JPS62199923U - - Google Patents
Info
- Publication number
- JPS62199923U JPS62199923U JP8987686U JP8987686U JPS62199923U JP S62199923 U JPS62199923 U JP S62199923U JP 8987686 U JP8987686 U JP 8987686U JP 8987686 U JP8987686 U JP 8987686U JP S62199923 U JPS62199923 U JP S62199923U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- resin film
- electronic component
- type electronic
- component body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Packages (AREA)
- Details Of Resistors (AREA)
Description
第１図は本考案に係るチツプ電子部品を示す断
面図、第２図は同部品の電子部品連を示す断面図
、第３〜７図は同部品連の製造工程を示す説明図
、第８，９図は同電子部品の装着工程を示す説明
図である。
１１：樹脂フイルム、１３：部品本体、１４：
熱硬化性物質。
FIG. 1 is a sectional view showing a chip electronic component according to the present invention, FIG. 2 is a sectional view showing an electronic component series of the same component, FIGS. 3 to 7 are explanatory diagrams showing the manufacturing process of the same component series, and FIG. , 9 are explanatory diagrams showing the mounting process of the electronic component. 11: Resin film, 13: Part body, 14:
Thermosetting material.
Claims (1)
、他面部を剥ぎ取り可能な樹脂フイルムで被覆し
てなることを特徴とするチツプ型電子部品。 (2) 上記樹脂フイルムが、熱可塑性の粘着材で
部品本体に被着されているところの実用新案登録
請求の範囲第１項記載のチツプ型電子部品。[Claims for Utility Model Registration] (1) A chip-type electronic component characterized by having a thermosetting substance on a partial surface of the component body and covering the other surface with a peelable resin film. (2) The chip-type electronic component according to claim 1, wherein the resin film is adhered to the component body using a thermoplastic adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8987686U JPS62199923U (en) | 1986-06-11 | 1986-06-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8987686U JPS62199923U (en) | 1986-06-11 | 1986-06-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62199923U true JPS62199923U (en) | 1987-12-19 |
Family
ID=30949255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8987686U Pending JPS62199923U (en) | 1986-06-11 | 1986-06-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62199923U (en) |
-
1986
- 1986-06-11 JP JP8987686U patent/JPS62199923U/ja active Pending
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