JPS62215855A - Apparatus for inspecting printed circuit board - Google Patents

Abstract

PURPOSE:To attain to shorten a processing time, by processing the both surface image information of a printed circuit board obtained by an image pickup part to make it possible to inspect the parts provided to the front surface of the board and the parts provided to the back surface thereof. CONSTITUTION:An image pickup part 13 is equipped with upper and lower cameras 32, 34 and upper and lower illumination devices 33, 35 and the images of the front and back surfaces of a printed circuit board to be inspected are picked up by the cameras 32, 34 and the obtained image signals are sent to a processing part 14. The processing part 14 extracts the parameters of reference parts 11-1a-11-na from the upper and lower side image signals on a reference printed circuit board 10-1 at the time of a teaching mode to form a judge file. Next, at the time of an inspection mode, the processing part 14 extracts the parameters of the parts 11-1b-11-nb of the printed circuit board 10-2 to be inspected to form a data file to be inspected. Both files are compared and the detachment and positional shift of the parts 11-1b-11-nb are inspected.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention provides an Ia image of both sides of a board, and a part attached to the surface of the board and a part attached to the surface of the board. The present invention relates to a board inspection device that performs simultaneous inspection.

(Prior art) - If an automatic mount 5A position is used when mounting various chip parts such as resistors and semiconductor elements, the parts may not be mounted according to the mount data after mounting. be.

For this reason, when using such automatic mounting, the printed circuit board is checked after mounting to ensure that the correct chip components are in the correct position and orientation (position, direction) on the printed circuit board. You need to check whether it is mounted or not and whether it has fallen off.

However, if such an inspection is performed by manual visual inspection as in the past, there are problems in that the occurrence of inspection errors cannot be completely eliminated and the inspection speed cannot be increased.

Therefore, in recent years, various manufacturers have proposed various automatic inspection devices for printed circuit boards that can automatically perform this type of inspection.

FIG. 8 is a block diagram showing an example of such an automatic inspection device.

The automatic inspection device shown in this figure has a TV camera 3 that inspects a printed circuit board 2-2 to be inspected on which a component 1 is mounted, and data input from a keyboard 8, that is, a reference board as shown in FIG. Data regarding the type of the base printed circuit board 2-1, data regarding the type, dispensing position, mounting position, shape, etc. of each component 1 mounted on this reference printed circuit board 2-1, and data regarding each of these. a storage unit 4 that stores information (data) regarding inspection processing procedures for the component 1;
The information stored in this storage unit 4 and the TV camera 3
By comparing the information shown by the image from It comprises a judgment circuit 5 and a monitor 6 for displaying the judgment results of the judgment circuit 5 and for printing the print schedule.

(Problem to be solved by the explanation) By the way, in this type of automatic inspection equipment, when inspecting the printed circuit board 2-2 to be inspected,
Since the configuration was such that only one surface of the board 2-2 was imaged and only the component 1 placed on this surface was inspected, when the printed circuit board 2-2 to be inspected was a double-sided mounting board, one After the inspection process of the part 1 which is taken on the surface of
Flip over the part 1 attached to the other side.
inspection process had to be carried out.

For this reason, in conventional automatic inspection apparatuses, when inspecting such double-sided mounting boards, there has been a problem that the inspection time becomes long.

In view of the above-mentioned circumstances, the present invention is designed to test components mounted on both sides at once without turning over the printed circuit board to be inspected, even when components are mounted on both sides of the printed circuit board for liquid inspection. It is an object of the present invention to provide a substrate inspection apparatus that can shorten the processing time.

(Means for Solving the Problems) In order to solve the above problems, the M temporary inspection system according to the present invention is a board that inspects components on the board by processing data obtained by imaging the board. In the inspection device, an imaging unit that captures images of both sides of the board, and a processing unit that processes the double-sided image information of the board obtained by the imaging unit to inspect components on the front side and parts on the back side of the board. It is characterized by having the following.

(Embodiment) FIG. 1 is a block diagram showing a first embodiment of a board inspection apparatus according to the present invention.

The board inspection apparatus shown in this figure has a reference printed circuit board 1O-
1 (or the printed circuit board to be inspected 1O-2) at the same time, this reference printed circuit board 1O-
1 (or the printed circuit board to be inspected 1O-2).
(or components 1l-1b to 1l-nb) at one time, and includes an X-Y table section 12, an imaging section 13, and a processing section 14.

The X-Y table section 12 determines the X-axis position of the semi-printed circuit board 1O-1 (or the board to be inspected 1 to 10-2) based on the control from the processing section 14. and determines the position in the Y-axis direction, and as shown in FIG.
6 and a substrate holding section 17.

The X-axis direction positioning section 15 includes an X-axis circumferential pulse motor 20 that operates based on the X-direction control signal from the processing section 14.
and 2 driven by this X-axis circumferential pulse motor 20.
two driving pulleys 21a, 21b, and a driven pulley 22a arranged parallel to each of these driving pulleys 21a, 21b.
, 22b, non-slip belts 23a, 23b, which are hung between each of the driven pulleys 22a, 22b and each of the drive pulleys 21a, 21b, and a slide fixed to the same position on each of these non-slip belts 23a, 23b. Blocks 24a, 24b and a slide shaft 25a that guides these slide blocks 24a, 24b movably in the X-axis direction.

25b, and determines the position of the substrate holding section 17 in the X-axis direction based on the X-direction control signal from the processing section 14.

Further, the Y-axis direction positioning part 16 is movably attached to the guide rail 26 with its both ends fixed on the respective slide blocks 24a and 24b, and the nut of the ball screw mechanism 18 is fitted. A slide block 29 is fixed to one end of the upper surface of the guide rail 26, and rotates the screw shaft of the ball screw mechanism 18 based on a Y-direction control signal from the processing section 14, thereby controlling the position of the slide block 29 in the Y-axis direction. The Y-axis pulse motor 27 determines the position of the substrate holding section 17 in the Y-axis direction based on the Y-direction control signal from the processing section 14.

Board protection 1. '1 part 17 includes a holder 31 fixed to the slide block 29 and a latch attached to this holder 31.
t%1 printed circuit board 1O-1 (or the printed circuit board to be inspected 1O-2) is fixed to this holder 31.
The reference printed circuit board 1 to the base board 10-1 (or the printed circuit board to be inspected 1O-2) set at
After the -Y direction position is determined, the front and back surfaces are imaged by the imaging unit 13.

The image carrying section 13 includes an upper TV camera 32 disposed above the substrate holding section 17, an upper ring illumination device 33 disposed coaxially with the lens fiQ surface of the upper TV camera 32, and the above-mentioned. A lower TV camera 34 disposed below the substrate holder 17, a lower ring illumination device 35 coaxially provided in front of the lens of the lower TV camera 34, and a lower ring illumination device 35 arranged from the upper TV camera 32 to the lower ring illumination device. It is equipped with angle 36 that supports buy 35,
The reference printed circuit board 10-1 (or the printed circuit board to be inspected 10-2) set and positioned in the board holder 17 is illuminated by the upper ring illumination mounting 33 and the lower ring illumination device 35, and the surface thereof is The upper TV camera 32 and the lower TV camera 3 are illuminated while the back side is illuminated.
4, both surfaces are imaged 11 times, and the upper surface side image signal and lower surface side image signal obtained by this imaging operation are supplied to the processing section 14.

When the processing section 14 is in the teaching mode, the processing section 14
From the upper side image signal and lower side image signal (upper side image signal and lower side image signal of the reference printed circuit board 10-1) supplied from 3 to each component 1l-1a on both sides of the reference printed circuit board 10-1. ~1l-na parameters are extracted to create a determination data file, and when the inspection mode is turned off, the upper side image signal and the lower side image signal (the printed circuit board 10-2 to be inspected) supplied from the positive image section 13 are extracted. Each component 1l-1b to 1l-n on both sides of the printed circuit board 10-2 to be inspected from the upper surface side image @5 lower surface side image signal)
A parameter b is extracted to create a data file to be inspected, and this data file to be inspected is compared with the 11th section judgment data file, and based on the comparison result, it is determined whether each of the parts 1l-1b to 1l-nb is missing. 1 positional shift, etc., and connects the upper/D converter 42 and the lower A/D converter 42.
D conversion unit 43, memory 44, teaching table 45, image processing unit 46, and XY stage control 0-
547, a CRT display 48, a printer 49, a keyboard 50, and an eleventh section (MAIN-CPU) 51.

When the upper A/D converter 42 is supplied with the upper side image signal from the imaging section 13, it performs A/D conversion (analog-to-digital conversion) to create upper side image data, which is then sent to the control section. 51.

Further, the lower A/D converter 43 is connected to the upper A/D converter 4.
2, when the lower side image signal is supplied from the imaging section 13, it A/D converts this to create lower side image data, and sends this to the control section 51. supply

Further, the memory 44 includes a RAM (random access memory), etc., and is configured by the control unit 5.
10 will be used as a work area.

Further, when the image processing section 46 is supplied with the upper surface side image data and the lower surface side image data via the control i11 section 51,
These upper surface side image data and lower surface side image data are binarized and a label (identification number) is attached to each component image, and each component image with the label 11 is supplied to the control section 51. Ru.

Furthermore, the teaching table 45 is equipped with a floppy disk device, etc., and upon being supplied with a judgment data file etc. from the control section 51 during teaching,
This is stored, and when the control section 51 outputs a transfer request during inspection, the judgment data file and the like are read out in response to this request and supplied to the control section 51 and the like.

Further, the X-Y stage controller O-ra 47 is connected to the control section 51.
and the X-Y table section 12, and controls the X-Y table section 12 based on the output of the control section 51.

Further, the CRT display plate 48 displays a cathode ray tube (CRT), and receives image data from the control section 51.

When the judgment result, key human power data, etc. are supplied, this is displayed on the screen.

Further, when the printer 49 is supplied with the determination result etc. from the control section 51, it prints it out in a predetermined format 91 (format 1-).

The keyboard 50 also provides operational information, data regarding the reference printed circuit board 10-1, and data on the reference printed circuit board 10-1.
The keyboard 50 is equipped with various keys necessary for inputting data, etc. related to the parts 1l-1a to 1l-na on the keyboard 50, and the information and data entered from the keyboard 50 are transferred to the control unit 5.
1.

The control unit 51 includes a microprocessor and the like, and operates as described below.

First, when inspecting a new printed circuit board 10-2 to be inspected, the control unit 51 executes the teaching routine 52 shown in the flowchart of FIG. 3(B) in step ST1 of the main flowchart as shown in FIG. 3(A). Step ST2 of this teaching routine 52 is called.
Wait until the reference printed circuit board 10-1 is set on the board holding section 17 of the X-Y table section 12.

When the reference printed circuit board 10-1 is set on the board holding section 17 of the X-Y table section 12, the control section 51 branches from step ST2 to step ST3, where it controls the X-Y table section 12. II image area 53- of the reference printed circuit board 10-1 is located below the upper TV camera 32.
18 (see Figure 4). At this time, the lower T
The back surface of the imaging area 53-1a is located above the V-camera 34.

After that, in step ST4, the control unit 51 operates the upper TV camera 32 and the lower TV camera 34 to respectively capture the front side and the back side of the imaging area 53-1a portion of the reference printed circuit board 10-1. In addition to capturing an image, the resulting upper surface side image signal and lower surface side image signal are converted into A/D converters 42 and 43, respectively.
A/D conversion is performed, and this A/D conversion result (both-side image data of the reference printed circuit board 10-1) is stored in the memory 44 in real time.

Next, the control unit 51 stores the memory 44 in step ST5.
The double-sided image data of the reference printed circuit board 10-1 is read out from , and is supplied to the image processing unit 46 to be binarized, and each part 1l-1a to 1l-ia (2≦ A label is displayed for each component image (i≦n).

Next, in step ST6, the control unit 51 takes in each labeled part image obtained by the image processing unit 46, and sets parameters such as color, shape, form, etc. for each part 11 1a to 1l-ia for 29 places. In addition to extracting, step S
From each of these parameters at T7, each part 1l-1a ~ 1
Create judgment data regarding i-ia.

After this, the control unit 51 controls each component 1i-1 in step ST8.
It is checked whether judgment data have been obtained for all parts a to 1l-ia, and steps ST6 to ST8 are repeatedly executed until judgment data 117 has been obtained for all parts 1l-1a to 1l-ia.

When the determination data for all of these parts 1l-1a to 1l-ia have been determined, the control Oa section 51 branches from step ST8 to step ST9, where all of the reference printer 1 to board 10-1 are determined. @Statue 1 rear 53-1
It is checked whether the processing for a to 53-ma has been completed.

If there remains an unprocessed imaging area, the control unit 51 returns from step ST9 to step ST3 and repeats the above-described operation.

Then, when the processing is completed for all of the 1ffilEl areas 53-1 to 53-ma, the control unit 51 branches from step ST9 to step 5T10, and here, each judgment for each of the parts 1l-1a to 1l-na is performed. After creating a judgment 1-tough aisle necessary for inspecting the printed circuit board 10-2 to be inspected from the data and storing it in the teaching table 45, this teaching routine 52 is ended.

Further, when this teaching routine 52 is finished and the inspection mode is set, the control section 51 starts the main flowchart 1.
- in step 5T11 of flowchart 1 of FIG. 3(C).
In step 5T12 of this inspection routine 54, the date data of the day and the ID number (identification number) of the printed circuit board 10-2 to be inspected are imported from the teaching table 45 and the keyboard 50. The judgment data file is read from 45 and stored in memory 44.

Next, in step 5T13, the control section 51 places the printed circuit board 10- to be inspected on the board holding section 17 of the X-Y table section 12.
Wait until 2 is set.

When the printed circuit board 10-2 to be inspected is set on the board holding section 17 of the X-Y table section 12, the control section 51
The process branches from step 5T13 to step 5T14, where the X-Y table section 12 is controlled to display the image area 53-1b (see FIG. 5) of the printed circuit board 10-2 under inspection under the upper TV camera 32. have it placed. At this time,
Above the lower TV camera 34, the [11 area 53-1
The back side of b is located.

After that, in step 5T15, the control unit 51 operates the upper TV camera 32 and the lower TV camera 34 to detect the front side and the back side of the Ra area 53-1b portion of the printed circuit board 10-2 to be inspected. At the same time as giving each person an image of
The upper surface side image signal obtained by this and the lower surface side inner B4
The signal is sent to the upper A/D converter 42 and the lower A/D converter 4.
3 and A/D conversion is performed on each of them, and the A/D conversion results (both-side image data of the printed circuit board 10-2 to be inspected) are stored in the memory 44 in real time.

Next, the control unit 51 stores the memory 4 in step 5T16.
The double-sided image data of the printed circuit board 10-2 to be inspected is read out from 4 and supplied to the image processing section 46 to be binarized, and each component 1 obtained by this binarization processing is
A label is attached to each part image of 1-1b to 11-ib (2≦i≦n).

Next, in step 5T17, the control unit 51 imports each labeled component image obtained by the image processing unit 16, and extracts parameters such as color, shape, form, etc. of each component 1l-1b to 1l-ib. At the same time, data to be inspected is created for all of the parts 11-1b to 11-ib based on each of these parameters.

After this, the control unit 51 performs the memory 4 in step 5T18.
4, each judgment data regarding the image area 53-1a in the judgment data file is read out, and each of these judgment data is compared with each of the above-mentioned data to be inspected. -1 b~1l-
It is determined whether or not ib has caused a dropout, a position shift, etc., and the result of this determination is stored in the memory 44.

Thereafter, the control section 51 returns from step ST19 to step ST14, and sequentially executes the above-described processing for the image areas 53-2b to 53-mb of the printed circuit board 10-2 to be inspected.

Then, when the processing has been completed for all of the @image areas 53-1b to 53-mb, the control section 51 branches from step 5T19 to step 5T20, and here, each part 1l-1b stored in the memory 44 is processed. ~1l-nb
The determination result is read out and displayed on the CRT display 48 or printed out from the printer 49.

In this embodiment, images of each surface of the Bt semi-printed board 1O-1 (or the printed circuit board 1O-2 to be inspected) are simultaneously captured by the upper TV camera 32 and the lower TV camera 34. Therefore, parts 1l-1a to 1l-na (or parts 11-1
The reference printed circuit board 1O-1 (or the printed circuit board to be inspected 1O-2) on which the test circuit boards 10-1 and 11-nb) are mounted can be processed at high speed.

In addition, in the above embodiment, the upper TV camera 32
and the lower TV camera 34.
The double-sided image data of the printed circuit board 10-1 (or the printed circuit board to be inspected 10-2) is recorded at 17, and as shown in FIG. 6 or 7, the reference printed circuit board 1 is
It is also possible to obtain image data on both sides of O-1 (or printed circuit board 1O-2 to be inspected).

In this case, the imaging unit 13-2 shown in FIG.
0, a switching mirror 61 rotatably arranged on the lens +'+N surface of this TV camera 6o, and a reference printed circuit board 1O-1 (or a printed circuit board to be inspected 10-2) set in the board holding section 17. Two upper mirrors 62 and 63 that guide the upper surface optical image to the switching mirror 61 and the reference print +-m board 1O-1 (or the print board to be inspected 1
i10-2) two lower mirrors 64 and 65 that guide the lower optical image to the switching mirror 61, and the TV camera 60.
~ a lower mirror 65, an upper ring illumination device 33°, and an arm 66 that supports the lower ring illumination device 35, and by switching the angle of the switching mirror 61, the reference print bowl plate 1O-1 (or the print to be inspected) The upper surface side and the lower surface side of the substrate 1O-2) are sequentially imaged by the TV camera 60, and the upper surface side image signal and the lower surface side image signal obtained by this image carrying operation are output in a time-sharing manner.

Further, the imaging section 13-3 shown in FIG. 7 is connected to the 1l shown in FIG.
The difference from the lti section 13-2 is that a fixed triangular mirror 7o is provided in place of the switching mirror 61.

With this configuration, the imaging unit 13-3 allows the TV camera 60 to capture the reference lint base plate 1O-
1 (or the printed circuit board 1O-2 to be inspected) can be R-imaged at the same time on the upper surface side and the lower surface side.

(Effects of the Invention) According to the present invention described above, even when components are mounted on both sides of a printed circuit board to be inspected, they can be mounted on both sides without turning over the printed circuit board to be inspected. parts can be inspected at once, thereby reducing processing time.

[Brief explanation of drawings]

FIG. 1 is a block diagram showing a first embodiment of the M plate inspection device according to the present invention, FIG. 2 is a perspective view showing a configuration of the X-Y table section shown in FIG. 1, and FIG. Main flowchart for explaining an operation example of the embodiment, FIG. 3(B)
3(C) is a flowchart showing an example of a teaching routine in the same embodiment, FIG. 3(C) is a flowchart showing an example of an inspection routine in the same embodiment, and FIG. A schematic diagram showing an example, FIG. 5 is a schematic diagram showing an example of the imaging area set for the printed circuit board to be inspected in the same embodiment, and FIG. 6 is a side view for explaining the second embodiment of the present invention. 7 is a side view for explaining the third embodiment of the present invention, FIG. 8 is a block diagram showing an example of a conventional automatic inspection device, and FIG. 9 is a diagram showing the inspection standard of this automatic inspection device. FIG. 2 is a side view showing an example of a reference printed circuit board. 10-1... Board (reference printed circuit board), 10-2...
... Board (printed circuit board to be inspected), 1l-1a to 11-
n a ... parts, 11-1 b ~ 11- n
b・gtS product, 12...X-Y table part, 13...
・Okazobe, 14...Processing department. Patent applicant: Tateishi Electric Co., Ltd. Agent Patent attorney: Tetsuji Yoshikura (1 other person) Figure 4 Figure 5 Figure 6 Figure 7

Claims (1)

[Claims] In a board inspection apparatus that processes data obtained by imaging a board to inspect components on the board, an imaging unit that takes images of both sides of the board, and both sides of the board obtained by the imaging unit are provided. A board inspection apparatus comprising: a processing section that processes image information to inspect components on the front surface and components on the back surface of the board.