S62145848A
Authority
JP
Japan
Prior art keywords
nickel
treatment
external leads
soldering
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60288284A
Other languages
English (en)
Japanese (ja)
Other versions
JPH04596B2 (2
Inventor
Toshio Hamano
浜野　寿夫
Takeshi Takenaka
竹中　武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60288284A priority Critical patent/JPS62145848A/ja
Publication of JPS62145848A publication Critical patent/JPS62145848A/ja
Publication of JPH04596B2 publication Critical patent/JPH04596B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP60288284A 1985-12-20 1985-12-20 半導体装置の製造方法 Granted JPS62145848A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60288284A JPS62145848A (ja) 1985-12-20 1985-12-20 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60288284A JPS62145848A (ja) 1985-12-20 1985-12-20 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS62145848A true JPS62145848A (ja) 1987-06-29
JPH04596B2 JPH04596B2 (2) 1992-01-08

Family

ID=17728168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60288284A Granted JPS62145848A (ja) 1985-12-20 1985-12-20 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS62145848A (2)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311353A (ja) * 2004-04-16 2005-11-04 Samsung Techwin Co Ltd リードフレーム及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311353A (ja) * 2004-04-16 2005-11-04 Samsung Techwin Co Ltd リードフレーム及びその製造方法

Also Published As

Publication number Publication date
JPH04596B2 (2) 1992-01-08

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