JPS6226830A - Chip bonding equipment - Google Patents

Abstract

PURPOSE:To enable positioning and connection with high accuracy by a method wherein a circuit forming surface of semiconductor chip and a substrate are positioned to be opposed to each other and then position detectors for respective semiconductor chip and substrate as well as a positioner to correct position deflection are provided. CONSTITUTION:A semiconductor chip 16 on a base 22 is positioned by a position detector 34 while the position deflection from the reference position is corrected by a positioner 26. On the other hand, a substrate 30 is positioned by another position detector 35 while the position deflection from the position detector 35 is detected and then the preliminarily specified distance B between the position detectors 34 and 35 is corrected to position the semiconductor chip 16 on the base 22 and the substrate 30 opposing to each other. In such an opposing position, the base 22 is lifted in the arrow A direction to bring a lead part 31 of the substrate 30 into contact with a pad part 16A of semiconductor chip 16. Through these procedures, the position detectors 34, 35 can position a semiconductor chip and a substrate lead part with high precision to be connected with each other.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a chip bonding apparatus for directly connecting pads of a semiconductor chip and leads of a circuit board.

Conventional technology chip bonding equipment is advantageous in terms of productivity and reliability of connection strength, and is about to be put into practical use, but because alignment is difficult, it is difficult to target transparent substrates or Since the target is a semiconductor bullet with a large pad spacing, there is a need for a device that can handle ceramic substrates and semiconductor chips with a small pad spacing.

An example of a conventional chip bonding apparatus will be described below with reference to the drawings.

FIG. 4 shows the configuration of a conventional chip bonding apparatus. In the figure, semiconductor chips 1 are arranged on a tray 2 with their circuit surfaces facing down, and positioned at arbitrary positions by a positioning device 3. Reference numerals 4 and 6 denote suction collets, which are attached to the transfer arm 6 so as to be slidable in the vertical direction, and are pressed downward by the force of a spring 7. 8 is a positioning device for the substrate 9, and the substrate 9 is fixed by a substrate holder 1o. 11 is a circuit pattern formed on the substrate 9. 12 shows a trajectory along which the suction collet 5 moves by the transfer arm 6. Reference numeral 13 denotes an intermediate regulating stand, on which regulating claws 14 and 15 are provided.

The operation of the chip bonding apparatus configured as described above will be described below.

The semiconductor chips 1 arranged on the tray 2 with their circuit surfaces facing down are positioned directly below the center of the suction collet 4 by the positioning device 3. Next, the suction collet 4 is lowered by the lowering of the transfer arm 6, and the semiconductor chip 1
The descent stops at the position where the tip of the suction collet 4 touches the back surface of the collet. Next, the semiconductor chip 1 is suctioned by vacuuming the suction hole formed on the lower surface of the suction collet. At the same time, the suction collet 5 performs the same operation as the suction collet 4 and suctions the semiconductor chip 1 placed on the intermediate adjustment table 13 and having its outer circumference regulated.

Next, the transfer arm 6 moves along a trajectory 12, and the suction collet 4 is positioned on the intermediate regulating table 13, and the suction collet 5 is positioned on the substrate 9. At this time, the substrate 9 is positioned by the positioning device 8 so that the part to be joined is located on the center line of the suction plet 6, and then the transfer arm 6 is lowered. At this time, the semiconductor chip 1 attracted by the attraction collet 5 is joined to the leads 11 by the force of the spring 7. Each collet 4, 5 then releases the vacuum and rises as per trajectory 12. The semiconductor chip 1 on the intermediate regulating stand 13 is the regulating claw 1
The position of the outer circumference is regulated by 4.15. The above operation completes one cycle of bonding.

Problems to be Solved by the Invention However, in the above-described configuration, it is necessary to arrange and store the elements configured in a phenolic manner on a tray after separating them, which causes defects such as scratches and cracks on the semiconductor chip. It is also disadvantageous in terms of cost. The position of a semiconductor chip is adjusted based on the outer periphery, so when dividing each element formed on a wafer using a dicing machine, etc., if there is a misalignment between the circuit pattern and the cutting part, the pad part of the semiconductor chip will be adjusted. Therefore, accurate position adjustment cannot be performed. Furthermore, when bonding is performed by such a method, the bonding strength is weak because it is only applied by the spring pressure, and separate processes such as ultrasonic pressure bonding and heat pressure bonding are required. Although it is possible to preheat on an intermediate standard table, the temperature drops during transfer, dimensional changes occur due to temperature changes, and it is difficult to press-bond at a predetermined temperature. Furthermore, since the semiconductor chips are held with the circuit forming surface facing downward in the tray and on the intermediate holder, there is a problem in that there is a high probability that defects will occur due to scratches or the like occurring on the circuit forming surface.

In view of the above-mentioned drawbacks, the present invention provides a chip bonding device that enables highly accurate alignment of the bed portion of the chip and the lead portion of the board without repacking the semiconductor chip into a tray, and also provides stable connection strength. It is something to do.

Means for Solving the Problems In order to solve the above-mentioned problems, the chip bonding apparatus of the present invention includes a transfer means for separating and transferring semiconductor chips arranged in a plane with the circuit forming surface as the upper surface, and A mounting table on which a semiconductor chip is placed, a first position detecting means for detecting the position of the semiconductor chip, and a second position detecting means for detecting the position of a circuit board placed opposite to the semiconductor chip on the mounting table. The semiconductor device includes a position detection device, first and second positioning devices that respectively position the chip and the substrate, and connection means that connects the semiconductor chip and the substrate circuit.

By arranging the semiconductor chip with the circuit forming surface facing upward, defects that occur on the circuit surface are prevented, and by aligning the pad part of the semiconductor chip and the lead part of the circuit board after position detection, it is possible to position the semiconductor chip with high precision. In addition to making it possible to match,
Ultrasonic bonding.

By providing a connection means such as thermocompression bonding, it becomes possible to obtain stable connection strength.

EXAMPLE Hereinafter, a chip bonding apparatus according to an example of the present invention will be described with reference to the drawings.

FIG. 1 shows the basic configuration of the present invention, and FIG. 2 shows a state in which the device 12 of the present invention is positioned. In FIGS. 1 and 2, 16 is a semiconductor chip, and the back surface of the circuit-forming surface is held by an adhesive film 17. A ring 18 holds the adhesive film 17, and is positioned at an arbitrary position by a positioning device 19. 2o is a suction collet, which has a vacuum hole 21 at its tip. 22 is a mounting table;
Heater 2 for heating the semiconductor chip 16 at the tip
4 is embedded. Furthermore, it has a vacuum hole 24 for securely holding the semiconductor chip 1e. A guide 25 holds the mounting table 22 so as to be slidable in the direction of arrow A. Reference numeral 26 denotes a positioning device for positioning the mounting table 22 at an arbitrary position.

27 is a transfer arm that transfers 20 suction collets along a trajectory 28. 29 is a spring that holds the collet 2o downward. 3o is a circuit board, on which leads 31, which serve as bonding parts, are formed.

32 is a positioning device that positions the substrate 30 at an arbitrary position, and the substrate 30 and the positioning device 32 are fixed by a substrate guide 33. Reference numerals 34 and 35 indicate position detection devices for detecting the positions of the semiconductor chip 16 and the substrate 3o on the mounting table, respectively.

The operation of the chip bonding apparatus configured as described above will be described below.

The back side of the semiconductor chip 16 is held on the adhesive film sheet 1, and the circuit pattern formed on the wafer is separated and expanded into each element, and the positioning device 19 positions the semiconductor chip 16 on the center line of the suction collet 2o. It is positioned so that the center of the semiconductor chip 16 is located. Next, the transfer arm 27 descends as shown in the trajectory 28, and the collet 2
0 and the semiconductor chip 16 are in contact with each other in the vacuum hole 2.
Vacuum. When the suction is confirmed, the transfer arm 27 transfers the semiconductor chip 16 along a trajectory 28, and with the semiconductor chip 16 placed on the mounting table 22, the adsorption cholera) 20
release the vacuum. After releasing the vacuum, the transfer arm 2a returns to the position shown in FIG.

The back surface of the semiconductor chip 1θ on the mounting table 22 is evacuated through the vacuum hole 24, and the semiconductor chip 16 is held on the mounting table 22. Heating means (not shown) buried in the mounting table 22
As a result, the semiconductor chip 1e is in a heated state. The position of the semiconductor chip 16 on the mounting table 22 is detected by the position detection device 34, and the amount of positional deviation from the reference position is corrected by the positioning device 26. On the other hand, the position of the substrate 3o is detected by the position detection device 35.
Detects the positional deviation of the board 3Q and the position detection device 3
By correcting the predetermined distance B of 4 and 35, the semiconductor chip 16 on the mounting table 22 and the substrate are aligned so as to face each other as shown in FIG. The mounting table rises in the direction of arrow A in the opposed state, and joins the lead portion 31 of the substrate 30 and the pad portion 16A of the semiconductor chip 16 as shown in FIG.

The pressing force at this time varies depending on the chip size and the number of pads, but is about 10047' to 50o1, and the heating temperature is 15
0' (: ~2o○C.) With the above operation, one process is completed and the connection is terminated.

As described above, according to this embodiment, by arranging the substrate and the semiconductor chips arranged in the form of a wafer so as to face each other, there is no need to repack the semiconductor chips into the tray, thereby eliminating the need for the step of refilling the tray. Also, it is possible to prevent defects (cracks, chips, scratches, etc.) that occur during refilling. Since the position of the substrate and the semiconductor chip is detected and corrected by the respective position detection devices, the mounting table does not require the conventional position adjustment claws on the outer periphery, making it possible to prevent defects that occur when adjusting the outer periphery. This makes it possible to align and connect the semiconductor chip and the substrate lead portion with high precision. Furthermore, since the heater and the embedded mounting table serve as direct bonding tools, it is possible to stably control the heating temperature of the semiconductor chip.

In the above embodiments, a heater was used as the connection means, but an ultrasonic transducer or both may be used in combination. It is also possible to arrange the semiconductor chips in a row on a tray with the circuit forming surface facing upward.

Effects of the Invention As described above, the present invention arranges a circuit forming surface of a semiconductor chip and a substrate so as to face each other, provides a position detection device for each of the semiconductor chip and the substrate, and includes a positioning device for correcting the amount of positional deviation. By providing this, the process of refilling the tray is not required compared to the conventional process, and it is possible to prevent defects related to that process.Furthermore, it is possible to detect the position of the semiconductor chip and the board. , it becomes possible to perform highly accurate alignment and connection. Furthermore, since the mounting table is directly used as a bonding tool, connection means such as heating and ultrasonic vibration can be easily added.

[Brief explanation of the drawing]

A front view showing the state of the device after alignment; FIG. 3 is a front view of main parts showing a state where the lead part and the semiconductor chip are connected;
FIG. 4 is a partially sectional front view showing the configuration of a conventional example. 16... Semiconductor chip, 2o... Adsorption collet, 22... Placement table, 3o...
Board, 34.35...Position detection device, 26.3
2...Positioning device. Name of agent: Patent attorney Toshio Nakao and 1 other person34
, 35--in, ta'out 11 Fig. 3 Fig. 4 E-+ Cicada rising 9 ph 2--Ll, Iq--Ikibayashi t3--- y M regulation officer

Claims (1)

[Claims] a transfer means for separating and transferring semiconductor chips arranged in a planar manner; a mounting table for placing the transferred semiconductor chips; a first position detection device for detecting the position of the semiconductor chips on the mounting table; a second position detection device that detects the position of a circuit board placed to face the semiconductor chip on the writing table; first and second positioning devices that respectively position the placement table and the circuit board; A chip bonding apparatus comprising a connecting means for connecting the semiconductor chip and the circuit board after bonding.