JPS6231373U - - Google Patents
Info
- Publication number
- JPS6231373U JPS6231373U JP12025785U JP12025785U JPS6231373U JP S6231373 U JPS6231373 U JP S6231373U JP 12025785 U JP12025785 U JP 12025785U JP 12025785 U JP12025785 U JP 12025785U JP S6231373 U JPS6231373 U JP S6231373U
- Authority
- JP
- Japan
- Prior art keywords
- connecting terminal
- terminal forming
- flexible printed
- thermal head
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案の実施例を示すサーマルヘツド
とフレキシブルプリント板の接合構造説明図、第
２図は第１図の―断面図、第３図は従来のサ
ーマルヘツドとフレキシブルプリント板の接合構
造説明図で、
図中、１１はサーマルヘツド、１３はフレキシ
ブルプリント板、１４は異方性導電フイルム、１
５，１６は接続端子形成部である。
Fig. 1 is an explanatory diagram of a bonding structure between a thermal head and a flexible printed board showing an embodiment of the present invention, Fig. 2 is a cross-sectional view of Fig. 1, and Fig. 3 is a conventional bonding structure between a thermal head and a flexible printed board. In the figure, 11 is a thermal head, 13 is a flexible printed board, 14 is an anisotropic conductive film, 1
5 and 16 are connection terminal forming portions.
Claims (1)
ルプリント板の接続端子形成部とを重ね合わせて
接合する接合構造において、 前記両接続端子形成部の間に、低温接合可能な
異方性導電フイルムを介在させて圧縮したことを
特徴とするサーマルヘツドとフレキシブルプリン
ト板の接合構造。[Claims for Utility Model Registration] In a joining structure in which a connecting terminal forming portion of a thermal head and a connecting terminal forming portion of a flexible printed board are overlapped and bonded, there is provided a bonding structure between the two connecting terminal forming portions that can be bonded at low temperature. A bonding structure between a thermal head and a flexible printed board, characterized by interposing and compressing a directional conductive film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12025785U JPS6231373U (en) | 1985-08-07 | 1985-08-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12025785U JPS6231373U (en) | 1985-08-07 | 1985-08-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6231373U true JPS6231373U (en) | 1987-02-25 |
Family
ID=31008404
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12025785U Pending JPS6231373U (en) | 1985-08-07 | 1985-08-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6231373U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0199905A (en) * | 1987-10-08 | 1989-04-18 | Showa Alum Corp | Method for heat sealing lid to container |
| JPH01153404A (en) * | 1987-11-30 | 1989-06-15 | Showa Alum Corp | Heat-sealer of lid for vessel |
-
1985
- 1985-08-07 JP JP12025785U patent/JPS6231373U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0199905A (en) * | 1987-10-08 | 1989-04-18 | Showa Alum Corp | Method for heat sealing lid to container |
| JPH01153404A (en) * | 1987-11-30 | 1989-06-15 | Showa Alum Corp | Heat-sealer of lid for vessel |
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