JPS6217122U - - Google Patents

Info

Publication number
JPS6217122U
JPS6217122U JP1985107856U JP10785685U JPS6217122U JP S6217122 U JPS6217122 U JP S6217122U JP 1985107856 U JP1985107856 U JP 1985107856U JP 10785685 U JP10785685 U JP 10785685U JP S6217122 U JPS6217122 U JP S6217122U
Authority
JP
Japan
Prior art keywords
tank
holes
processing
utility
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985107856U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0642333Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985107856U priority Critical patent/JPH0642333Y2/ja
Priority to DE19863623233 priority patent/DE3623233A1/de
Priority to KR1019860005591A priority patent/KR870001648A/ko
Publication of JPS6217122U publication Critical patent/JPS6217122U/ja
Priority to KR2019900012096U priority patent/KR910001932Y1/ko
Application granted granted Critical
Publication of JPH0642333Y2 publication Critical patent/JPH0642333Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0426—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0404—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
    • B05C3/02—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material
    • B05C3/09—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material the work being immersed in the liquid or other fluent material for treating separate articles
    • B05C3/109—Passing liquids or other fluent materials into or through chambers containing stationary articles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0416—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

Landscapes

  • Weting (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP1985107856U 1985-07-15 1985-07-15 半導体材料の処理槽 Expired - Lifetime JPH0642333Y2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1985107856U JPH0642333Y2 (ja) 1985-07-15 1985-07-15 半導体材料の処理槽
DE19863623233 DE3623233A1 (de) 1985-07-15 1986-07-10 Becken zur behandlung von halbleitermaterialien
KR1019860005591A KR870001648A (ko) 1985-07-15 1986-07-11 반도체 재료의 처리조(處理槽)
KR2019900012096U KR910001932Y1 (ko) 1985-07-15 1990-08-10 반도체 재료의 처리조

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985107856U JPH0642333Y2 (ja) 1985-07-15 1985-07-15 半導体材料の処理槽

Publications (2)

Publication Number Publication Date
JPS6217122U true JPS6217122U (mo) 1987-02-02
JPH0642333Y2 JPH0642333Y2 (ja) 1994-11-02

Family

ID=14469797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985107856U Expired - Lifetime JPH0642333Y2 (ja) 1985-07-15 1985-07-15 半導体材料の処理槽

Country Status (3)

Country Link
JP (1) JPH0642333Y2 (mo)
KR (2) KR870001648A (mo)
DE (1) DE3623233A1 (mo)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050196519A1 (en) * 2004-03-08 2005-09-08 Depuy Products, Inc. Apparatus for producing a biomimetic coating on a medical implant

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5452985A (en) * 1977-10-04 1979-04-25 Kyushu Nippon Electric Etching device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1067657B (de) * 1955-08-03 1959-10-22 Schilde Maschb Ag Tauchbehaelter fuer Oberflaechenbehandlung
DE1577685B2 (de) * 1965-08-13 1974-07-04 Duerr, Otto, 7000 Stuttgart Tauchbecken zur Oberflächenbehandlung von Werkstücken, insbesondere zum Lackieren

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5452985A (en) * 1977-10-04 1979-04-25 Kyushu Nippon Electric Etching device

Also Published As

Publication number Publication date
KR870001648A (ko) 1987-03-17
JPH0642333Y2 (ja) 1994-11-02
KR910001932Y1 (ko) 1991-03-30
DE3623233A1 (de) 1987-01-15

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