JPS62190823A - Manufacture of electronic parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing electronic components used in electronic equipment and electrical equipment.

Conventional technology In recent years, electronic component sealing technology has helped miniaturize devices.

Higher density of circuits to achieve rationalization of production.

With the need for high-speed automation of mounting, molding with high dimensional and shape accuracy has come to be adopted.

In conventional molding, the electronic component element is first sealed by sandwiching the electrode lead-out portion to which the electronic component element is joined between molds processed into a product shape. In this manufacturing method, resin is injected under pressure into a sealed space around the electronic component element, and is cured and molded in a mold.

Hereinafter, conventional molding as described above will be explained with reference to one drawing. FIG. 3 is a front view showing a closed state of conventional molding. In FIG. 3, 1 is an electronic component element. Reference numeral 2 denotes an electrode lead-out portion for taking out the electrodes of the electronic component element 1 to the outside. 4
6 is an upper mold for sealing the electronic component element 1, and 6 is a lower mold. 6 is a space around the electronic component element 1 that is sealed by the upper and lower molds 4.6. FIG. 4 is a side view of FIG. 3.

In the above configuration, first the electronic component element 1
is joined to the electrode extension part 2, the electrode extension part 2 is positioned on the lower mold 5, and is inserted between the upper mold 4 and the electronic component element is sealed.

Resin is injected under pressure into the space 6 around the sealed electronic component element 1, hardened in a mold, and molded.

Problems to be Solved by the Invention However, in the above method, the electrode extraction part is
Since the electrode is sandwiched between an upper mold and a lower mold, high precision is required in the shape and pitch of the electrode lead-out portion, the pitch dimension, and the shape and size of the mold. In addition, if many electrode lead-out parts are not on the same plane, some parts may not be moldable, or even if molding is possible, the mold must be divided into multiple parts, and processing and molding of one mold may be difficult. It has been difficult to improve the productivity of electronic component manufacturing by molding.

In view of the above-mentioned drawbacks, the present invention provides a method for manufacturing electronic components with high productivity and high packaging precision in manufacturing electronic components by molding.

Means for Solving the Problems In order to solve the above problems, the method for manufacturing electronic components of the present invention includes attaching electrode lead-out portions and electronic component elements to an insulating substrate in advance, and attaching the insulating substrate during molding. The structure is such that it plays part of the role of a mold as one side of a chamber that seals the electronic component element.

Function: With this configuration, the electrode lead-out portion is already closed by the insulating substrate, so the electronic component element is sealed by pressing the mold processed into the product shape against the insulating substrate. For this reason, there is no need for a high-precision mold like in the past. Furthermore, even if there are a large number of electrode lead-out parts and the electrode lead-out parts are not on the same plane, if a large number of electrode lead-out parts are attached to an insulating substrate as described above, a multi-segmented mold is not required. Mold forming is possible.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to five drawings. FIG. 1 is a front view showing a sealed state before molding in a method for manufacturing an electronic component according to an embodiment of the present invention. 11 is Remento, an electronic parts engineer. Reference numeral 12 denotes an electrode lead-out portion for drawing out the electrodes of the electronic component element 11 to the outside.

Reference numeral 13 denotes an insulating substrate on which the electrode extension portion 12 is attached. Reference numeral 14 denotes an upper mold for sealing the electronic component element 11. Reference numeral 15 denotes a presser die for bringing the upper mold 14 and the insulating substrate 13 into close contact.

Reference numeral 16 denotes a space around the electronic component element 11 that is sealed by the upper mold 14 and the insulating substrate 13.

FIG. 2 is a side view of FIG. 1.

In the configuration of the embodiment as described above, the first insulating substrate 13 is punched out in advance into a predetermined shape by a bush pack method or the like, and then the electrode extension part 12 is driven into the insulating substrate 13, and the electronic component element 11 and the electrode extension part are punched out. 12 are joined. Next, the upper mold 14 and the insulating substrate 13 are positioned and sealed with the presser mold 16. In that sealed space 16,
Resin is injected under pressure, cured, and molded.

In this embodiment, phenol is used as the material for the first insulating substrate 13, but other materials such as glass epoxy and pps film can also be used. Further, by using a printed circuit board as the insulating substrate 13, attachment of electronic component terminals can be omitted. Furthermore, the insulating substrate can be processed into a predetermined shape by cutting, punching, etc. after attaching lead terminals and electronic component elements.

Effects of the Invention As described above, the present invention has a manufacturing method including molding of electronic parts, in which an insulating substrate with an electrode lead-out part is used for sealing and as one surface during molding of one mold, thereby improving the conventional method. , the high dimensional precision of the electrode lead-out part and the molding die, which was a drawback of the molding manufacturing method, is no longer required, and in the conventional molding method, due to the structure and shape of the electrode lead-out part, the electrode lead-out part can only be drawn out after molding. In the present invention, even if the electrode lead-out part cannot be processed, the structure of the electrode extraction part processing process can be freely configured either before or after molding. This eliminates the need for high dimensional accuracy in the electrode lead-out part and the molding die.

Furthermore, the manufacturing process can be simplified and further automated, leading to a dramatic improvement in productivity, which is truly a great contribution to industry.

[Brief explanation of drawings]

FIG. 1 is a front view showing a sealed state before molding in a method for manufacturing electronic components according to an embodiment of the present invention, FIG. 2 is a side view of FIG. 1, and FIG. FIG. 4 is a front view showing the sealed state, and FIG. 4 is a side view of FIG. 3. 11...Electronic component element, 12...
・Electrode extraction part, 13...Insulating substrate, 14...
...Top mold. 15... Presser mold, 16... Sealed space. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3 Figure 4

Claims (2)

[Claims] (1) A method for manufacturing an electronic component, characterized in that an electrode lead-out portion of an electronic component and an electronic component element are attached to an insulating substrate in advance, and the insulating substrate is used as one side of the seal when molding the electronic component element. . (2) A method for manufacturing an electronic component according to claim 1, characterized in that an electrode lead-out portion of the electronic component is provided on the insulating substrate.