JPS62183155A - Semiconductor integrated circuit - Google Patents

Abstract

PURPOSE:To improve the property pertaining to noise of the titled device as well as to accomplish a high density mounting by a method wherein the die pad part of a frame is composed of a plurality of metal plates having an insulating material pinched between than. CONSTITUTION:The titled device is formed in sandwich structure wherein the upper die-pad 3, on which a chip 1 is fixed through the intermediary of a conductive bonding part 2, and the lower die-pad 5 with an insulating layer 4 pinched between them. Also, the upper die-pad 3 is connected to an earthing, and the lower die-pad part 5 is connected to a power source. As a result, said pads 3 and 5, which become their electrodes respectively, are brought into the state wherein a capacitor is formed between the power source and the earthing with them.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application] The present invention relates to a semiconductor integrated circuit device, and particularly to the structure of a die pad portion for fixing a chip.

[Conventional technology]

FIG. 2 is a plan view and a sectional view showing the structure of a frame and a chip portion in a conventional semiconductor integrated circuit device.

In the figure, III is a chip (21 is the chip fi)
The adhesive part (3) used to fix the + to the frame is a die pad.

A conductive material is used for the adhesive portion (2), and the die pad (3) is grounded to ground the semiconductor integrated circuit board, which is the chip (1).

Further, when a semiconductor integrated circuit device is generally mounted, a capacitor called a bypass capacitor is often inserted between the power source of the semiconductor integrated circuit device and ground as a countermeasure against noise in the power supply system.

When using this capacitor, it is more effective to use the shortest wiring possible between the power supply and ground.

[Problem that the invention seeks to solve]

As mentioned above, while taking noise countermeasures using conventional means,
In order to mount a semiconductor integrated circuit device, a capacitor must also be mounted on the printed circuit board on which the semiconductor integrated circuit device is mounted, which increases the number of mounted elements, making high-density mounting inefficient and cost-effective. There were problems such as high prices.

The present invention was made to solve the above-mentioned problems, and an object of the present invention is to obtain a semiconductor integrated circuit device that is resistant to noise.

[Means for solving problems]

In the semiconductor integrated circuit device according to the present invention, the die pad portion of the frame is composed of a plurality of metal plates sandwiching an insulator.

[Effect]

In the semiconductor integrated circuit device of the present invention, by providing a capacitor in the die pad portion within the semiconductor integrated circuit device, the space occupied by the capacitor can be reduced, and the wiring length between the chip and the capacitor can be extremely shortened.

. [Embodiment] FIG. 1 is a plan view and a sectional view of a chip and a frame portion of a semiconductor integrated circuit device showing an embodiment of the present invention.

The same symbols as in FIG. 2 are the same.

In FIG. 1, tl+ is a chip, 121 is a chip 11
) to the frame, conductive adhesive part,
(3; is the upper die pad that fixes the chip +11, (4;
) is an insulating layer, and (6) is a lower die pad.

As can be seen from the figure, an upper die pad (31) and a lower die pad (51) similar to each other are provided, forming a sandwich structure in which the insulating layer 14+ is sandwiched between the two die pads +31 and +51.

Also, the upper die pad (3) is grounded and the lower die pad (6
) are respectively connected to the power supply.

As can be seen from the above structure, a capacitor is formed by the upper die pad (31), the insulating layer +41, and the lower die pad (6), and the die pad (3) serves as each electrode.
, (5) are connected to the ground and the power supply, respectively, so that a capacitor is formed between the power supply and the ground.

In the above embodiment, the insulating layer of the capacitor is one layer, but a multilayer capacitor having a multilayer structure may be formed.

〔Effect of the invention〕

As described above, according to the present invention, the die pad portion of the frame is composed of a plurality of metal plates sandwiching insulators, so that
This has the effect of improving the performance of the semiconductor integrated circuit device against noise and enabling high-density packaging when mounting the semiconductor integrated circuit device.

[Brief explanation of drawings]

FIG. 1 (BL is a plan view and a sectional view of a chip frame portion of a semiconductor integrated circuit device according to an embodiment of the present invention, and FIG. 2 +ILI (t)I is a chip frame portion of a conventional semiconductor integrated circuit device. They are a plan view and a cross-sectional view of the frame part. +11 is a chip, (21 is an adhesive part, (31 is an upper die pad, (41 is an insulating layer, and (6) is a lower die pad. In addition, the same reference numerals are used in the figure. indicate the same or equivalent part.

Claims (1)

[Claims] A semiconductor integrated circuit device characterized in that a die pad portion of a frame to which a semiconductor integrated circuit chip is die-bonded is composed of a plurality of metal plates sandwiching an insulating material.