JPS62183106A - Composite laminated ceramic parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a composite component, and more particularly to a capacitor-embedded composite laminated ceramic component in which a large-capacity capacitor is built into a substrate.

(Prior Art) Conventionally, chip-type capacitors have been mounted on substrates such as alumina to achieve high integration in electronic circuits that utilize large-capacity capacitors. In other words, hybrid E-C is achieved by forming a wiring pattern using resistors, electrodes, and conductors on an insulating substrate such as ceramic using a printing method, and then mounting chip capacitors, semiconductor ICs, etc. on the same surface. It had been made. Furthermore, in recent years, the development of composite ceramic parts in which a dielectric material is sandwiched between insulators has progressed, and applications are being made to hybrid ICs and the like.

(Problems to be solved by the invention) In recent years, with the rapid technological advancement of electronics,
Various electronic parts are becoming smaller,
From the point of view of cost reduction, making parts lighter, thinner, and shorter has become an essential condition.

However, in conventional composite parts such as hybrid ICs, it is necessary to print resistors, electrodes, and wiring patterns at a higher density on a limited ceramic substrate, and to print chip capacitors, semiconductor ICs, etc. at a higher density. To post,
There are certain limits.

For example, if a high-density pattern is formed, quality may deteriorate or costs may rise, and in highly integrated designs, mounting space issues and shape constraints arise especially as the number of mounted components increases. etc. became a problem.

Therefore, in order to achieve higher density and higher integration, new composite ceramic components with a structure in which resistors and capacitors are housed in a substrate are being developed. However, in a composite ceramic component having a structure in which a dielectric 11 is sandwiched between insulators 12 and 13 to form a conductor 9 as shown in Fig. 2, the insulator material and the dielectric material are made of materials with completely different properties. Because it is a composite material, there are problems with stable quality and reliability, such as peeling and cracking at the interface between the insulator and dielectric due to subtle differences in shrinkage rates of each material and mutual diffusion between different materials. It was not possible to obtain high composite parts.

(Means for Solving the Problem) The present invention provides a composite laminated ceramic component having a structure in which a dielectric is sandwiched between insulators, and a metal layer to which a dielectric material is added at the interface between the dielectric layer and the insulator layer. , two different types of metal layers were formed, including a metal layer to which an insulating material was added.

(Function) The material forming the metal layer to which dielectric material is added and the metal layer to which insulator material is added undergo sintering at a relatively low temperature. These interfaces are completely separated when the sintering reaction occurs,
It prevents mutual diffusion between different materials and completely prevents reactions between ceramics. This has the effect of preventing microcracks, interfacial peeling, etc. that conventionally occur. In addition, in order to bond with each ceramic (dielectric, insulator), a metal layer made of a metal material added with a dielectric material was provided at the interface on the dielectric side, while an insulator material was added to the wire edge side. By providing a metal layer made of a metal body material, we have achieved a composite laminated ceramic component with high bonding properties and no peeling.

(Example) Hereinafter, the present invention will be explained in detail with reference to Examples.

Generally, to obtain ceramic green sheets, oxidized powder raw materials are weighed and mixed or pulverized using a ball mill or the like. Next, the mixed powder raw material is calcined using an electric furnace or the like to produce a prefired powder material. The precalcined powder material obtained by calcining is mixed with an organic solvent and an organic binder to obtain a slurry. The slurry is formed into a green sheet on a polyethylene film using a casting device such as a Dr. Plaid method to obtain a ceramic green sheet.

Ceramic green sheet of insulator using the above method,
A dielectric ceramic green sheet, a metal green sheet added with an insulating material, and a metal green sheet added with a dielectric material were each prepared and cut into appropriate shapes. A metal green sheet piece was produced.

Next, an electrode pattern is printed on the dielectric sheet pieces using Ag/Pd internal electrode paste, and for each ceramic green sheet piece that requires snowholes, through holes are opened and then electrode paste is filled in the through holes to form via conductor parts. form. Further, necessary through holes are formed in the metal sheet pieces, and then they are laminated so as to have the structure shown in FIG. 1, and after being put into a press mold, a thermocompression press is performed. After cutting the press-pressed raw composite laminated ceramic body into a predetermined shape with a knife blade or the like, the binder is removed at around 500'C, and the composite laminated body after the binder is removed is heated at 850°C using an electric furnace. By sintering at a temperature of about 950'C, a composite multilayer ceramic part with a built-in capacitor can be obtained.

The insulators used here include lead silicate-based composite materials such as alumina oxide, cordierite ceramics, mullite ceramics, anorthite ceramics, calcilite ceramics, 7-orsterite ceramics, spodumene, and euthane. Materials such as cryptite can be used. The dielectric constant of these insulators is 5~
It is about 10.

On the other hand, the dielectric material is a compound with a perogeskite structure containing lead, and the sintering temperature is the same as that of the insulating material. The dielectric constant of this dielectric material varies depending on the composition of the constituent elements, but is controlled within the range of about 500 to 20,000. Therefore, it is extremely advantageous for forming a large capacity capacitor.

In addition, examples of metal bodies include Au, Ag, Pd, Pt, Cu.
Each metal layer was made by adding an insulator material and a dielectric material to a metal material having a composition containing one or more of Ni, Ni, and the like.

FIG. 1 is an exploded cross-sectional view of a composite multilayer ceramic component with a built-in capacitor manufactured based on an example.

Metal layers 2 and 3 containing dielectric frits are formed on the upper and lower surfaces of a dielectric layer 1 having an internal electrode pattern that becomes a capacitor layer.

Furthermore, metal layers 4 and 5 containing insulating frits are formed on each outer surface of the metal layers 2 and 3, and furthermore, insulator layers 6 and 7 are formed on each outer surface of the metal layers 4.5. The internal electrode bar 8 formed on the dielectric layer 1 is guided to the upper surface of the insulator layer 6 by a conductor electrode 9 as a capacitor part.
It is formed as a butt electrode 10 on the top surface of the substrate.

As described above, by forming two types of metal layers at the interface between the insulator layer and the dielectric layer, a metal layer containing an insulator frit added with an insulator material and a metal layer containing a dielectric frit added with a dielectric material. We were able to provide a highly reliable, high-quality composite multilayer ceramic component with a built-in capacitor that prevents interfacial reactions between dielectrics and insulators and has good bonding properties compared to products without metal layers.

Although the metal layer was formed by a green sheet method in this example, it was confirmed that the metal layer could also be formed by a method of printing a metal paste such as a screen printing method.

(Effects of the Invention) According to the present invention, it is possible to obtain a highly reliable composite laminated ceramic component in which cracks do not occur between layers of different materials.

[Brief explanation of drawings]

FIG. 1 is a sectional view of an embodiment of a composite multilayer ceramic component with a built-in capacitor according to the present invention. Figure 2 is an exploded cross-sectional view of a conventional composite laminated ceramic component. 1... Dielectric layer 2, 3... Metal layer with dielectric frit 4.5... Metal layer with insulator frit 6,
7... Insulator layer 8... Internal pattern electrode 9...
Conductor 10... Electrode pad 11... Dielectric layer/θ

Claims (1)

[Claims] In a composite laminated ceramic component consisting of a dielectric layer, an insulator layer, and a conductor, two metal layers are formed at the interface between the dielectric layer and the insulator layer, and a dielectric material is formed on the side in contact with the dielectric layer. 1. A composite laminated ceramic component having a structure in which a metal layer added with an insulating material is formed, and a metal layer added with an insulating material is formed on a side in contact with the insulating layer.