JPS6223733Y2 - - Google Patents
Info
- Publication number
- JPS6223733Y2 JPS6223733Y2 JP16821582U JP16821582U JPS6223733Y2 JP S6223733 Y2 JPS6223733 Y2 JP S6223733Y2 JP 16821582 U JP16821582 U JP 16821582U JP 16821582 U JP16821582 U JP 16821582U JP S6223733 Y2 JPS6223733 Y2 JP S6223733Y2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- chip
- electronic components
- leader
- shaped electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002390 adhesive tape Substances 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000004804 winding Methods 0.000 description 3
- 238000007906 compression Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Description
【考案の詳細な説明】
産業上の利用分野
本考案はチツプ形電子部品のテーピング包装品
に関するもので、特に自動装着の行いやすい形態
でチツプ形電子部品を収納するテーピング包装品
に関するものである。[Detailed Description of the Invention] Industrial Field of Application The present invention relates to a taped package for chip-shaped electronic components, and particularly to a taped package for storing chip-shaped electronic components in a form that is easy to automatically attach.
従来例の構成とその問題点
チツプ形電子部品の自動装着用テーピング包装
品は、第１図に示すようにキヤリアテープ１にチ
ツプ形電子部品５を収納する収納穴２を等間隔に
設け、そのキヤリアテープ１の下面を下テープ３
にて熱圧着した後、上記収納穴２にチツプ形電子
部品５を収納し、キヤリアテープ１の上面を上テ
ープ４にて熱圧着を行いシール包装するものであ
る。Structure of conventional example and its problems Taped packaging products for automatic mounting of chip-shaped electronic components have storage holes 2 for storing chip-shaped electronic components 5 arranged at equal intervals in a carrier tape 1 as shown in FIG. Lower the bottom surface of carrier tape 1 to tape 3.
After heat-compression bonding, the chip-shaped electronic component 5 is stored in the storage hole 2, and the upper surface of the carrier tape 1 is heat-compression bonded with the upper tape 4 for seal packaging.
従来、上テープ４及び下テープ３の熱圧着をし
た時、巻終り部の処理として上テープ４をリーダ
ーテープ用として使用するため、第２図に示すよ
うに上テープ４の巻終り部にリーダーテープ部４
ａを設けてその終端に接着テープ６を接着し、こ
の接着テープ６にて上テープ４が外れないように
第３図に示すようにリール７に巻かれたその１巻
前の上テープ４に貼付けを行つていた。この場
合、上テープ４のリーダーテープ部４ａの長さに
よつては、チツプ形電子部品５が収納されている
上テープ４の上に接着テープ６が貼付けられるこ
ととなり、ユーザが接着テープ６を外した時、第
４図に示すように熱圧着されている上テープ４が
外れてチツプ形電子部品５がこぼれ落ちるという
問題点があつた。第２図で８はキヤリアテープ１
に形成された送り穴である。 Conventionally, when the upper tape 4 and the lower tape 3 are heat-pressed together, the upper tape 4 is used as a leader tape for processing the end of the winding, so that the leader tape portion 4 is formed at the end of the winding of the upper tape 4 as shown in FIG.
In this case, depending on the length of the leader tape portion 4a of the upper tape 4, the adhesive tape 6 may be stuck on the upper tape 4 containing the chip-type electronic components 5, and when the user removes the adhesive tape 6, the thermally compressed upper tape 4 may come off and the chip-type electronic components 5 may fall out, as shown in Fig. 4. In Fig. 2, 8 denotes the carrier tape 1.
These are feed holes formed in the
考案の目的
本考案はこのような従来の欠点を除去すべく創
案されたものであり、上テープをリーダーテープ
として使う際に熱圧着されている上テープが外れ
てチツプ形電子部品がこぼれ落ちないようにした
チツプ形電子部品のテーピング包装品を提供する
ことを目的とする。Purpose of the invention The present invention was devised to eliminate these conventional drawbacks, and is designed to prevent chip-shaped electronic components from falling out when the upper tape, which is thermocompressed, comes off when the upper tape is used as a leader tape. The purpose of the present invention is to provide taped packaging products for chip-shaped electronic components.
考案の構成
この目的を達成するために本考案のチツプ形電
子部品のテーピング包装品は、上テープのリーダ
ーテープ部の長さを少なくともリールの外周１回
転以上の長さにすることにより、熱圧着された上
テープの上にリーダーテープ部が貼付けられるこ
とを防ぐようにしたものである。Structure of the Invention In order to achieve this object, the tape-packed product of the present invention for chip-shaped electronic components is made by thermocompression bonding by making the length of the leader tape part of the upper tape at least one rotation around the outer circumference of the reel. This prevents the leader tape portion from being pasted on top of the top tape.
実施例の説明
以下、本考案の一実施例について第５図と共に
上記と同一箇所には同一番号を付して説明する。DESCRIPTION OF EMBODIMENTS Hereinafter, an embodiment of the present invention will be described with reference to FIG. 5, with the same numbers assigned to the same parts as above.
本考案では、上テープ４をリーダーテープとし
て使用する際、上テープ４のリーダーテープ部４
ｂの長さを少なくとも上記リール７の外周１回転
以上の長さにし、そのリーダーテープ部４ｂの終
端に接着した接着テープ６にて上テープ４が外れ
ないようにリール７に巻かれた１巻前の上テープ
４に貼付けた構成としている。 In the present invention, when the upper tape 4 is used as a leader tape, the leader tape portion 4 of the upper tape 4
The length of b is at least one rotation around the outer circumference of the reel 7, and the upper tape 4 is wound around the reel 7 with an adhesive tape 6 adhered to the end of the leader tape portion 4b so that the upper tape 4 does not come off. It has a configuration in which it is attached to the upper tape 4 in front.
考案の効果
以上のように構成された本考案のチツプ形電子
部品のテーピング包装品によれば、上テープのリ
ーダーテープ部が少なくともチツプ形電子部品が
収納されているその上テープの部分にかからない
ため、ユーザが接着テープを外した時に発生する
上テープ剥離によつて生じるチツプ形電子部品の
落ちこぼれを防止することができる。Effects of the Invention According to the tape-packaged product for chip-shaped electronic components of the present invention constructed as described above, the leader tape portion of the upper tape does not cover at least the portion of the upper tape in which the chip-shaped electronic components are housed. It is possible to prevent chip-shaped electronic components from falling off due to peeling of the upper tape when the user removes the adhesive tape.
第１図は従来例のテーピング包装品を説明する
ためのテーピング収納帯の断面図、第２図は第１
図のテーピング収納帯をリールに巻取つた状態を
示す斜視図、第３図は従来例によるリール巻取り
後の上テープ終端部の処理例を示す説明図、第４
図は同じく上テープの剥離状態を示す説明図、第
５図は本考案のテーピング包装品における上テー
プ終端部の処理例を示す説明図である。
１……キヤリアテープ、２……収納穴、３……
下テープ、４……上テープ、４ｂ……リーダーテ
ープ部、５……チツプ電子部品、７……リール。
Figure 1 is a sectional view of a taping storage band for explaining a conventional taped packaging product, and Figure 2 is a cross-sectional view of a taping storage band.
FIG. 3 is an explanatory view showing an example of processing of the upper tape end after reel winding according to the conventional example; FIG.
This figure is also an explanatory view showing the peeling state of the upper tape, and FIG. 5 is an explanatory view showing an example of processing the end portion of the upper tape in the taped packaged product of the present invention. 1...Carrier tape, 2...Storage hole, 3...
Lower tape, 4... Upper tape, 4b... Leader tape section, 5... Chip electronic component, 7... Reel.
Claims (1)
プ形電子部品を収納し、上記キヤリアテープの上
面及び下面を各々上テープ、下テープにて熱圧着
シール包装し、上記上テープをリーダーテープと
して使用する際、その上テープのリーダーテープ
部を少なくともリールの外周１回転以上の長さに
してなるチツプ形電子部品のテーピング包装品。 Chip-shaped electronic components are stored in storage holes provided at equal intervals in the carrier tape, and the upper and lower surfaces of the carrier tape are sealed and packaged by thermocompression using upper and lower tapes, respectively, and the upper tape is used as a leader tape. In addition, the leader tape part of the tape has a length of at least one revolution of the outer circumference of the reel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16821582U JPS5972795U (en) | 1982-11-05 | 1982-11-05 | Taping packaging for chip-shaped electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16821582U JPS5972795U (en) | 1982-11-05 | 1982-11-05 | Taping packaging for chip-shaped electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5972795U JPS5972795U (en) | 1984-05-17 |
| JPS6223733Y2 true JPS6223733Y2 (en) | 1987-06-17 |
Family
ID=30367810
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16821582U Granted JPS5972795U (en) | 1982-11-05 | 1982-11-05 | Taping packaging for chip-shaped electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5972795U (en) |
-
1982
- 1982-11-05 JP JP16821582U patent/JPS5972795U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5972795U (en) | 1984-05-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0324244A3 (en) | Tape automated bonding package for a semiconductor chip with decoupling | |
| JPS6223733Y2 (en) | ||
| JPH02109815A (en) | Method for storing small sized electronic component | |
| CN102887281A (en) | Multiple multi-column type element carrying belt | |
| JPS6047275U (en) | Taping packaging products for chip parts | |
| JPH0415672Y2 (en) | ||
| JPS63281968A (en) | Taping form of resin molded part | |
| JPS6038259U (en) | packaging equipment | |
| JPS6047276U (en) | Taping packaging products for chip parts | |
| JPH057160Y2 (en) | ||
| JPH03289457A (en) | Semiconductor part packaging tape | |
| JPS58161400A (en) | Taping packaging method for automatic mounting of chip-shaped electronic components | |
| JPH0298557A (en) | Electronic parts device stuck by tape | |
| JPH03114758U (en) | ||
| JPS6114660U (en) | Taping packaging for semiconductor devices | |
| JPH04279465A (en) | parts supply tape | |
| JPS5972798U (en) | Taping parts series for chip-shaped electronic parts | |
| JPS6076097U (en) | Reel for electronic parts | |
| JPH0158576U (en) | ||
| JPS5972797U (en) | Taping parts series for chip-shaped electronic parts | |
| JPS6015490U (en) | solder paste packaging | |
| JPS62193969A (en) | Member for packaging semiconductor device | |
| JPH04106259U (en) | Chip type electronic component storage belt | |
| JPS58115324U (en) | Packing materials such as garbage | |
| JPS60126305U (en) | Chip parts taping packaging equipment |