JPS6218042Y2 - - Google Patents

Description

[Detailed Description of the Invention] This invention relates to a sleeve for circuit isolation used when diagnosing failures in integrated circuits, etc.

Generally, in order to mount a dual-in-line integrated circuit on a printed circuit board, played through holes (hereinafter referred to as through holes) are created on the printed circuit board to match the arrangement of the leads of the integrated circuit.
The leads of the integrated circuit are inserted into the holes, and the leads are soldered to the through holes to establish electrical continuity between the two. When diagnosing a fault in an integrated circuit mounted on a printed circuit board in this way, the signal system of the integrated circuit to be diagnosed must be electrically independent from the printed circuit board. A tool was used to cut the leads of an integrated circuit. Therefore, even if there is no abnormality in the integrated circuit as a result of diagnosis, the integrated circuit cannot be used again, which is uneconomical.

The present invention was developed in view of the above-mentioned drawbacks, and is a sleeve for fault diagnosis of integrated circuits that can be used to diagnose the faults of dual in-line integrated circuits mounted on printed circuit boards without damaging the integrated circuits. This is what we are trying to provide.

The sleeve for fault diagnosis of an integrated circuit according to the present invention is characterized in that the inner peripheral surface of a cylindrical ceramic sleeve is coated with a conductive metal.

The present invention will be explained below with reference to the drawings. The figure is a sectional view showing an embodiment of the structure and usage of the sleeve for fault diagnosis of integrated circuits according to the present invention. In the figure, reference numeral 1 denotes a dual in-line integrated circuit, and leads 3 protruding from the side wall of the main body 2 are bent 90 degrees midway and arranged parallel to the side wall of the main body 2. This integrated circuit 1 is used by inserting the leads 3 of the integrated circuit 1 into through holes 5 provided in a printed circuit board 4 in accordance with the arrangement of the leads 3 and soldering them. In this way, when diagnosing the operating state of the integrated circuit 1 mounted on the printed circuit board 1 for a specific lead 3 for some reason,
First, the solder in the through hole 5 is melted and the solder is sucked off using a solder sucker or the like (not shown), and then the sleeve 6 for fault diagnosis according to the present invention is inserted into the through hole 5. The failure diagnosis sleeve 6 is a sleeve 7 made of a hard insulating material made of ceramic or the like and formed into a cylindrical shape, and the inner circumferential surface 8 of the sleeve 7 is coated with a conductive metal 9 such as solder. Although gold, silver, or the like may be used as the conductive metal 9, solder is the softest and most suitable for the purpose of the present invention. That is, the failure diagnosis sleeve 6 inserted into the through hole 5 isolates the lead 3 from the through hole 5 by the sleeve 7 made of ceramic or the like, and the conductive metal 9 on the inner peripheral surface 8 contacts the lead 3. . Therefore, in order to ensure that the leads 3 are not damaged and come into contact with the conductive metal 9 when the fault diagnosis sleeve 6 is inserted, a soft conductive metal such as solder is optimal. When diagnosing the signal system of the lead 3 isolated from the printed circuit board 4 in this way, the test probe 10 connected to a tester (not shown) can be brought into contact with the conductive metal 9 in the fault diagnosis sleeve 6. good.

As is clear from the above description, the integrated circuit failure diagnosis sleeve according to the present invention is capable of diagnosing the integrated circuit to be diagnosed while it is mounted on a printed circuit board and without damaging the integrated circuit. The economic impact is significant.

[Brief explanation of the drawing]

The figure is a sectional view showing an embodiment of the structure and usage of the sleeve for fault diagnosis of integrated circuits according to the present invention. 1 in the figure...Dual in-line integrated circuit,
3...Lead, 4...Printed circuit board, 5...Through hole, 6...Sleeve for fault diagnosis, 7...
Ceramic sleeve, 8...inner peripheral surface, 9...conductive metal.

Claims (1)

[Scope of utility model registration request] A sleeve for fault diagnosis of integrated circuits, characterized in that the inner peripheral surface of a cylindrical ceramic sleeve is coated with a conductive metal.