JPS621875A - Electroless-plated complex compound and its production - Google Patents
Electroless-plated complex compound and its productionInfo
- Publication number
- JPS621875A JPS621875A JP14191385A JP14191385A JPS621875A JP S621875 A JPS621875 A JP S621875A JP 14191385 A JP14191385 A JP 14191385A JP 14191385 A JP14191385 A JP 14191385A JP S621875 A JPS621875 A JP S621875A
- Authority
- JP
- Japan
- Prior art keywords
- electroless
- plated
- film
- resin composition
- electroless plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 150000001875 compounds Chemical class 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 claims abstract description 28
- 239000004840 adhesive resin Substances 0.000 claims abstract description 27
- 229920006223 adhesive resin Polymers 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 238000007772 electroless plating Methods 0.000 claims abstract description 19
- 238000001035 drying Methods 0.000 claims abstract description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 6
- 229910000808 amorphous metal alloy Inorganic materials 0.000 claims abstract 2
- 239000002131 composite material Substances 0.000 claims description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 229910052698 phosphorus Inorganic materials 0.000 claims description 5
- 239000011574 phosphorus Substances 0.000 claims description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 2
- 229910052796 boron Inorganic materials 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 239000011651 chromium Substances 0.000 claims 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 1
- 229910052721 tungsten Inorganic materials 0.000 claims 1
- 239000010937 tungsten Substances 0.000 claims 1
- 239000012212 insulator Substances 0.000 abstract description 10
- 238000011282 treatment Methods 0.000 abstract description 8
- 239000000463 material Substances 0.000 abstract description 7
- 229910001096 P alloy Inorganic materials 0.000 abstract 3
- 229910000521 B alloy Inorganic materials 0.000 abstract 1
- 229910018104 Ni-P Inorganic materials 0.000 abstract 1
- 229910018536 Ni—P Inorganic materials 0.000 abstract 1
- 230000003213 activating effect Effects 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 47
- 238000007747 plating Methods 0.000 description 25
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229920006267 polyester film Polymers 0.000 description 5
- 239000011342 resin composition Substances 0.000 description 5
- 239000004677 Nylon Substances 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 229920001778 nylon Polymers 0.000 description 4
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000003273 ketjen black Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 2
- UKBBLYOZLMOPNK-UHFFFAOYSA-N [P].[Cr].[Ni] Chemical compound [P].[Cr].[Ni] UKBBLYOZLMOPNK-UHFFFAOYSA-N 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- -1 fuse characteristics Substances 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000008313 sensitization Effects 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910021555 Chromium Chloride Inorganic materials 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004727 Noryl Substances 0.000 description 1
- 229920001207 Noryl Polymers 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- VFYPSWGDJSPEQI-UHFFFAOYSA-N [B].[P].[Ni] Chemical compound [B].[P].[Ni] VFYPSWGDJSPEQI-UHFFFAOYSA-N 0.000 description 1
- ACVSDIKGGNSZDR-UHFFFAOYSA-N [P].[W].[Ni] Chemical compound [P].[W].[Ni] ACVSDIKGGNSZDR-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- QSWDMMVNRMROPK-UHFFFAOYSA-K chromium(3+) trichloride Chemical compound [Cl-].[Cl-].[Cl-].[Cr+3] QSWDMMVNRMROPK-UHFFFAOYSA-K 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- XMVONEAAOPAGAO-UHFFFAOYSA-N sodium tungstate Chemical compound [Na+].[Na+].[O-][W]([O-])(=O)=O XMVONEAAOPAGAO-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
狐友直Δ机且立」
本発明は、板、フィルム、複合板その他複雑な形状のほ
とんどの絶縁体に、発熱体・低抗体・導電体・ヒユーズ
特性または磁性体の特性などを持つ無電解めっき膜を形
成してなる無電解めっき複合体及びその製造方法に関す
る。[Detailed Description of the Invention] The present invention applies to most insulators of complicated shapes, such as plates, films, composite plates, etc., by adding heating elements, low antibodies, conductors, fuse characteristics, or magnetic materials. The present invention relates to an electroless plated composite formed by forming an electroless plated film having characteristics, etc., and a method for manufacturing the same.
良米遺古
無電解めっき膜は、耐食耐摩耗性膜、電磁シールド膜、
抵抗膜発熱体膜などとして用いることができる機能を有
している。ところで、これらの機能を持ち合わせた製品
を製造するためには、ポリエステル等の耐熱機能フィル
ムなどあらゆる絶縁体に、無電解めっき膜が、低コスト
でかつ容易に形成されなければならない。Ryomai Iko electroless plating film is a corrosion-resistant and wear-resistant film, an electromagnetic shielding film,
It has a function that can be used as a resistive film heating element film, etc. By the way, in order to manufacture products with these functions, an electroless plating film must be easily formed at low cost on any insulator such as a heat-resistant functional film such as polyester.
発明が解決しようとする問題点
しかし、従来、上記各種の機能を持つフレキシブルプリ
ント板、プリント配線板等の絶縁物に無電解めっきを行
なう場合には、耐熱性の低いＡＢＳ樹脂、ノリルなどに
化学腐食処理、還元剤を入れてすず系の金属を付着させ
てパラジウムを付着させやすくする感受性化処理、活性
化処理などの前処理を行なったのち、めっきを行わなけ
ればならないので、これらの前処理が非常に煩雑であり
上記絶縁物にめっきを行なうことは困難であった。Problems to be Solved by the Invention However, conventionally, when performing electroless plating on insulators such as flexible printed boards and printed wiring boards that have the various functions mentioned above, chemical plating has been applied to ABS resin, Noryl, etc., which have low heat resistance. Plating must be performed after pre-treatments such as corrosion treatment, sensitization treatment to make it easier for palladium to adhere by adding a reducing agent to make tin-based metals adhere, and activation treatment. However, it was very complicated and difficult to plate the above-mentioned insulator.
さらに、ナイロンなどでは前もって専用のエツチング処
理液で前処理を要する一方、その他の樹脂では前処理前
にアニーリングや機械的粗面化処理、脱脂処理を要する
が、めっきの付着性は悪いといった問題もあった。また
、セラミック等への無電解めっきは、活性ペーストを高
温（３００〜 ５００℃）で乾燥させる必要があるので
、例えば有機物とガラスの複合体への無電解めっきは容
易ではなかった。Furthermore, while nylon and other materials require pretreatment with a special etching solution, other resins require annealing, mechanical roughening, and degreasing before pretreatment, but they also have the problem of poor plating adhesion. there were. Furthermore, since electroless plating on ceramics and the like requires drying the active paste at high temperatures (300 to 500°C), electroless plating on composites of organic matter and glass, for example, has not been easy.
従って、本発明の目的は、上記問題点を解決することに
あって、前処理を簡単に行なうことができかつ強固に絶
縁体にめっきを付着させることができる無電解めっき複
合体及びその製造方法を提供することにある。Therefore, an object of the present invention is to solve the above-mentioned problems, and to provide an electroless plating composite which can be easily pretreated and which can firmly adhere plating to an insulator, and a method for manufacturing the same. Our goal is to provide the following.
問題点を解決するための手段
上記目的を達成するために、第１の発明は、プラスチッ
クの中で最もめっきしやすいといわれているＡＢＳ樹脂
を化学腐食した状態（前処理した状態）と同じような物
性を有し、かつセラミック、金属及びプラスチックのい
ずれにも良好に接着することのできる物質を見い出し、
この見い出した物質をめっきパターンを形成する中間物
として活用して、希望する絶縁体に希望するめっき膜を
形成させて、前処理を簡略化できるように構成した。Means for Solving the Problems In order to achieve the above-mentioned object, the first invention is based on a chemically corroded state (pretreated state) of ABS resin, which is said to be the easiest to plate among plastics. We discovered a substance that has excellent physical properties and can adhere well to ceramics, metals, and plastics.
By using this discovered substance as an intermediate for forming a plating pattern, a desired plating film can be formed on a desired insulator, and the pretreatment can be simplified.
すなわち、被めっき体（例えば、ポリエステルフィルム
、ポリイミドフィルム、セラミック板、ガラス板、ナイ
ロン板などの絶縁板）上に無電解めっき膜を、ポリブチ
ラール樹脂を共重合させた接着性樹脂組成物の硬化被膜
を介して接着してなるように構成した。上記物性を有す
る接着性樹脂組成物としては、ケイ酸層の酸素や他の樹
脂の官能基と水素結合しやすい活性ＯＨ基及びカルボキ
シル基を有し、かつ帯電粒子を吸着しやすいとともに金
属イオン錯体を形成しやすいポリブチラール樹脂が好ま
しい。ただし、この樹脂単独では、加熱変形温度が低く
、９０°Ｃ前後のめっき浴や発熱体の下地物質としては
不適当なので、熱硬化性の樹脂と共重合させて約１５０
℃以上の耐熱性を持たせるのが好ましい。That is, an electroless plating film is applied to an object to be plated (for example, an insulating board such as a polyester film, a polyimide film, a ceramic board, a glass board, a nylon board, etc.), and an adhesive resin composition in which polybutyral resin is copolymerized is cured. It was constructed so that it was bonded through a film. The adhesive resin composition having the above-mentioned physical properties has active OH groups and carboxyl groups that easily form hydrogen bonds with oxygen in the silicic acid layer and functional groups of other resins, easily adsorbs charged particles, and has metal ion complexes. A polybutyral resin that easily forms is preferred. However, this resin alone has a low heating deformation temperature and is unsuitable for plating baths at around 90°C or as a base material for heating elements, so it is copolymerized with a thermosetting resin to
It is preferable to have heat resistance of ℃ or higher.
また、第２の発明は、上記前処理した状態と同様な構造
を有する樹脂を、簡単にかつ確実に上記波めっき体上に
付着させることができるように構成した。すなわち、ポ
リブチラール樹脂を共重合させた接着性樹脂組成物を披
めっき体に印刷または塗布などの方法で接着させ、該組
成物を、例えば、１００〜２００°Ｃの間でかつ３０分
以上で、乾燥硬化させ、硬化した接着性樹脂組成物の被
膜上に無電解めっき膜を形成するように構成した。Moreover, the second invention is configured such that the resin having the same structure as the pretreated state can be easily and reliably attached onto the wave-plated body. That is, an adhesive resin composition copolymerized with a polybutyral resin is adhered to a plated body by a method such as printing or coating, and the composition is heated, for example, at 100 to 200°C for 30 minutes or more. The adhesive resin composition was dried and cured, and an electroless plated film was formed on the cured adhesive resin composition film.
上記接着性樹脂組成物の一例としてのポリブチラール系
ペーストは、ポリブチラール樹脂と熱硬化性樹脂を各々
溶剤に溶かして混合し、乾燥して共重合させたものであ
る。この共重合の配合比は、ｌ：３〜３：１の範囲が好
ましい。上記ポリブチラール樹脂は、１００％ポリブチ
ラールではなく、ポリビニルアルコール、酢酸ビニルア
セテートを含有したものが好ましい。また、上記ポリブ
チラール系ペーストにブチルカルピトールに溶解したケ
ッチェンブラックなどのカーボンブラックを配合すれば
、接着性めっきの密着性が向上する。上記熱硬化性樹脂
としては、接着用フェノール樹脂、メラミン樹脂、イソ
ノアネート、エポキシ樹脂、グリオキザール樹脂などを
用いるのが好ましい。The polybutyral paste as an example of the adhesive resin composition is prepared by dissolving a polybutyral resin and a thermosetting resin in a solvent, mixing them, drying them, and copolymerizing them. The blending ratio of this copolymerization is preferably in the range of 1:3 to 3:1. The polybutyral resin described above is preferably one containing polyvinyl alcohol and vinyl acetate rather than 100% polybutyral. Furthermore, if carbon black such as Ketjen black dissolved in butyl calpitol is added to the polybutyral paste, the adhesion of the adhesive plating will be improved. As the thermosetting resin, it is preferable to use adhesive phenol resin, melamine resin, isonoanate, epoxy resin, glyoxal resin, etc.
また、接着性樹脂組成物としては、ペースト状のもの以
外には、ホットメルトタイプのフィルムら使用すること
ができる。このフィルムを使用するときには、熱圧着で
接着する。該フィルムは、平板に使用するのが好ましい
。従って、凹凸のあるものではペースト状のものが好ま
しい。Further, as the adhesive resin composition, in addition to a paste-like one, a hot-melt type film can be used. When using this film, it is adhered by thermocompression bonding. The film is preferably used for flat plates. Therefore, if the material has irregularities, it is preferable to use a paste-like material.
上記めっき膜としては、要求する特性によって種々のも
のを選ぶことができる。例えば、薄膜状抵抗体乃至数百
度までの発熱体としては、抵抗温度係数（ＴＣＲ）が３
０ ｐｐｍ／ ’Ｃ以下と少ないニッケルークロム−リ
ンめっき膜、３００度までの加熱で抵抗値がほとんど変
化しないものとしてはニッケルークンゲステン−リン非
晶質めっき膜、２００℃での高温耐久性の優れたものと
してはニッケルーリン非晶質膜、高温で速断ヒユーズの
働きを持つものとしてはニッケルーホウ素−リンめっき
膜、がそれぞれ用途により選択できる。電磁シールドに
は、接着性樹脂組成物としてのペーストにカーボンを配
合した上にニッケル系無電解めっき膜を付着させたもの
が好ましい。コネクタ接点としても、カーボン入り接着
性樹脂組成物としてのペースト上にニッケルータングス
テン−リン非晶質めっき膜またはニッケルーホウ素非晶
質めっき膜を付着させたものが好ましい。As the above-mentioned plating film, various ones can be selected depending on the required characteristics. For example, as a thin film resistor or a heating element up to several hundred degrees, the temperature coefficient of resistance (TCR) is 3.
A nickel-chromium-phosphorus plating film with a low value of 0 ppm/'C or less, a nickel-kungsten-phosphorus amorphous plating film with almost no change in resistance when heated up to 300 degrees, and high-temperature durability at 200 degrees Celsius. A nickel-phosphorus amorphous film can be selected as an excellent film, and a nickel-boron-phosphorus plating film can be selected as a film that functions as a fast-acting fuse at high temperatures. For the electromagnetic shield, it is preferable to use a nickel-based electroless plating film on which carbon is blended into a paste as an adhesive resin composition. Also as a connector contact, it is preferable to use a nickel-tungsten-phosphorus amorphous plating film or a nickel-boron amorphous plating film adhered to a paste as a carbon-containing adhesive resin composition.
フレキシブルプリント配線板には、ポリエステルやポリ
イミドフィルムの上に絶縁接着性樹脂組成物としてのペ
ーストを配し、かつその上にニッケルーリンやニッケル
ーホウ素めっきをしたものが好ましい。The flexible printed wiring board is preferably one in which a paste as an insulating adhesive resin composition is placed on a polyester or polyimide film, and nickel-phosphorus or nickel-boron plating is applied thereon.
上記のニッケルーリン膜、ニッケルーホウ素膜のめっき
浴液については、既に、日本カニゼン、奥野工業などよ
り市販されている多くの商品があり、還元剤としは次亜
リン酸塩を用いたものを用いる。ニッケルータングステ
ン−リン浴液については、次亜リン酸浴にタングステン
酸ソーダを配合したものを用いる一方、ニッケルークロ
ム−リン浴液については、次亜リン酸入りの浴液に塩化
クロムを配合した浴液を用いることによってめっき膜を
形成できる。これらの浴液の組成については、多くのも
のが公表されている。Regarding the plating bath solutions for the above-mentioned nickel-phosphorous films and nickel-boron films, there are already many commercially available products from Nippon Kanigen, Okuno Kogyo, etc., and those that use hypophosphite as the reducing agent. use For the nickel-tungsten-phosphorous bath solution, a hypophosphorous acid bath mixed with sodium tungstate is used, while for the nickel-chromium-phosphorus bath solution, a bath solution containing hypophosphorous acid is mixed with chromium chloride. A plating film can be formed by using the bath solution. Many compositions of these bath liquids have been published.
また、被めっき体である絶縁体は、上記のポリブチラー
ル系接着性樹脂組成物が接着できるものに限定されるが
、ポリエステルフィルム、ポリイミドフィルム、セラミ
ック板、ガラス板、ナイロン板、フェノール樹脂板など
＋００°Ｃ以上の耐熱を有する絶縁体のほとんどのもの
を選ぶことができる。Insulators to be plated are limited to those to which the above-mentioned polybutyral adhesive resin composition can adhere, such as polyester films, polyimide films, ceramic plates, glass plates, nylon plates, phenolic resin plates, etc. Most insulators with heat resistance of +00°C or higher can be selected.
上記製造方法により製造された無電解めっき複合体とし
ては、例えば、フレキシブルフィルム、ミラー又はＨＩ
Ｃ配線板上に形成したフレキシブルのアディテブプリ
ント板、めっき模ヒーター付きミラー、めっき膜配線導
体、めっき膜抵抗体、ヒユーズ・磁性体付ＨＩ Ｃ配線
板などがある。Examples of electroless plated composites produced by the above production method include flexible films, mirrors, and HI
These include flexible additive printed boards formed on C wiring boards, mirrors with plated imitation heaters, plated film wiring conductors, plated film resistors, and HIC wiring boards with fuses and magnetic materials.
発明の効果
第１の発明によれば、被めっき体に、接着剤としての接
着性樹脂組成物を介して無電解めっき膜を接着するので
、フレキシブルプリント板、ミラー用プリント配線板等
のどのような絶縁物にも所望の無電解めっき膜を上記接
着性樹脂組成物の接着力により強固にかつ確実に付着さ
せることができる。すなわち、上記接着性樹脂組成物は
、ポリブチラール樹脂を含むので、このポリブチラール
樹脂自体が水素結合性コンプレックスの一種であり、金
属やイオンと結合しやすくめつきしやすいので、無電解
めっき膜を確実に被めっき体に付着させることができる
。また、無電解めっきによりめっき膜を形成するので、
めっき膜の厚みが一定となるとともに、任意のパターン
を簡単に形成することができる。Effects of the Invention According to the first invention, since the electroless plating film is adhered to the object to be plated via the adhesive resin composition as an adhesive, it can be applied to any type of material such as flexible printed boards and printed wiring boards for mirrors. A desired electroless plated film can be firmly and reliably attached to even an insulating material by the adhesive force of the adhesive resin composition. That is, since the above-mentioned adhesive resin composition contains polybutyral resin, this polybutyral resin itself is a type of hydrogen-bonding complex, and easily bonds with metals and ions and is easily attached to metals and ions. It can be reliably attached to the object to be plated. In addition, since the plating film is formed by electroless plating,
The thickness of the plating film becomes constant, and any pattern can be easily formed.
第２の発明によれば、ポリブチラール樹脂を共重合させ
た接着性樹脂ペーストを被めっき体に接着し、１００〜
１６０℃で３０分以上で乾燥硬化させて樹脂組成物を被
めっき体に付着させるので、該樹脂組成物が被めっき体
に簡単にかつ確実に形成することができる。また、この
樹脂組成物を被めっき体に形成させると、彼めっき体の
表面が化学腐食処理、感受性化処理、などの前処理を行
った状態と同じ状態となるので、フレキシブルプリント
板、ミラー用プリント配線板等、所望の絶縁物に所望の
めっき膜を付着させるときに、煩雑な前処理をほとんど
行う必要がなく、必要に応じてわずかに活性化処理を行
うだけでよく、前処理作業が大幅に簡略化できる。また
、上記樹脂組成物が接着剤として機能することにより、
無電解めっき膜をこれらの絶縁物に強固にかつ確実に接
着させることができる。また、無電解めっきによりめっ
き膜を形成するので、従来行なわれていたスパッタ法な
どよりも安価に所望のめっき膜を被めっき膜に付着させ
ることができるとともに、任意のパターンを形成するこ
とができる。According to the second invention, an adhesive resin paste made by copolymerizing polybutyral resin is adhered to the object to be plated, and
Since the resin composition is adhered to the object to be plated by drying and curing at 160° C. for 30 minutes or more, the resin composition can be easily and reliably formed on the object to be plated. In addition, when this resin composition is applied to an object to be plated, the surface of the plated object becomes the same as the state after pretreatment such as chemical corrosion treatment or sensitization treatment. When attaching a desired plating film to a desired insulating material such as a printed wiring board, there is almost no need to perform complicated pretreatment, and only a slight activation treatment is required if necessary. It can be greatly simplified. In addition, since the resin composition functions as an adhesive,
The electroless plated film can be firmly and reliably adhered to these insulators. In addition, since the plated film is formed by electroless plating, it is possible to attach the desired plated film to the plated film at a lower cost than the conventional sputtering method, and it is also possible to form any pattern. .
叉巖皿 以下に、本発明の詳細な説明する。fork plate The present invention will be explained in detail below.
本実施例にかかる無電解めっき複合体は、第１゜２図に
示すように、被めっき体ｌ上に接着性樹脂組成物の被膜
２を所望の形状に形成したのち、無電解めっきによりめ
っき膜３を上記被膜２に形成してなる。As shown in Fig. 1-2, the electroless plated composite according to this example is produced by forming a film 2 of an adhesive resin composition in a desired shape on an object 1 to be plated, and then plating it by electroless plating. A film 3 is formed on the coating 2.
この無電解めっき複合体は、例えば、以下のように製造
される。すなわち、ポリブチラール系接着性樹脂組成物
としては、ポリブチラール樹脂を６０重量部、メチルエ
チルケトンを１００重量部、接着用フェノール樹脂を３
０重量部、エタノールを４５重量部、ブチルカルピトー
ルを１００重量部、配合したものと、さらに、これにケ
ッチェンブラック１０重量部を配合したものとをそれぞ
れ作成した。作成した各接着性樹脂組成物を第１゜２図
に示すように、被めっき体１にそれぞれ印刷して被膜２
を形成し、１４０℃下で３０分間乾燥させた。上記被め
っき体ｌとしては、ポリエステルフィルム、アルミナセ
ラミック、セラミックタイル、ナイロン樹脂板について
試みたが、いづれも強固に被膜２を接着することができ
た。接着性樹脂組成物の被膜２を被めっき休日こ付着さ
せた後、パラジウム系の活性処理液に、数秒間、浸漬し
たのち水洗する。その後、次亜リン酸を還元剤とするニ
ッケルーリンめっき浴液に浸漬すると、数分でニッケル
ーリンのめっき膜３を上記樹脂組成物の被膜２に付着さ
せることができた。めっき性はケッチェンブラックを配
合したもののほうが良かった。これらのめっき膜３は、
テープ剥離試験、−３０℃〜＋１２０℃で熱サイクルテ
スト５回、ポリエステルフィルムの場合は折り曲げ試験
２０回のすべてで異常が見られなかった。This electroless plated composite is produced, for example, as follows. That is, the polybutyral adhesive resin composition contains 60 parts by weight of polybutyral resin, 100 parts by weight of methyl ethyl ketone, and 3 parts by weight of phenol resin for adhesive.
0 parts by weight, 45 parts by weight of ethanol, and 100 parts by weight of butylcarpitol, and another with 10 parts by weight of Ketjenblack added thereto. Each of the prepared adhesive resin compositions was printed on the object to be plated 1 to form a coating 2, as shown in Fig. 1-2.
was formed and dried at 140° C. for 30 minutes. A polyester film, an alumina ceramic, a ceramic tile, and a nylon resin plate were used as the object 1 to be plated, and the coating 2 could be firmly adhered to all of them. After the coating 2 of the adhesive resin composition is attached to the plated surface, it is immersed in a palladium-based activation treatment liquid for several seconds and then washed with water. Thereafter, when it was immersed in a nickel-phosphorus plating bath solution using hypophosphorous acid as a reducing agent, a nickel-phosphorus plating film 3 could be attached to the coating 2 of the resin composition in a few minutes. The plating performance was better with the one containing Ketjen black. These plating films 3 are
No abnormality was observed in all of the tape peeling test, 5 thermal cycle tests at -30°C to +120°C, and 20 bending tests in the case of polyester film.
第［図は本発明の一実施例にかかる無電解めっき複合体
の断面側面図、第２図は無電解めっき複合体の平面図で
ある。
■・・被めっき体、２・・・接着性樹脂組成物、３・・
・無電解めっき膜。
特許出願人 株式会社東海理化電機製作所代理人 弁理
士 青 山 葆 ほか２名第１図FIG. 2 is a cross-sectional side view of an electroless plated composite according to an embodiment of the present invention, and FIG. 2 is a plan view of the electroless plated composite. ■...Object to be plated, 2...Adhesive resin composition, 3...
・Electroless plating film. Patent applicant Tokai Rika Denki Seisakusho Co., Ltd. Agent Patent attorney Aoyama Ao and two others Figure 1
Claims (9)
ポリブチラール樹脂を共重合させた接着性樹脂組成物の
硬化被膜（２）を介して接着してなることを特徴とする
無電解めっき複合体。(1) Electroless plating film (3) on the object to be plated (1),
An electroless plating composite, characterized in that it is formed by adhering through a cured film (2) of an adhesive resin composition copolymerized with a polybutyral resin.
、該ポリブチラール樹脂と反応して熱硬化する熱硬化性
樹脂とからなる特許請求の範囲第１項記載の無電解めっ
き複合体。(2) The electroless plating composite according to claim 1, wherein the adhesive resin composition comprises a polybutyral resin and a thermosetting resin that reacts with the polybutyral resin to thermoset.
めっき膜である特許請求の範囲第１項又は第２項記載の
無電解めっき複合体。(3) The electroless plated composite according to claim 1 or 2, wherein the electroless plated film is a nickel-based amorphous alloy plated film.
特許請求の範囲第３項記載の無電解めっき複合体。(4) The electroless plated composite according to claim 3, wherein the electroless plated film comprises nickel and phosphorus.
る特許請求の範囲第３項記載の無電解めっき複合体。(5) The electroless plated composite according to claim 3, wherein the electroless plated film comprises nickel and boron.
からなる特許請求の範囲第３項記載の無電解めっき複合
体。(6) The electroless plated composite according to claim 3, wherein the electroless plated film comprises nickel, chromium, and phosphorus.
からなる特許請求の範囲第３項記載の無電解めっき複合
体。(7) The electroless plated composite according to claim 3, wherein the electroless plated film comprises nickel, boron, and phosphorus.
とリンとからなる特許請求の範囲第３項記載の無電解め
っき複合体。(8) The electroless plated composite according to claim 3, wherein the electroless plated film comprises nickel, tungsten, and phosphorus.
成物を被めっき体（１）に接着したのち、該接着性樹脂
組成物を１００〜１６０℃で３０分以上乾燥硬化させ、
硬化した接着性樹脂組成物の被膜（２）上に無電解めっ
き膜（３）を形成したことを特徴とする無電解めっき複
合体の製造方法。(9) After adhering an adhesive resin composition copolymerized with polybutyral resin to the plated object (1), drying and curing the adhesive resin composition at 100 to 160°C for 30 minutes or more,
A method for producing an electroless plated composite, comprising forming an electroless plated film (3) on a coat (2) of a cured adhesive resin composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14191385A JPS621875A (en) | 1985-06-27 | 1985-06-27 | Electroless-plated complex compound and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14191385A JPS621875A (en) | 1985-06-27 | 1985-06-27 | Electroless-plated complex compound and its production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS621875A true JPS621875A (en) | 1987-01-07 |
Family
ID=15303076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14191385A Pending JPS621875A (en) | 1985-06-27 | 1985-06-27 | Electroless-plated complex compound and its production |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS621875A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5359766A (en) * | 1976-11-10 | 1978-05-29 | Matsushita Electric Industrial Co Ltd | Coating materials for substrate of chemical plating |
| JPS5885111A (en) * | 1981-11-16 | 1983-05-21 | Seiko Epson Corp | Manufacturing method of encoder slit plate |
-
1985
- 1985-06-27 JP JP14191385A patent/JPS621875A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5359766A (en) * | 1976-11-10 | 1978-05-29 | Matsushita Electric Industrial Co Ltd | Coating materials for substrate of chemical plating |
| JPS5885111A (en) * | 1981-11-16 | 1983-05-21 | Seiko Epson Corp | Manufacturing method of encoder slit plate |
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