JPS62156931A - 多層プリント配線板の製造方法及びこれに使用する装置 - Google Patents

多層プリント配線板の製造方法及びこれに使用する装置

Info

Publication number
JPS62156931A
JPS62156931A JP60297415A JP29741585A JPS62156931A JP S62156931 A JPS62156931 A JP S62156931A JP 60297415 A JP60297415 A JP 60297415A JP 29741585 A JP29741585 A JP 29741585A JP S62156931 A JPS62156931 A JP S62156931A
Authority
JP
Japan
Prior art keywords
surface plate
flexible sheet
wiring board
printed wiring
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60297415A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0453168B2 (da
Inventor
Katsumi Kosaka
克己 匂坂
Mamoru Kawasaki
衛 川崎
Kunio Setsuda
説田　国男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP60297415A priority Critical patent/JPS62156931A/ja
Publication of JPS62156931A publication Critical patent/JPS62156931A/ja
Publication of JPH0453168B2 publication Critical patent/JPH0453168B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3642—Bags, bleeder sheets or cauls for isostatic pressing
    • B29C2043/3647—Membranes, diaphragms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
JP60297415A 1985-12-28 1985-12-28 多層プリント配線板の製造方法及びこれに使用する装置 Granted JPS62156931A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60297415A JPS62156931A (ja) 1985-12-28 1985-12-28 多層プリント配線板の製造方法及びこれに使用する装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60297415A JPS62156931A (ja) 1985-12-28 1985-12-28 多層プリント配線板の製造方法及びこれに使用する装置

Publications (2)

Publication Number Publication Date
JPS62156931A true JPS62156931A (ja) 1987-07-11
JPH0453168B2 JPH0453168B2 (da) 1992-08-25

Family

ID=17846208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60297415A Granted JPS62156931A (ja) 1985-12-28 1985-12-28 多層プリント配線板の製造方法及びこれに使用する装置

Country Status (1)

Country Link
JP (1) JPS62156931A (da)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5157828A (en) * 1989-01-25 1992-10-27 Siemens Automotive S.A. Method and device for fastening an electronic circuit substrate onto a support
US5297480A (en) * 1991-05-09 1994-03-29 Hitachi Techno Engineering Co., Ltd. High vacuum hot press
US5558015A (en) * 1993-12-28 1996-09-24 Hitachi Techno Engineering Co., Ltd. Hot press with pressure vessels to uniformly distribute pressure to the work piece
US5578159A (en) * 1993-06-29 1996-11-26 Hitachi Techno Engineering Co., Ltd. Hot press for producing multilayer circuit board
JP2014107503A (ja) * 2012-11-29 2014-06-09 Mikado Kiki Hanbai Kk 真空加熱加圧封止成形装置及び真空加熱加圧封止成形方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102642368A (zh) * 2012-04-05 2012-08-22 福兴达科技实业（深圳）有限公司 粘贴治具及其应用方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52148561A (en) * 1976-06-07 1977-12-09 Kanebo Ltd Method of manufacture of resin laminated sheet

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52148561A (en) * 1976-06-07 1977-12-09 Kanebo Ltd Method of manufacture of resin laminated sheet

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5157828A (en) * 1989-01-25 1992-10-27 Siemens Automotive S.A. Method and device for fastening an electronic circuit substrate onto a support
US5297480A (en) * 1991-05-09 1994-03-29 Hitachi Techno Engineering Co., Ltd. High vacuum hot press
US5578159A (en) * 1993-06-29 1996-11-26 Hitachi Techno Engineering Co., Ltd. Hot press for producing multilayer circuit board
US5558015A (en) * 1993-12-28 1996-09-24 Hitachi Techno Engineering Co., Ltd. Hot press with pressure vessels to uniformly distribute pressure to the work piece
JP2014107503A (ja) * 2012-11-29 2014-06-09 Mikado Kiki Hanbai Kk 真空加熱加圧封止成形装置及び真空加熱加圧封止成形方法

Also Published As

Publication number Publication date
JPH0453168B2 (da) 1992-08-25

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