JPS62201941U - - Google Patents

Info

Publication number
JPS62201941U
JPS62201941U JP1986090677U JP9067786U JPS62201941U JP S62201941 U JPS62201941 U JP S62201941U JP 1986090677 U JP1986090677 U JP 1986090677U JP 9067786 U JP9067786 U JP 9067786U JP S62201941 U JPS62201941 U JP S62201941U
Authority
JP
Japan
Prior art keywords
package
integrated circuit
external lead
receiving notch
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986090677U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986090677U priority Critical patent/JPS62201941U/ja
Priority to KR2019860022015U priority patent/KR900003885Y1/ko
Publication of JPS62201941U publication Critical patent/JPS62201941U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H10W70/429—Bent parts being the outer leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案によるパツケージの一実施例を
示す斜視図、第２図は第１図におけるリード受け
用切込み部と外部リード端子の関係を示す一部断
面図、第３図は上記実施例のパツケージを実装し
た時の状態を示す一部断面図、第４図は本考案に
よる他の実施例を示す斜視図、第５図ａおよびｂ
は本考案による別の実施例をそれぞれ示す一部断
面図、第６図は従来のパツケージの一例を示す斜
視図、第７図は第６図におけるリード受け部と外
部リード端子の関係を示す一部断面図、第８図は
第６図のパツケージを実装したときの状態を示す
一部断面図である。 １…パツケージ本体、２…Ｊ形のリード（外部
リード端子）、３…実装基板、４…半田、１１…
パツケージ本体の側面、１２…パツケージ本体の
下面、１３，１４，１５，１６…リード受け用切
込み部、２１…外部リード端子の先端部、３１…
マウントパツド。

Claims (1)

  1. 【実用新案登録請求の範囲】 (1) 集積回路チツプを樹脂封止したパツケージ
    本体の少なくとも１つの側面に沿つて下方に延び
    る複数のＪ形の外部リード端子を有する集積回路
    用パツケージにおいて、前記パツケージ本体の側
    面と下面の境界部に、前記各外部リード端子の先
    端部を保持するためのリード受け用切込み部を設
    けたことを特徴とする集積回路用パツケージ。 (2) リード受け用切込み部を外部リード端子毎
    に分割して設けたことを特徴とする実用新案登録
    請求の範囲第１項記載の集積回路用パツケージ。
JP1986090677U 1986-06-13 1986-06-13 Pending JPS62201941U (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1986090677U JPS62201941U (ja) 1986-06-13 1986-06-13
KR2019860022015U KR900003885Y1 (ko) 1986-06-13 1986-12-30 집적회로용 패키지

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986090677U JPS62201941U (ja) 1986-06-13 1986-06-13

Publications (1)

Publication Number Publication Date
JPS62201941U true JPS62201941U (ja) 1987-12-23

Family

ID=30950761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986090677U Pending JPS62201941U (ja) 1986-06-13 1986-06-13

Country Status (2)

Country Link
JP (1) JPS62201941U (ja)
KR (1) KR900003885Y1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100422439B1 (ko) * 1997-01-15 2004-05-17 페어차일드코리아반도체 주식회사 모터 드라이브 아이시의 Pd제한 회로

Also Published As

Publication number Publication date
KR900003885Y1 (ko) 1990-05-03
KR880001342U (ko) 1988-03-15

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