JPS6218063Y2 - - Google Patents
Info
- Publication number
- JPS6218063Y2 JPS6218063Y2 JP1981091026U JP9102681U JPS6218063Y2 JP S6218063 Y2 JPS6218063 Y2 JP S6218063Y2 JP 1981091026 U JP1981091026 U JP 1981091026U JP 9102681 U JP9102681 U JP 9102681U JP S6218063 Y2 JPS6218063 Y2 JP S6218063Y2
- Authority
- JP
- Japan
- Prior art keywords
- small
- circuit board
- printed circuit
- light emitting
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
【考案の詳細な説明】
本考案は部品取付装置に関するもので、特に発
光体の取付装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a component mounting device, and particularly to a light emitting body mounting device.
従来、発光ダイオード等の発光体のキヤビネツ
トやシヤーシへの取付けは第１図に示す如く行な
われるものが一般的であつた。即ち、第１図にお
いては、発光ダイオード１が接着等の方法により
取付けられた小基板２をキヤビネツト３に形成さ
れた嵌合部３ａ，３a′にて固定し、然る後リード
線４，４′にて小基板２とプリント基板５に印刷
された銅箔パターン５ａ，５a′とを電気的に接続
する方法が示されている。然し乍ら、斯様な方法
においては取付強度や作業性の点で問題を有して
いた。 Conventionally, a light emitter such as a light emitting diode has generally been attached to a cabinet or chassis as shown in FIG. That is, in FIG. 1, a small substrate 2 on which a light emitting diode 1 is attached by a method such as adhesive is fixed by fitting parts 3a and 3a' formed in a cabinet 3, and then lead wires 4 and 4 are fixed. A method for electrically connecting the small substrate 2 and copper foil patterns 5a, 5a' printed on the printed circuit board 5 is shown in . However, such a method has problems in terms of mounting strength and workability.
そこで、本考案の目的は、上記した欠点を解決
することができる部品取付装置を提供するもので
ある。 SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a component mounting device that can solve the above-mentioned drawbacks.
以下、図面を参照して本考案の一実施例につい
て説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第２図は本考案の部分分解斜視図で、１ａは発
光ダイオード１の足、６は支持部材で、ガイド溝
６ａ及び係合部６ｂ，６b′を有している。７は小
基板で、支持部材６の係合部６ｂ，６b′が嵌入さ
れる透孔７ａが穿設されている。斯様な構造の発
光ダイオード１、支持部材６及び小基板７の組立
は、先ず発光ダイオード１の足１ａを支持部材６
のガイド溝６ａに沿つて折曲した後接着等により
発光ダイオード１と支持部材６の取付けを行う。
然る後、小基板７に穿設された透孔７ａに支持部
材６の係合部６ｂ，６b′を第２図の矢印方向より
嵌入する。その時、ガイド溝６ａに沿つて折曲さ
れた発光ダイオード１の足１ａの先端を各々小基
板７に穿設された透孔及び切欠７ｂ，７b′に挿入
して小基板７の裏面に形成された銅箔パターン７
ｄ，７d′と半田付けすると発光ダイオード１、支
持部材６及び小基板７の組立が完了する。次に、
プリント基板５に形成された取付部５ｂを小基板
７に穿設された透孔７ｃに挿入した後、小基板７
の銅箔パターン７ｄ，７d′とプリント基板５の銅
箔パターン５ａを半田付けし、小基板７とプリン
ト基板５の固定を確実にすると共に両基板５，７
間の電気的接続を確実に行うことが出来る。 FIG. 2 is a partially exploded perspective view of the present invention, where 1a is a leg of the light emitting diode 1, 6 is a support member, and has a guide groove 6a and engaging parts 6b and 6b'. Reference numeral 7 denotes a small board, which has a through hole 7a into which the engaging portions 6b, 6b' of the support member 6 are inserted. To assemble the light emitting diode 1 having such a structure, the support member 6 and the small substrate 7, first attach the legs 1a of the light emitting diode 1 to the support member 6.
After bending along the guide groove 6a, the light emitting diode 1 and the support member 6 are attached by gluing or the like.
Thereafter, the engaging portions 6b, 6b' of the support member 6 are inserted into the through hole 7a formed in the small substrate 7 in the direction of the arrow in FIG. At this time, the tips of the legs 1a of the light emitting diode 1 bent along the guide groove 6a are inserted into the through holes and notches 7b and 7b' formed in the small substrate 7, respectively, and formed on the back surface of the small substrate 7. Copper foil pattern 7
By soldering d and 7d', the assembly of the light emitting diode 1, the support member 6 and the small board 7 is completed. next,
After inserting the mounting portion 5b formed on the printed circuit board 5 into the through hole 7c formed in the small board 7,
The copper foil patterns 7d, 7d' of the printed circuit board 5 are soldered to the copper foil pattern 5a of the printed circuit board 5 to ensure the fixation of the small circuit board 7 and the printed circuit board 5, and also to securely fix both the circuit boards 5, 7.
Electrical connection between the two can be reliably established.
以上、詳述した通り本考案に依れば、小基板及
びプリント基板を直接半田付けするようにしたの
で、両基板間の取付けを確実にすると共に電気的
接続もリード線等の新たな部品を必要とせず、容
易且つ確実に行うことが出来る。 As detailed above, according to the present invention, the small board and the printed circuit board are directly soldered, which not only ensures secure attachment between both boards, but also requires new parts such as lead wires for electrical connection. It is not necessary and can be done easily and reliably.
第１図は従来例を示す図、第２図は本考案の部
分分解斜視図、第３図及び第４図は小基板とプリ
ント基板の取付過程を示す図で、第３図は取付
前、第４図は取付後の状態を示している。
１……発光ダイオード、５……プリント基板、
６……支持部材、７……小基板。
FIG. 1 is a diagram showing a conventional example, FIG. 2 is a partially exploded perspective view of the present invention, FIGS. 3 and 4 are diagrams showing the process of attaching a small board and a printed circuit board, and FIG. FIG. 4 shows the state after installation. 1...Light emitting diode, 5...Printed circuit board,
6...Supporting member, 7...Small board.
Claims (1)
持する為の支持部材と、第１・第２透孔を有し、
前記支持部材が取付けられる際に前記支持部材が
前記第１透孔に嵌合されると共に前記支持部材に
支持された前記電気部品と電気的に接続される小
基板と、該小基板が取付けられる際に前記第２透
孔と対向する位置に小基板取付部が形成されたプ
リント基板とを備え、該プリント基板の取付部と
前記小基板の第２透孔を嵌合させて前記両基板の
銅箔パターンを半田付けすることにより前記両基
板を固定すると共に電気的接続を行うようにした
ことを特徴とする部品取付装置。 It has an electrical component having a lead wire, a support member for supporting the electrical component, and first and second through holes,
When the supporting member is attached, the supporting member is fitted into the first through hole and a small board is electrically connected to the electrical component supported by the supporting member, and the small board is attached. a printed circuit board having a small board mounting portion formed at a position facing the second through hole; A component mounting device characterized in that both the substrates are fixed and electrically connected by soldering a copper foil pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981091026U JPS6218063Y2 (en) | 1981-06-19 | 1981-06-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981091026U JPS6218063Y2 (en) | 1981-06-19 | 1981-06-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57203570U JPS57203570U (en) | 1982-12-24 |
| JPS6218063Y2 true JPS6218063Y2 (en) | 1987-05-09 |
Family
ID=29886121
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981091026U Expired JPS6218063Y2 (en) | 1981-06-19 | 1981-06-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6218063Y2 (en) |
-
1981
- 1981-06-19 JP JP1981091026U patent/JPS6218063Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57203570U (en) | 1982-12-24 |
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