JPS62206842A - 樹脂封止形半導体装置用トランスフア−成形機 - Google Patents

樹脂封止形半導体装置用トランスフア−成形機

Info

Publication number
JPS62206842A
JPS62206842A JP61049683A JP4968386A JPS62206842A JP S62206842 A JPS62206842 A JP S62206842A JP 61049683 A JP61049683 A JP 61049683A JP 4968386 A JP4968386 A JP 4968386A JP S62206842 A JPS62206842 A JP S62206842A
Authority
JP
Japan
Prior art keywords
pot
transfer molding
resin
molding machine
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61049683A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0416015B2 (th
Inventor
Susumu Ueno
進 上野
Masaru Kaneda
優 金田
Shinichi Shimizu
清水　真一
Tetsuo Yoshida
哲夫 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin-Etsu Chemical Co Ltd
Original Assignee
Shin-Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Chemical Co Ltd filed Critical Shin-Etsu Chemical Co Ltd
Priority to JP61049683A priority Critical patent/JPS62206842A/ja
Publication of JPS62206842A publication Critical patent/JPS62206842A/ja
Publication of JPH0416015B2 publication Critical patent/JPH0416015B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/58—Details
    • B29C45/62—Barrels or cylinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP61049683A 1986-03-07 1986-03-07 樹脂封止形半導体装置用トランスフア−成形機 Granted JPS62206842A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61049683A JPS62206842A (ja) 1986-03-07 1986-03-07 樹脂封止形半導体装置用トランスフア−成形機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61049683A JPS62206842A (ja) 1986-03-07 1986-03-07 樹脂封止形半導体装置用トランスフア−成形機

Publications (2)

Publication Number Publication Date
JPS62206842A true JPS62206842A (ja) 1987-09-11
JPH0416015B2 JPH0416015B2 (th) 1992-03-19

Family

ID=12837977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61049683A Granted JPS62206842A (ja) 1986-03-07 1986-03-07 樹脂封止形半導体装置用トランスフア−成形機

Country Status (1)

Country Link
JP (1) JPS62206842A (th)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5460502A (en) * 1993-09-15 1995-10-24 Majercak; Michael L. Plunger apparatus used in a resin molding device for encapsulating electronic components
US5501588A (en) * 1994-04-22 1996-03-26 Han-Mi Mold & Tool Co., Ltd Mold for a semiconductor package

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5436835A (en) * 1977-08-25 1979-03-17 Susumu Hirai Quiet jump shoes by installation of coil spring
JPS54132661A (en) * 1978-04-07 1979-10-15 Hitachi Ltd Transfer molding of thermosetting resin
JPS5993315A (ja) * 1982-11-19 1984-05-29 Hitachi Ltd モ−ルド型
JPS6137407A (ja) * 1984-07-31 1986-02-22 Hitachi Metals Ltd トランスフア−成形機用スリ−ブ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5436835A (en) * 1977-08-25 1979-03-17 Susumu Hirai Quiet jump shoes by installation of coil spring
JPS54132661A (en) * 1978-04-07 1979-10-15 Hitachi Ltd Transfer molding of thermosetting resin
JPS5993315A (ja) * 1982-11-19 1984-05-29 Hitachi Ltd モ−ルド型
JPS6137407A (ja) * 1984-07-31 1986-02-22 Hitachi Metals Ltd トランスフア−成形機用スリ−ブ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5460502A (en) * 1993-09-15 1995-10-24 Majercak; Michael L. Plunger apparatus used in a resin molding device for encapsulating electronic components
US5501588A (en) * 1994-04-22 1996-03-26 Han-Mi Mold & Tool Co., Ltd Mold for a semiconductor package

Also Published As

Publication number Publication date
JPH0416015B2 (th) 1992-03-19

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