JPS622093A - Heat-insulating structure - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a heat insulating structure for cold and heat insulation.

BACKGROUND OF THE INVENTION Conventionally, inorganic materials such as glass fiber 9 asbestos and calcium silicate, and organic materials such as foamed polyurethane and foamed polystyrene have been used as heat insulating materials. Inorganic materials have good heat resistance, but thermal conductivity is 0.03~o, oa Kc
al /m*h 8°C, and the thermal conductivity of the organic foam is 0.016 Kc in the case of rigid polyurethane foam.
afi/m*h*℃, 0 for soft polyurethane foam
．． It has a heat insulation performance of 0.03 Kcal/mah*℃, and in the case of rigid polystyrene foam, 0.03 KCa R7m @ h・℃. [For example, co-authored by Yukio Sugiyama and Katsumi Nagaita; Insulation Engineering (1972)].

Problems to be Solved by the Invention However, the heat insulating performance of such heat insulating materials has been improved year by year, and it is not easy to further improve the heat insulating performance. In addition, insulation materials with relatively good insulation performance (
For example, rigid foamed polyurethane insulation materials have the disadvantage of being hard and inflexible.Means for Solving the ProblemsThe present invention relates to a heat insulating structure that solves the above problems, and relates to a flexible plastic container. It is a heat insulating structure that is made of a flexible heat insulating material, the voids of which are filled with a gas that has a lower thermal conductivity than air, and are sealed.

As the flexible heat insulating material, flexible polyurethane foam, inorganic fiber, cotton 1 synthetic fiber cotton, felt, etc. are preferable. As the gas having a lower thermal conductivity than air, fluorocarbon gas 9 carbon dioxide, etc. are preferable. There are no particular restrictions on the material of the flexible plastic container, but examples include polyethylene, polypropylene, polyamide, polyester, polyvinylidene chloride, and aluminum vapor-deposited film.

A gas barrier container made of a single layer or laminated material such as aluminum foil or rubber material is preferable.

Function: A gas with a thermal conductivity lower than that of air is present in the nitrogen gap of a flexible heat insulating material (the thermal conductivity of air is approximately 0.020 KcaR/m).
The heat transfer due to gas convection is almost negligible, and the shape of the insulating structure can be defined by filling the insulation structure with air (sh・℃), which is sealed in a flexible plastic container. The thermal conductivity of the heat insulating structure is 0.020 Kcal/mah ++'
It has excellent heat insulation performance of C or lower.

Embodiment An embodiment of the present invention will be described with reference to the drawings. The figure is a sectional view of the base structure of the heat insulating structure of the present invention. Reference numeral 1 denotes a flexible plastic container, the inside of which is filled with a flexible heat insulating material 2, and the gap in the flange is filled with a gas 3 having a lower thermal conductivity than air and sealed.

The present invention will be explained in more detail below using specific examples. In addition, in this example, the measurement of thermal conductivity is as follows:
Using Dynatic's Nichimatic thermal conductivity measuring device, the temperature was measured at 13°C and 3°C using a method compliant with ASTM-Cs1s.
Thermal conductivity was measured at a temperature difference of 6°C.

Example 1 A flexible polyurethane foam insulation material with open pores (thermal conductive material: 0.032 Kcal/msh++°C) was placed in a container bag made of a laminate film (thickness: 10, um) made of polyethylene and aluminum-deposited polyester.

The laminated film container was filled with 0.031/crl (density: 0.031/crl), placed in a gas displacement packaging machine equipped with a heat sealing device, and the inside of the film container was evacuated using a vacuum pump. -12 (CCl2F3) gas is filled, and in that state, the open part of the laminate film container is sealed using a heat sealing device, and the width is 30 cm.
A heat insulating structure having a vertical width of 30 cm and a thickness of 2 cm was obtained.

The resulting insulation structure retained the flexibility of the flexible polyurethane foam insulation material used and was extremely flexible. The thermal conductivity is 0.015Kcafi/m*h-℃,
It had excellent heat insulation performance. Furthermore, as a result of measuring the thermal conductivity of this heat insulating structure after leaving it at room temperature for three months, it was found to be 0.
015 Kcal/m++h*'c, and there was no deterioration at all.

Example 2 A flexible plastic container as shown in Table 1,
30 crn width, 30 crn length, 2C thickness using flexible insulation material and gas in the same manner as in Example 1.
A heat insulating structure was prepared for each of m.

Flexibility and thermal conductivity of each obtained insulation structure, 3
Table 2 shows the thermal conductivity after being left at room temperature for several months. Further, it has excellent heat insulation performance with a thermal conductivity of 0.020 KaaA/m*h*'c or less.

Table 2 Example 3 In a laminate film container made of polyethylene, aluminum vapor-deposited polyester, and polyamide, aluminum foil or aluminum vapor-deposited plastic film and a flexible heat insulating sheet as shown in Table 3 were placed. Filled with multi-layered materials, and the gap was filled with Freon-12 (CCI2F2) gas in the same manner as in Example 1,
Seal the width 30 cm, the height 30, and the thickness of the solder 1 cm.
A thermal insulation structure was obtained for each of the following. Table 4 shows the results of measuring the thermal conductivity and flexibility of each of the obtained heat insulating structures.0 As is clear from Table 4, all of the obtained heat insulating structures were It has the same flexibility as a heat insulation sheet, and has a thermal conductivity of 0.020 Kc a n7 m-h.
・It has excellent insulation performance below ℃.

As described in detail in Table 4, the present invention comprises a flexible plastic container filled with a flexible heat insulating material and a gas having a lower thermal conductivity than air in the space, and sealed. It is a heat insulating structure made of aluminum, and has high industrial value because it is flexible, has low thermal conductivity, and has excellent heat insulating performance.

[Brief explanation of drawings]

The figure is a sectional view showing the basic configuration of a heat insulating structure in an embodiment of the present invention. 1...Flexible plastic container, 2...
・Flexible insulation material, 3...Gas with lower thermal conductivity than air.

Claims (5)

[Claims] (1) A heat insulating structure in which a flexible plastic container is filled with a flexible heat insulating material and a gas whose thermal conductivity is lower than that of air, and the space is sealed. (2) The heat insulating structure according to claim 1, wherein the gas having a lower thermal conductivity than air is fluorocarbon gas. (3) The flexible plastic container is formed by laminating at least two layers of a plastic film, a gas barrier film, an aluminum vapor-deposited film, and an aluminum foil. Insulated structure. (4) The heat insulating structure according to claim 1, wherein the flexible heat insulating material has many voids. (5) The heat insulating material according to claim 1, wherein the flexible heat insulating material is formed by laminating a flexible heat insulating sheet and aluminum vapor-deposited film or aluminum foil in multiple layers. Structure.