JPS62242558A - Light-emitting diode array unit - Google Patents
Light-emitting diode array unitInfo
- Publication number
- JPS62242558A JPS62242558A JP61086013A JP8601386A JPS62242558A JP S62242558 A JPS62242558 A JP S62242558A JP 61086013 A JP61086013 A JP 61086013A JP 8601386 A JP8601386 A JP 8601386A JP S62242558 A JPS62242558 A JP S62242558A
- Authority
- JP
- Japan
- Prior art keywords
- led array
- light emitting
- led
- array unit
- drive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Exposure Or Original Feeding In Electrophotography (AREA)
- Facsimile Heads (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、感光体に所望の光パターンを照射するＬＥＤ
光Ｄ光み装置に使用するしＥＤアレイユニットに関する
。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to an LED that irradiates a photoreceptor with a desired light pattern.
This invention relates to an ED array unit used in an optical D optical device.
従来の技術
従来、光書込み装置に用いるＬＥＤアレイは、第６図及
び第７図に示す様にＰ側電極１、ｎ −ＧａＡｓＰ層２
、ｎ−ＧａＡＳＰ層３、Ｐ！８！層４、絶縁層５及び６
及びｎ側電極１３よりなり、そしてＰ側電極１を発光部
列の両側に引き出し、第８図及び第９図に示す様にＬＥ
Ｄアレイチップの両側にドライブＩＣ８を配置していた
。そして、ドライブＩＣＢとＬＥＤアレイチップ７の間
はボンディングワイヤ１０により電気的に接続され、ま
たドライブＩＣとプリント基板９との間はボンディング
ワイヤ１１により電気的に接続されており、ドライブＩ
Ｃに内臓されるデー°夕のシリアルパラレル変換回路、
点灯制御回路、定電流駆動回路によりＬＥＤアレイチッ
プ上の各々の発光部を独立に制御していた。2. Description of the Related Art Conventionally, an LED array used in an optical writing device has a P-side electrode 1, an n-GaAsP layer 2, as shown in FIGS.
, n-GaASP layer 3, P! 8! layer 4, insulating layers 5 and 6
and an n-side electrode 13, and the p-side electrode 1 is drawn out to both sides of the light emitting section row to form an LE as shown in FIGS. 8 and 9.
Drive ICs 8 were placed on both sides of the D array chip. The drive ICB and the LED array chip 7 are electrically connected by a bonding wire 10, and the drive IC and the printed circuit board 9 are electrically connected by a bonding wire 11.
The data serial/parallel conversion circuit built into the C.
Each light emitting section on the LED array chip was independently controlled by a lighting control circuit and a constant current drive circuit.
発明が解決しようとする問題点
しかしながら、上記のような従来のＬＥＤアレイは、両
側にドライブＩＣを配列しているため、基材１２の巾Ｗ
が大きくなり、装置全体の大形化をまねくという欠点を
有していた。また、ＬＥＤアレイ発光部に制御電極を１
ドツト毎に左右に振りわけて、１ドツト毎に互いに反対
側に位置するドライブＩＣで制御するよう構成されてい
るから、入力される画像データを予め左側駆動発光部用
データと右側駆動発光部用データに分割し、交互に発光
部に入力する必要があった。したがって、ＬＥＤアレイ
ユニットにデータを送るデータ処理回路が複雑化し、大
形化、高価格化をまねくという欠点を有していた。Problems to be Solved by the Invention However, in the conventional LED array as described above, since drive ICs are arranged on both sides, the width W of the base material 12 is
This has the drawback of increasing the size of the device as a whole. In addition, one control electrode is placed in the LED array light emitting part.
Since each dot is distributed to the left and right, and each dot is controlled by the drive IC located on the opposite side, the input image data is divided into data for the left drive light emitting section and data for the right drive light emitting section in advance. It was necessary to divide the data into parts and input them to the light emitting unit alternately. Therefore, the data processing circuit that sends data to the LED array unit becomes complicated, resulting in an increase in size and price.
本発明は、従来技術の上記欠点に鑑みなされたもので、
基材の巾Ｗの小さいＬＥＤアレイユニットテを提供する
ことを目的とする。又本発明はＬＥＤアレイユニットに
データを送るデータ処理回路が、単純で小型、かつ低価
格であるＬＥＤアレイユニツ１−を（２供することを目
的とする。The present invention has been made in view of the above-mentioned drawbacks of the prior art.
An object of the present invention is to provide an LED array unit with a small base material width W. Another object of the present invention is to provide an LED array unit 1-(2) in which the data processing circuit that sends data to the LED array unit is simple, small, and inexpensive.
問題点を解決するための手段
本発明のＬＥＤアレイユニットは、塞材上に列状にＬＥ
Ｄ発光部を配列して設け、かつ各ＬＥＤ発光部に電気的
に接続され各ＬＥＤ発光部を独立に明滅制御するドライ
ブＩＣを有し、ドライブＩＣにＬＥＤアレイユニット外
から電源電流と制御信号を印加する配線手段を有するも
のであるが、ＬＥＤ発光部を基材端部に列状に設け、ド
ライブＩＣ及び配線手段を、列状に配置されたＬＥＤ発
光部の片側のみに配置してなることを特徴とするもので
ある。Means for Solving the Problems The LED array unit of the present invention has LED arrays arranged in rows on a blocking material.
It has a drive IC that is electrically connected to each LED light emitting part and independently controls blinking of each LED light emitting part, and a power supply current and a control signal are supplied to the drive IC from outside the LED array unit. It has wiring means for applying voltage, but the LED light emitting parts are arranged in a row at the end of the base material, and the drive IC and the wiring means are arranged only on one side of the LED light emitting parts arranged in the row. It is characterized by:
作用
本発明のＬＥＤアレイユニットにおいては、画像データ
は、予め左側駆動発光部用のものと右側駆動発光部用の
ものとに分割されることなく、列上に配設されたＬＥＤ
発光部の片側に設けられている各ドライブＩＣに入力さ
れ、その入力された画像データに基づいて各ＬＥＤアレ
イチップの点滅の制御が行われる。Function: In the LED array unit of the present invention, image data is not divided in advance into data for the left drive light emitting section and data for the right drive light emitting section, but instead is divided into data for the left drive light emitting section and right drive light emitting section.
The image data is input to each drive IC provided on one side of the light emitting section, and blinking of each LED array chip is controlled based on the input image data.
実施例
第１図及び第２図は、本発明におけるＬＥＤアレイデツ
プの平面図及び断面図である。ＬＥＤアレイチップは、
Ｐ側電極１、ｎ−ＧａＡＳＰ層２、ｎ−ＧａＡＳ層３、
Ｐ型層４、絶縁層５及び６、及びｎ側電極１３より構成
され、制御電極であるＰ側電極１は一方向にのみ取り出
されるよう構成されている。Embodiment FIGS. 1 and 2 are a plan view and a sectional view of an LED array depth according to the present invention. The LED array chip is
P-side electrode 1, n-GaASP layer 2, n-GaAS layer 3,
It is composed of a P-type layer 4, insulating layers 5 and 6, and an n-side electrode 13, and is configured so that the P-side electrode 1, which is a control electrode, can be taken out only in one direction.
第３図及び第４図は、上記のＬＥＤアレイチップが配置
されたＬＥＤアレイユニットの平面図及び断面図であっ
て、基材１２の端部にＬＥＤアレイチップ７が列状に配
設され、その片方の側にドライブＩＣ８が設置されてい
る。ＬＥＤアレイチップとドライブＩＣとはボンディン
グワイヤ１０によって電気的に接続されており、またド
ライブＩＣ８とプリント基板９ともボンディングワイヤ
１１によって電気的に接続されている。3 and 4 are a plan view and a sectional view of an LED array unit in which the above LED array chips are arranged, in which the LED array chips 7 are arranged in a row at the end of the base material 12, A drive IC 8 is installed on one side thereof. The LED array chip and the drive IC are electrically connected by a bonding wire 10, and the drive IC 8 and the printed circuit board 9 are also electrically connected by a bonding wire 11.
ドライブ用ＩＣ及び配線手段をＬＥＤアレイの片側に設
けたために、ドライブＩＣとＬＥＤアレイチップとの間
のボンディングワイヤ１０の密度は高くなり、ドライブ
ＩＣ及びＬＥＤアレイ双方の取出し電極結線部の占有面
積が広がって接続が困難になるが、これは、第５図に示
すように、ＬＥＤアレイ側のボンディング用取出し電極
１４とドライブＩＣ側のボンディング用取出し電極１５
とを、互いに千鳥状に配列することによって解決するこ
とができる。その結果、従来技術に比して基材中を４０
％削減することができる。Since the drive IC and wiring means are provided on one side of the LED array, the density of the bonding wires 10 between the drive IC and the LED array chip is increased, and the area occupied by the lead-out electrode connection portion of both the drive IC and the LED array is reduced. This spreads out and makes connection difficult, but this is because the bonding lead electrode 14 on the LED array side and the bonding lead electrode 15 on the drive IC side, as shown in FIG.
This can be solved by arranging them in a staggered manner. As a result, compared to the conventional technology, 40%
% can be reduced.
上記の実施例では、ＬＥＤアレイチップとドライブＩＣ
との接続について、ワイヤーボンディング方式による場
合を例にあげて説明したが、接続方法はワイヤーボンデ
ィング方式に限定されるものではなく、他の接続方法を
採用してもよい。例えば、導電性ゴムによる圧着方法あ
るいは、フリップチップ、ビームリード、ＴＡＢ１セラ
ミックキャリヤなど公知の諸方式が利用できる。In the above embodiment, the LED array chip and drive IC
Although the connection with is described using the wire bonding method as an example, the connection method is not limited to the wire bonding method, and other connection methods may be adopted. For example, various known methods such as a pressure bonding method using conductive rubber, a flip chip, a beam lead, a TAB1 ceramic carrier, etc. can be used.
発明の効果
本発明のＬ Ｅ Ｄアレイユニットは、ＬＥＤ発光部を
基材端部に列状に設け、ドライブＩＣ及び配線手段を列
状に配置されたＬＥＤ発光部の片側のみに配置してなる
から、隣接する発光部は同一の側にあるドライブＩＣに
より制御されることになる。したがって、本発明は従来
技術におけるように、画像データを予め左側駆動発光部
用のデータと右側駆動発光部用のデータに分割して、交
互にＬＥＤ発光部に入力する必要がなく、画像データ処
理回路が複雑化することがなく、単純なデータ転送方式
を採用することができる。Effects of the Invention In the LED array unit of the present invention, the LED light emitting parts are arranged in a row at the end of the base material, and the drive IC and the wiring means are arranged only on one side of the LED light emitting parts arranged in the row. Therefore, adjacent light emitting sections are controlled by drive ICs on the same side. Therefore, the present invention eliminates the need to divide image data in advance into data for the left drive light emitting section and data for the right drive light emitting section and inputting them alternately to the LED light emitting sections, as in the prior art, and image data processing. A simple data transfer method can be used without complicating the circuit.
また本発明のＬＥＤアレイユニットは、基材の巾Ｗを従
来技術に比して小さくすることができるから、装置を小
型化できるという利点もある。Furthermore, the LED array unit of the present invention has the advantage that the width W of the base material can be made smaller than that of the conventional technology, so that the device can be made smaller.
第１図は、本発明におけるＬＥＤアレイチップの要部の
平面図、第２図は、第１図のＡＡ線断面図、第３図は、
本発明のＬＥＤアレイユニットの要部の平面図、第４図
は、第３図のＬＥＤアレイユニットの平面図、第５図は
、本発明のＬＥＤアレイユニットにおけるＬＥＤアレイ
チップとドライブＩＣとの接続状態を示す説明図、第６
図は、従来のＬＥＤアレイチップの要部の平面図、第７
図は第６図のＢＢ線断面図、第８図は、従来のＬＥＤア
レイユニットの要部の平面図、第９図は、第８図のＬＥ
Ｄアレイユニツ１−の断面図である。
１ ・Ｐ側電極、２ ・ｎ −Ｇ ａ Ａ Ｓ Ｐ層、
３ ・ｎ−ＧａＡｓ層、４−Ｐ型層、５．６・・・絶縁
層、７・・・ＬＥＤアレイチップ、８・・・ドライブＩ
Ｃ，９・・・プリント基板、１０．１１・・・ポンディ
ングワイヤ、１２・・・基材、１３・・・ｎ側電極、１
４．１５・・・ボンディング用取出電極
特許出願人 富士ゼロックス株式会社代理人
弁理士 渡部 剛
第６図FIG. 1 is a plan view of the main parts of the LED array chip according to the present invention, FIG. 2 is a sectional view taken along line AA in FIG. 1, and FIG.
FIG. 4 is a plan view of the main parts of the LED array unit of the present invention, FIG. 4 is a plan view of the LED array unit of FIG. 3, and FIG. 5 is a connection between the LED array chip and the drive IC in the LED array unit of the present invention. Explanatory diagram showing the state, No. 6
The figure is a plan view of the main parts of a conventional LED array chip.
The figure is a cross-sectional view taken along line BB in Fig. 6, Fig. 8 is a plan view of the main parts of a conventional LED array unit, and Fig. 9 is a sectional view of the LE in Fig. 8.
It is a sectional view of D array unit 1-. 1 ・P side electrode, 2 ・n-Ga AS P layer,
3. n-GaAs layer, 4-P type layer, 5.6... insulating layer, 7... LED array chip, 8... drive I
C, 9... Printed circuit board, 10.11... Bonding wire, 12... Base material, 13... N-side electrode, 1
4.15...Bonding extraction electrode patent applicant Fuji Xerox Co., Ltd. agent
Patent Attorney Tsuyoshi Watanabe Figure 6
Claims (1)
ＥＤ発光部に電気的に接続され各ＬＥＤ発光部を独立に
明滅制御するドライブＩＣを有し、ドライブＩＣにＬＥ
Ｄアレイユニット外から電源電流と制御信号を印加する
配線手段を有するＬＥＤアレイユニットにおいて、基材
端部にＬＥＤ発光部を列状に設け、ドライブＩＣ及び配
線手段を、列状に配置されたＬＥＤ発光部の片側にのみ
配置してなることを特徴とするＬＥＤアレイユニット。LED light emitting parts are arranged in rows on the base material, and each L
It has a drive IC that is electrically connected to the ED light emitting section and independently controls blinking of each LED light emitting section.
D In an LED array unit having a wiring means for applying a power supply current and a control signal from outside the array unit, LED light emitting parts are provided in a row at the end of the base material, and a drive IC and a wiring means are connected to the LEDs arranged in a row. An LED array unit characterized by being arranged only on one side of a light emitting part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61086013A JPS62242558A (en) | 1986-04-16 | 1986-04-16 | Light-emitting diode array unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61086013A JPS62242558A (en) | 1986-04-16 | 1986-04-16 | Light-emitting diode array unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62242558A true JPS62242558A (en) | 1987-10-23 |
Family
ID=13874793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61086013A Pending JPS62242558A (en) | 1986-04-16 | 1986-04-16 | Light-emitting diode array unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62242558A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02277274A (en) * | 1989-04-18 | 1990-11-13 | Sharp Corp | Led indicator |
| US5734406A (en) * | 1993-04-12 | 1998-03-31 | Oki Electric Industry Co., Ltd. | Driver IC, a print head having the driver IC and a printer including the print head |
-
1986
- 1986-04-16 JP JP61086013A patent/JPS62242558A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02277274A (en) * | 1989-04-18 | 1990-11-13 | Sharp Corp | Led indicator |
| US5734406A (en) * | 1993-04-12 | 1998-03-31 | Oki Electric Industry Co., Ltd. | Driver IC, a print head having the driver IC and a printer including the print head |
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