JPS6230403Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a power supply device with a static cooling device.

Conventionally, air cooling has been mainly used as a cooling method for telecommunication equipment from the viewpoints of reliability, economy, and maintainability. In power supplies for telecommunications equipment, semiconductor parts are cooled by natural air using a heat sink, and transformers and blocked wires are cooled by natural air from the iron core and wire sheath, or when the power loss is large. Forced air cooling using a blower is applied. in this case,
In order to improve the air circulation within the device, it is necessary to provide a sufficiently large space as an air flow path, and for this reason each component must be placed at intervals of a certain size or more. This results in an increase in device volume, and the larger the amount of heat generated, the larger the volume. In particular, natural air cooling systems generate convection through the buoyancy effect caused by the rise in temperature of the air, so the ventilation force is less than a fraction of that of forced air cooling systems that force convection using a blower. Therefore, in order to reduce the air resistance of the ventilation passage and ensure a sufficient air flow rate, a large space volume must be provided, and there is a significant tendency for the device to become even larger. In addition, the heat generated within the parts,
The heat dissipation fins are used to effectively dissipate heat from the component surface to the air inside the device. No matter what material (copper, aluminum, etc.) the heat dissipation fins have, the larger the surface area, the greater the heat dissipation performance, thus minimizing the temperature rise inside the component. In order to do this, it is necessary to use heat dissipation fins with a sufficiently large surface area, which also results in an increase in the internal space volume of the device.

On the other hand, according to the forced air cooling method using a blower,
Due to the increase in ventilation force and the promotion of heat dissipation from the component surface, the space inside the device can be reduced compared to natural air cooling, and the device can therefore be made more compact. In addition, the power required to drive the blower increases approximately in proportion to the cube of the air flow rate supplied per unit time, and the noise generated by the blower is approximately equal to the amount of air supplied. It increases in proportion to the fifth power of the flow rate. In addition, the lifespan of the blower used is usually 3 to 5 years, which is significantly shorter than the required lifespan of the telecommunications equipment to be cooled (usually 20 years or more), and it is difficult to replace the blower regularly or break down. A body protection mechanism is required in case.

As described above, while the forced air cooling system has the advantage of having a large cooling effect, it inevitably has various drawbacks when applied to telecommunications equipment.

In addition, in stationary power converters, a fluorocarbon boiling cooling method is applied, which is effective in cases of high-density heat generation, but requires a highly airtight structure.
Due to implementation problems such as the need for a dedicated heat exchange device, it has not been widely used in general applications other than outdoor rectifiers for electric railways, for example.

Let's examine the problems with conventional cooling structures for rectifiers as an example of power supplies for telecommunications equipment.

Conventionally, parts mounting parts, heat dissipation parts (fins, etc.), and cooling fluid (air) passage parts coexist inside the device. The design of the passageway is mutually constrained, making it difficult to optimally design each part, resulting in excessive wiring length in the electrical part and an increase in space volume in the heat dissipation part, resulting in power loss. This led to an increase in the size of the equipment. In addition, as is well known, power loss in transformers and blocked coils is
Copper loss (joule loss) and iron loss (eddy current loss)
The heat is radiated from the wire coating surface and the iron core surface to the air inside the device, respectively. In this case, the silicon steel plate that makes up the iron core has a thermal conductivity of approximately
Since the iron core is small at 20W/m℃, its effectiveness as a heat dissipator from heat sources including wires is small, and a heat dissipation method different from that from semiconductor components and resistors is required.

Despite this, in conventional rectifiers, transformers, blockage wires, semiconductors, and resistors are mixed in the device without taking into account the differences in heat dissipation characteristics. Since each of the heat sinks is arranged in such a manner that they are each cooled by natural air cooling, this has been a cause of preventing the volume of the heat radiation space from being reduced.
This will be explained with reference to FIG.

The drawings omit support members for the parts.

In the figure, semiconductor components 2, a transformer 3, a blocking wire 4,
Most of the heat generated from the resistors 5 is radiated from the surfaces of these parts to the air inside the housing 1, and the heated air flows through the voids existing inside the housing 1 and is caused by convection. The body 1 moves upward due to
It flows out from the opening 9 provided at the top. 8 is a non-heat generating part. Note that this air flows in through air holes located at various locations in the lower part of the body 1. At this time, as shown in the figure, in order to improve heat dissipation from each component (through heat dissipation fins, etc.) and circulation of cooling air, a significantly larger surplus space is provided around each component compared to the individual components. In addition, as shown in this figure, the transformer core, blockage wire rings, semiconductor components, and resistors with different heat dissipation performance are mixed irregularly, so for example, above the transformer core, An excessively large space S1 is provided, and the efficiency of component mounting is extremely poor.

Also, when considering components that are easily affected by temperature, such as capacitors, in conventional heat dissipation configurations, almost all of the heat from the heat generating components is transferred to the air inside the device, so the effect of the temperature rise on capacitors etc. This also greatly restricts the arrangement of parts within the device, making it difficult to downsize the device.

Furthermore, because of the need for good circulation of the heated air, it was not possible to make the device housing a sealed structure, and it was not possible to shield the noise generated within the device.

In order to eliminate the conventional drawbacks, the present invention provides a partition plate inside the power supply device to divide the upper and lower partitions so that gas does not flow between them, and the upper partition includes a relatively lightweight semiconductor component. A resistor and non-heat generating components are housed in the lower compartment, and the transformer and the flow coil, which are relatively heavy and generate a large amount of heat, are housed, and heat is applied to each of the semiconductor component group and the resistor component group. A heat input end of the pipe is mounted, a heat absorber is installed in the upper space in the compartment where the transformer and the flow coil are housed, and the heat input end of the heat pipe is mounted on the heat absorber, while the heat input end of the heat pipe is mounted on the heat absorber. A heat radiator is placed on the top of the outside of the body, and the heat radiating ends of the heat pipes mounted on each component group and the heat absorber are attached to the radiator.The purpose is to improve the efficiency of heat radiation and improve the efficiency of the equipment. The goal is to make the device smaller and more economical.

Embodiments of the present invention will be described based on the drawings.

FIG. 2 shows a power supply device according to an embodiment of the present invention, in which a is a front view and b is a side view.

The same symbols as in FIG. 1 indicate the same parts.

6 is a heat pipe, 7 is a heat radiator, 10 is a heat absorber, and 17 is a partition plate which is a heat insulating material.

In this embodiment, a partition plate 17 is provided inside the housing 1 of a conventional device, and upper and lower partition portions A and B are provided.

In this example, considering the stability of the power supply device,
A heavy transformer 3 and a blockage wire 4 are installed in the lower section B.
In the upper section A, a lightweight semiconductor component 2, a resistor 5, and a non-heat generating component 8 are housed. On the other hand, a heat radiator 7 is placed on the upper part of the outside of the body 1, and a space is provided above the transformer 3 and the blocking wire 4 in the lower section B, and a heat absorber 10 is provided. Then, the heat input end of the heat pipe 6 is attached to the heat absorber 10, two groups of semiconductor components, five groups of resistors, and eight groups of non-heat generating components provided in the spaces above the transformer 3 and the blocking wire ring 4, respectively. The heat radiation ends of the heat pipes 6 are attached to the heat radiators 7, respectively.

Based on the above configuration, the heat of the heat absorber 10 that has absorbed the heat generated by the transformer 3 and the blocking wire 4, as well as the heat generated by other parts, is transmitted to the radiator 7 through the heat pipe 6, and Dissipates heat to the air outside the device.

As is well known, a heat pipe is a conductive component with extremely high equivalent thermal conductivity, so by adopting a heat dissipation structure as shown in Figure 2, there is no need to provide a space for a heat sink or a space for air circulation within the device. Without,
It is sufficient to have enough space for a heat pipe with a diameter of about 10 mm to pass through the device, making it possible to reduce the spacing between each component and shortening the wiring length. This provides advantages in electrical circuitry as well as miniaturization of the device.

In addition, due to restrictions on their heat dissipation performance, the transformer and blocking coils are housed in a lower section of the device, separate from the semiconductor components, resistors, etc., to dissipate heat from the air whose temperature has risen in this section. By adopting a structure in which the heat is transmitted to the heat absorber 10 and the heat absorber 10 radiates the heat from the heat radiator 7 via the heat pipe 6, the influence of heat generated from the transformer and the blockage wire on other components is extremely minimized. can do. In addition, most of the heat generated from each component is transferred to the outside through the heat pipe, which reduces the rise in air temperature inside the device and reduces the impact on non-heat generating components that are easily affected by temperature, such as capacitors. This is advantageous for downsizing the device, as it increases the degree of freedom in arranging parts. Also, for the same reason, the body of the device can be made into a sealed structure, so
Noise generated inside the device can be shielded,
It is possible to reduce the noise of the device.

Hereinafter, an example of a structure in which heat pipes are attached to each of the above-mentioned components will be explained.

Figure 3 shows the structure of a group of semiconductor components, a is a perspective view, and b
shows a plan view, and c shows a plan view of a group of semiconductor components with an insulator interposed therebetween.

11 is a component mounting block, 12 is a clamp screw, and 14 is a heat conductive insulating sheet. Since power semiconductor components generally have a mounting stud (with thread), the component can be mounted on the block 11 by screwing this into the internal thread provided on the block 11. This block 1
1 is a rectangular plate with a convex cross section, as shown in FIG.
, and has a groove 11-2 extending from the through hole 11-1 to the center of the convex tip. By inserting the heat pipe 6 into the through hole 11-1 and tightening the screws 12 on both sides of the convex portion, the heat pipe 6 can be coupled to the block 11 with low thermal resistance.

Furthermore, when there is no need to electrically insulate the semiconductor component 2, the block 11, and the heat pipe 6, the threaded stud of the semiconductor component 2 can be screwed directly into the block, as shown in FIG. 3b. However, if insulation is required, as shown in FIG. This allows the heat pipe 6 to be mounted with low thermal resistance and electrical insulation.

FIG. 4 is a structural diagram of a heat pipe mounted on a resistor group, in which a is a front view and b is a plan view.

The resistor 5 is inserted into the mounting circular groove 47-1 bored in the center of the heat radiator 47, and the heat radiator 47 is attached to the block 41 with screws. The block 41 is a rectangular plate, and a circular through hole 41-1 in which the heat pipe 6 is mounted and a groove 41-2 reaching the through hole 41-1 are provided along both edges of the short side. Insert the heat pipe 6 into the through hole 41-1,
It is screwed together with a screw 12.

FIG. 5 shows a perspective view of the heat absorber 10 with a heat pipe mounted thereon.

The heat absorber 10 is a block body in which heat absorbing fins 10-1 are arranged in a comb shape, and an approximately semicircular groove 10-2 in which the heat pipe 6 is mounted is provided on the outer surface of the base of the comb teeth. A rectangular fixing plate 13 with the same area is provided, and a surface 1 corresponding to the outer surface of the fixing plate 13 is provided.
An approximately semicircular groove 13-2 in which the heat pipe 6 is mounted is formed in 3-1. Groove portion 10-2 and groove portion 13
The heat pipe 6 is mounted between the heat absorber 10 and the fixing plate 13 by fixing the heat absorber 10 and the fixing plate 13 with screws.

FIG. 6 is a diagram showing another embodiment of the heat absorber and the mounting structure of the heat pipe, in which a shows a front view and b shows a plan view.

The base body 60-1 of the heat absorber 60 has a rectangular parallelepiped shape, and a through hole 60-2 for fitting the heat pipe 6 is formed in the center of one side of the base body to the opposite side. A groove 60-3 reaching the inner peripheral surface of the through hole 60-2 is provided from one surface parallel to the through hole 60-2, and heat absorbing fins 60-4 are provided on the entire peripheral surface of the four sides parallel to the through hole 60-2 of the base body 60-1. 60
-5 is provided. Then, the heat pipe 6 is inserted into the through hole 60-2, a screw orthogonal to the groove 60-3 is provided, and the screw is tightened in the direction that narrows the gap between the grooves, thereby connecting the heat pipe 6 and the heat absorber 60 with a small thermal resistance. Implement it with

FIG. 7 is a structural diagram in which a heat pipe is mounted on an embodiment of a radiator, in which a is a front view and b is a plan view.

A semicircular groove 70-3 in which a heat pipe is mounted from the plane part of the trapezoidal part 70-2 of the block 70, which has a T-shaped protruding trapezoidal part 70-2 in the center of the rectangular plate 70-1. is provided parallel to the short side, and both ends of the plate body 70-1 and the trapezoidal part 70-
A heat dissipation fin 70-4 is provided on one side of the heat sink 2.
On the other hand, block 70' is plane symmetrical to block 70.
will be established. Semicircular groove 70- of block 70
3. Mount the heat pipe 6 between the grooves 70'-3 of the block 70' and fix the blocks 70 and 70' with the screws 12. A cylindrical insulator 15 is provided between the heat pipe 6 and the body 1 to electrically insulate the heat pipe 6 and the body 1.

FIG. 8 shows an embodiment in which the inside of the body of the device is divided into an upper section and a lower section. A heat insulating member 17 is provided as a partition plate between both partitions. By providing the heat insulating member 17, it is possible to prevent heat from flowing into the lower section.

The above structure is used as a rectifier for transmission equipment (21V,
90A), when the heat pipe is not applied, the dimensions of the device enclosure are: height 1975mm, width 500mm, depth 400mm.
mm, when 10 heat pipes with a diameter of 12 mm are mounted to cool the component, approximately 700 W of power loss is dissipated, the height of the main body is reduced to 1000 mm, or approximately 1/2, and the heat sink is Including this, we were able to reduce the size to approximately 1,400 mm, or approximately 70%.

Since the power supply device of the present invention has the above configuration, it can efficiently dissipate heat generated from components with different heat dissipation performance, it can miniaturize the device enclosure, it can be mounted at high density, and it can be used as a rectifier for telecommunication equipment or an inverter device. If applied to this, it is possible to shorten the wiring length between parts, resulting in effects such as miniaturization of the device, high efficiency of heat dissipation, and economy.

[Brief explanation of the drawing]

Fig. 1 is a component layout diagram of a conventional power supply device for telecommunications equipment, a is a front view, b is a side view, and Fig. 2 is a diagram of the component layout and cooling device of the power supply device of the present invention, a is a front view, b is a side view, FIG. 3 is a diagram of a heat pipe mounting structure on a group of semiconductor components, a is a perspective view, b is a plan view,
c is a plan view of a semiconductor component group with an insulator interposed therebetween, FIG. 4 is a diagram of a heat pipe mounting structure on a resistor group, a
is a front view, b is a plan view, Fig. 5 is a perspective view of a heat sink mounted with a heat pipe, Fig. 6 is a structural diagram of a heat pipe mounted in another embodiment of the heat sink, a is a front view, b is a plan view, FIG. 7 is a structural diagram of a heat pipe mounted on an embodiment of the radiator, a is a front view, b is a plan view, and FIG. 8 is an upper section inside the device body.
An example diagram of dividing into a lower section is shown. 1: Device housing, 2: Semiconductor parts, 3: Transformer, 4: Blocking wire, 5: Resistor, 6: Heat pipe, 7: Heat sink, 8: Non-heat generating parts, 9: Opening,
10: heat absorber, 17: heat insulating member, A: upper section, B: lower section.

Claims (1)

[Scope of utility model registration request] In a power supply device composed of semiconductor components, resistors, non-heat generating components, a transformer, and a flow coil, a partition plate is provided inside the device enclosure to allow gas to flow between the upper and lower partitions. The upper section accommodates semiconductor components, resistors, and non-heat generating components, the lower section accommodates the transformer and the flow wire, and the semiconductors accommodated in the upper section A heat input end of a heat pipe is mounted on each of the components and the resistor component group, a heat absorber is installed in the space above the transformer and the flow coil housed in the lower compartment, and the heat pipe is connected to the heat absorber. On the other hand, a heat radiator is placed on the upper part of the exterior of the device body, and the heat radiation ends of the heat pipes mounted on each of the component groups and the heat absorber are attached to the heat radiator. A power supply device characterized by: