JPS622799A - Ultrasonic probe - Google Patents
Ultrasonic probeInfo
- Publication number
- JPS622799A JPS622799A JP60140557A JP14055785A JPS622799A JP S622799 A JPS622799 A JP S622799A JP 60140557 A JP60140557 A JP 60140557A JP 14055785 A JP14055785 A JP 14055785A JP S622799 A JPS622799 A JP S622799A
- Authority
- JP
- Japan
- Prior art keywords
- ultrasonic
- printing wiring
- ultrasonic vibrator
- ultrasonic probe
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、電気的に駆動して媒体内へ超音波を発生させ
る超音波プローブに関し、特に超音波振動子を格子状(
或いは行列状)に複数個配列した超音波プローブに関す
る。Detailed Description of the Invention [Technical Field of the Invention] The present invention relates to an ultrasonic probe that is electrically driven to generate ultrasonic waves into a medium.
The present invention relates to a plurality of ultrasonic probes arranged in a matrix (or in a matrix).
超音波診断装置の超音波プローブにおいては、より鮮明
な超音波像を得る為に様々な試みが行なわれている。中
でも前記超音波振動子は高分解能化を図るため、例えば
この超音波振動子を2次元的に配列したものがある。こ
の−例として第4図はその外観を斜視図として示したも
のである。同図において、行列状に所定の間隙を保って
配列配置されて、その横と縦がそれぞれPlとP2の大
きさを有する各超音波振動子11aは、この下面に設け
られた第1電極12側が導電性接着剤19により接着さ
れて印刷配線された基板(以下、プリント配線板と称す
る)14を介して超音波吸収体20に接着されて固定さ
れている。一方、各超音波振動子11aの上面の第2電
極13には、導電性接着剤或いは半田等により金属薄板
11が接続されている。Various attempts have been made to obtain clearer ultrasound images in ultrasound probes for ultrasound diagnostic apparatuses. Among these, in order to improve the resolution of the ultrasonic transducers, there are, for example, those in which ultrasonic transducers are arranged two-dimensionally. As an example of this, FIG. 4 shows its appearance in a perspective view. In the same figure, each ultrasonic transducer 11a is arranged in a matrix with a predetermined gap, and has horizontal and vertical sizes of Pl and P2, respectively. The ultrasonic absorber 20 is bonded and fixed to the ultrasonic absorber 20 via a substrate (hereinafter referred to as a printed wiring board) 14 whose side is bonded with a conductive adhesive 19 and has printed wiring. On the other hand, a thin metal plate 11 is connected to the second electrode 13 on the upper surface of each ultrasonic transducer 11a using a conductive adhesive, solder, or the like.
このような超音波プローブにおいては、同図に示すよう
に電極は水平方向に引き出した状態に設けられているた
めに、例えば前記超音波振動子11aが、より細分化さ
れて且つ素子数が増大すると同図に示すように水平方向
に突出している電極の数が増大し、この増大に伴なって
前記プローブ幅が大きくなり、又プリント配線板に印刷
配線されている配線パターンも複雑化して、その製作。In such an ultrasonic probe, since the electrodes are provided in a horizontally extended state as shown in the figure, for example, the ultrasonic transducer 11a is further segmented and the number of elements is increased. Then, as shown in the figure, the number of electrodes protruding horizontally increases, and with this increase, the width of the probe increases, and the wiring pattern printed on the printed wiring board becomes more complex. Its production.
組立が困難になるという問題があった。There was a problem that assembly was difficult.
本発明は上記事情に鑑みてなされたものであり、超音波
プローブの幅寸法を大きくする事なく容易に電極を設け
る事のできる超音波プローブの提供を目的とする。The present invention has been made in view of the above circumstances, and aims to provide an ultrasonic probe in which electrodes can be easily provided without increasing the width of the ultrasonic probe.
上記目的を達成する為の本発明の概要は、水平な面上に
行列状に複数設けられた超音波振動子を有する超音波プ
ローブにおいて、前記各行又は各列に配置された複数の
超音波振動子の下面に前記水平面と交差する板状のプリ
ント配線板をそれぞれ前記各行又は各列に対応させて設
け、この各プリント配線板の間にバッキング材を積層し
て設けた事を特徴とするものである。The outline of the present invention for achieving the above object is to provide an ultrasonic probe having a plurality of ultrasonic transducers arranged in rows and columns on a horizontal plane, in which a plurality of ultrasonic vibrations are arranged in each row or column. A plate-shaped printed wiring board intersecting with the horizontal plane is provided on the lower surface of the child in correspondence with each row or column, and a backing material is laminated between the printed wiring boards. .
〔発明の実施例〕
以下、本発明の超音波プローブの一実施例について図面
を参照しながら説明する。[Embodiment of the Invention] Hereinafter, an embodiment of the ultrasonic probe of the present invention will be described with reference to the drawings.
第1図は本発明の超音波プローブの一実施例の外観斜視
図である。同図において超音波プローブは、水平面上に
行列状に複数配置された超音波振動子1と、この各行又
は各列に対応して設けられた前記複数の超音波振動子1
の下面にこの超音波振動子1を配置した水平面に交差す
るように導電性接着剤4を介してプリント配線板3が接
着固定されている。このプリント配線板3は各行又は各
列に対応して配置され、超音波振動子lの行方向(図中
矢印A方向)若しくは列方向(図中矢印B方向)の寸法
とほぼ同寸法の幅を有するものである。このように設け
られたプリント配線板3の間であって、前記超音波振動
子lの下面にはバッキング材2が設けられて、超音波振
動子lから発生する超音波を吸収できるようになってい
る。FIG. 1 is an external perspective view of an embodiment of the ultrasonic probe of the present invention. In the figure, the ultrasonic probe includes a plurality of ultrasonic transducers 1 arranged in a matrix on a horizontal plane, and a plurality of ultrasonic transducers 1 provided corresponding to each row or column.
A printed wiring board 3 is adhesively fixed to the lower surface of the ultrasonic transducer 1 through a conductive adhesive 4 so as to intersect the horizontal plane on which the ultrasonic transducer 1 is arranged. This printed wiring board 3 is arranged corresponding to each row or each column, and has a width that is approximately the same as the dimension of the ultrasonic transducer l in the row direction (arrow A direction in the figure) or column direction (arrow B direction in the figure). It has the following. A backing material 2 is provided on the lower surface of the ultrasonic transducer l between the printed wiring boards 3 provided in this way, so that it can absorb the ultrasonic waves generated from the ultrasonic transducer l. ing.
以下に、前記第1図に示した本発明の一実施例について
、この超音波プローブを製造する工程に従って説明する
。An embodiment of the present invention shown in FIG. 1 will be described below according to the steps for manufacturing this ultrasonic probe.
第2図は第1図に示す超音波プローブの一実施例の製造
工程におけるものの分解した斜視図である。最初にバッ
キング材2例えばゴム材と、プリント配線板3を積層で
きるようにしたものを用意する。このバッキング材2と
プリント配線板3は、例えば前記列方向(第1図に示す
矢印B方向)に積層して設けられ、後の工程においてこ
の上面に積層して設ける超音波振動子lの形成に伴って
カッティングされる為に、積層される各プリント配線板
3と各バッキング材2には、位置決めの為に穴Aを形成
し、例えば棒状部材を挿入して位置決めが行なえるよう
になっている。尚、位置決めの際に前記バッキング材2
と各プリント配線板3の接着を行うようになっている。FIG. 2 is an exploded perspective view of one embodiment of the ultrasonic probe shown in FIG. 1 during the manufacturing process. First, a backing material 2, such as a rubber material, and a material on which the printed wiring board 3 can be laminated are prepared. The backing material 2 and the printed wiring board 3 are laminated, for example, in the column direction (direction of arrow B shown in FIG. 1), and in a later step, an ultrasonic transducer l is formed by laminating on the upper surface of the backing material 2 and the printed wiring board 3. Since each printed wiring board 3 and each backing material 2 to be laminated are cut according to the process, a hole A is formed in each of the printed wiring boards 3 and each backing material 2 for positioning, so that positioning can be performed by inserting, for example, a rod-shaped member. There is. In addition, when positioning, the backing material 2
and each printed wiring board 3 is bonded.
次に、このバッキング材2とプリント配線板3が前記列
方向に積層されたものの上面に導電性の接着剤を塗布す
る。Next, a conductive adhesive is applied to the upper surface of the backing material 2 and printed wiring board 3 stacked in the column direction.
この導電性の接着剤の塗布された面に同図に示す超音波
振動子1を積層して接着固定する。この超音波振動子1
は例えば圧電セラミックであり、この圧電セラミックの
上下両面に、例えば金属薄板あるいは金属を蒸着した金
属蒸着膜の電極1aを設けたものである。このように組
立てられた後、超音波振動子lを所定の寸法に第1図に
示す行列方向にカッティングして第1図に示す超音波プ
ローブを構成する。The ultrasonic transducer 1 shown in the figure is laminated on the surface coated with the conductive adhesive and fixed by adhesive. This ultrasonic vibrator 1
is a piezoelectric ceramic, for example, and electrodes 1a of, for example, a metal thin plate or a metal vapor-deposited film are provided on the upper and lower surfaces of the piezoelectric ceramic. After being assembled in this manner, the ultrasonic transducer 1 is cut into predetermined dimensions in the matrix direction shown in FIG. 1 to construct the ultrasonic probe shown in FIG.
第3図は本発明の超音波プローブの第2実施例について
の分解した斜視図である。本実施例においても製造工程
に従って以下に説明をする。FIG. 3 is an exploded perspective view of a second embodiment of the ultrasonic probe of the present invention. This example will also be explained below according to the manufacturing process.
両面に電極1aを積層して貼着して設けた超音波振動子
1に超音波振動子ガイド5を、例えば接着剤により貼着
固定する。この際、この超音波振動子ガイド5又は超音
波振動子lに振動が影響を及ぼさないようにする為に、
前記電極1aは図示するように超音波振動子ガイドと貼
着する面には設けられておらず、その部分の超音波振動
子は加振しないようになっている。次にプリント配線板
3の下面に前述した導電性接着剤4を塗布し、前記した
超音波振動子ガイド5の内側面に設けである溝5aにプ
リント配線板3の側部を嵌合しつつ下方に移動させ、前
記超音波振動子1の上面に設けた電極1aと接着固定す
る。次に超音波振動子ガイド5と超音波振動子1が貼着
されて形成したものに、例えば液状の注型用バンキング
材を流し込み所定の時間をかけて硬化させる。その後、
第2図にて説明したように超音波振動子1をカッティン
グして組み立てる。An ultrasonic transducer guide 5 is adhered and fixed to the ultrasonic transducer 1, which is provided by laminating and adhering electrodes 1a on both sides, using an adhesive, for example. At this time, in order to prevent the vibration from affecting the ultrasonic transducer guide 5 or the ultrasonic transducer l,
As shown in the figure, the electrode 1a is not provided on the surface to be attached to the ultrasonic transducer guide, so that the ultrasonic transducer in that part is not vibrated. Next, the conductive adhesive 4 described above is applied to the lower surface of the printed wiring board 3, and the sides of the printed wiring board 3 are fitted into the grooves 5a provided on the inner surface of the ultrasonic transducer guide 5 described above. It is moved downward and adhesively fixed to the electrode 1a provided on the upper surface of the ultrasonic transducer 1. Next, a liquid casting banking material, for example, is poured into the structure formed by pasting the ultrasonic transducer guide 5 and the ultrasonic transducer 1, and is hardened over a predetermined period of time. after that,
As explained in FIG. 2, the ultrasonic transducer 1 is cut and assembled.
又前述した本実施例の他に、例えば最初に超音波振動子
ガイド5とプリント配線板3を組立て、次に注型用バッ
キング材を注入して硬化させた後プリント配線板3の下
面に導電性接着剤4を塗布して超音波振動子1と貼着固
定してもよい。尚、前述した実施例のいずれにおいても
、後工程においてアース線の引き出し、音響整合層及び
音響レンズ(いずれも図示しない)を設けるようになっ
ている。In addition to the present embodiment described above, for example, first the ultrasonic transducer guide 5 and the printed wiring board 3 are assembled, then a backing material for casting is injected and cured, and then a conductive layer is placed on the lower surface of the printed wiring board 3. The ultrasonic transducer 1 may be fixed to the ultrasonic transducer 1 by applying an adhesive 4. In any of the embodiments described above, a ground wire lead-out, an acoustic matching layer, and an acoustic lens (none of which are shown) are provided in the subsequent process.
本発明は前記実施例に限定されるものではなく本発明の
要旨の範囲内において種々の変形例を包収上詳述したよ
うに本発明によると、超音波プローブの各超音波振動子
の数を増加させて高分解能化しても、この超音波プロー
ブの幅寸法を増加させる事が無く、しかもこの超音波振
動子の数の増加に伴なう配線の複雑化を防止する事が可
能で且つコンパクトな超音波プローブを提供する事が出
来る。The present invention is not limited to the embodiments described above, but includes various modifications within the scope of the invention.According to the present invention, the number of each ultrasonic transducer of the ultrasonic probe Even if the resolution is increased by increasing the number of ultrasonic transducers, the width of the ultrasonic probe does not need to be increased, and it is possible to prevent the wiring from becoming complicated due to an increase in the number of ultrasonic transducers. A compact ultrasonic probe can be provided.
第1図は本発明の超音波プローブの組立斜視図1、
第2図は第1図に示す超音波プローブの組立説明のため
の分解斜視図、第3図は本発明の超音波プローブの第2
実施例の組立説明のための分解斜視図、第4図は従来の
超音波プローブの一例を示す外観斜視図である。
1・・・超音波振動子、2・・・バッキング材、3・・
・プリント配線板。
代理人 弁理士 則 近 憲 佑(ほか1名)への
OQ
第4図
旧 18FIG. 1 is an assembled perspective view 1 of the ultrasonic probe of the present invention.
2 is an exploded perspective view for explaining the assembly of the ultrasonic probe shown in FIG. 1, and FIG. 3 is an exploded perspective view of the ultrasonic probe of the present invention.
FIG. 4 is an exploded perspective view for explaining the assembly of the embodiment, and FIG. 4 is an external perspective view showing an example of a conventional ultrasonic probe. 1... Ultrasonic vibrator, 2... Backing material, 3...
・Printed wiring board. OQ to representative patent attorney Kensuke Chika (and one other person) Figure 4 old 18
Claims (1)
有する超音波プローブにおいて、前記各行又は各列に配
置された複数の超音波振動子の下面に前記水平面と交差
する板状のプリント配線板をそれぞれ前記各行又は各列
に対応させて設け、この各プリント配線板の間にバッキ
ング材を積層して設けた事を特徴とする超音波プローブ
。In an ultrasonic probe having a plurality of ultrasonic transducers arranged in a matrix on a horizontal plane, a plate-shaped print intersecting the horizontal plane on the lower surface of the plurality of ultrasonic transducers arranged in each row or each column. An ultrasonic probe characterized in that wiring boards are provided corresponding to each of the rows or columns, and a backing material is laminated between the printed wiring boards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60140557A JPH07108040B2 (en) | 1985-06-28 | 1985-06-28 | Ultrasonic probe and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60140557A JPH07108040B2 (en) | 1985-06-28 | 1985-06-28 | Ultrasonic probe and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS622799A true JPS622799A (en) | 1987-01-08 |
| JPH07108040B2 JPH07108040B2 (en) | 1995-11-15 |
Family
ID=15271448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60140557A Expired - Lifetime JPH07108040B2 (en) | 1985-06-28 | 1985-06-28 | Ultrasonic probe and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07108040B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63146699A (en) * | 1986-12-10 | 1988-06-18 | Yokogawa Medical Syst Ltd | Manufacture of two-dimension array transducer |
| DE19743341C1 (en) * | 1997-09-30 | 1999-03-11 | Siemens Ag | Piezoelectric transducer device for ultrasound apparatus for ultrasound medical diagnosis or materials testing |
| JP2008079034A (en) * | 2006-09-21 | 2008-04-03 | Aloka Co Ltd | Ultrasonic probe and manufacturing method thereof |
| US7654961B2 (en) | 2004-10-15 | 2010-02-02 | Kabushiki Kaisha Toshiba | Ultrasonic probe |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5732199A (en) * | 1980-06-25 | 1982-02-20 | Commissariat Energie Atomique | Method of producing multiplex element ultrasonic probe |
-
1985
- 1985-06-28 JP JP60140557A patent/JPH07108040B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5732199A (en) * | 1980-06-25 | 1982-02-20 | Commissariat Energie Atomique | Method of producing multiplex element ultrasonic probe |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63146699A (en) * | 1986-12-10 | 1988-06-18 | Yokogawa Medical Syst Ltd | Manufacture of two-dimension array transducer |
| DE19743341C1 (en) * | 1997-09-30 | 1999-03-11 | Siemens Ag | Piezoelectric transducer device for ultrasound apparatus for ultrasound medical diagnosis or materials testing |
| US7654961B2 (en) | 2004-10-15 | 2010-02-02 | Kabushiki Kaisha Toshiba | Ultrasonic probe |
| JP2008079034A (en) * | 2006-09-21 | 2008-04-03 | Aloka Co Ltd | Ultrasonic probe and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH07108040B2 (en) | 1995-11-15 |
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