JPS62250650A - 電子部品の実装構造 - Google Patents

電子部品の実装構造

Info

Publication number
JPS62250650A
JPS62250650A JP61095583A JP9558386A JPS62250650A JP S62250650 A JPS62250650 A JP S62250650A JP 61095583 A JP61095583 A JP 61095583A JP 9558386 A JP9558386 A JP 9558386A JP S62250650 A JPS62250650 A JP S62250650A
Authority
JP
Japan
Prior art keywords
tabic
electronic component
ceramic substrate
stress
component part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61095583A
Other languages
English (en)
Japanese (ja)
Other versions
JPH053738B2 (2
Inventor
Michinori Shiina
椎名　道則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61095583A priority Critical patent/JPS62250650A/ja
Publication of JPS62250650A publication Critical patent/JPS62250650A/ja
Publication of JPH053738B2 publication Critical patent/JPH053738B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/301—Assembling printed circuits with electric components, e.g. with resistors by means of a mounting structure

Landscapes

  • Wire Bonding (AREA)
JP61095583A 1986-04-23 1986-04-23 電子部品の実装構造 Granted JPS62250650A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61095583A JPS62250650A (ja) 1986-04-23 1986-04-23 電子部品の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61095583A JPS62250650A (ja) 1986-04-23 1986-04-23 電子部品の実装構造

Publications (2)

Publication Number Publication Date
JPS62250650A true JPS62250650A (ja) 1987-10-31
JPH053738B2 JPH053738B2 (2) 1993-01-18

Family

ID=14141606

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61095583A Granted JPS62250650A (ja) 1986-04-23 1986-04-23 電子部品の実装構造

Country Status (1)

Country Link
JP (1) JPS62250650A (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5264726A (en) * 1989-07-21 1993-11-23 Nec Corporation Chip-carrier
US7601039B2 (en) 1993-11-16 2009-10-13 Formfactor, Inc. Microelectronic contact structure and method of making same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5810841A (ja) * 1981-07-13 1983-01-21 Mitsubishi Electric Corp 樹脂封止形半導体装置
JPS60206314A (ja) * 1984-03-30 1985-10-17 Matsushita Electric Ind Co Ltd 梯子形セラミツクフイルタ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5810841A (ja) * 1981-07-13 1983-01-21 Mitsubishi Electric Corp 樹脂封止形半導体装置
JPS60206314A (ja) * 1984-03-30 1985-10-17 Matsushita Electric Ind Co Ltd 梯子形セラミツクフイルタ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5264726A (en) * 1989-07-21 1993-11-23 Nec Corporation Chip-carrier
US7601039B2 (en) 1993-11-16 2009-10-13 Formfactor, Inc. Microelectronic contact structure and method of making same

Also Published As

Publication number Publication date
JPH053738B2 (2) 1993-01-18

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