JPS6232575U - - Google Patents
Info
- Publication number
- JPS6232575U JPS6232575U JP12381985U JP12381985U JPS6232575U JP S6232575 U JPS6232575 U JP S6232575U JP 12381985 U JP12381985 U JP 12381985U JP 12381985 U JP12381985 U JP 12381985U JP S6232575 U JPS6232575 U JP S6232575U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- insulating layer
- land
- conductive pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例を説明するための要
部を拡大した断面説明図、第２図は本考案に係る
プリント配線板のパターン面の一部切欠平面図、
第３図は従来のプリント配線板を示す平面図、第
４図は第３図における―線の断面図、第５図
は同要部の拡大断面図である。
１０……プリント配線板、１４……ランド、１
６……パターン、１８……電子部品、２０……リ
ード端子、２２……カツト部、２４……第１の絶
縁層、２６……第２の絶縁層。
FIG. 1 is an enlarged sectional explanatory view of essential parts for explaining one embodiment of the present invention, and FIG. 2 is a partially cutaway plan view of a pattern surface of a printed wiring board according to the present invention.
FIG. 3 is a plan view showing a conventional printed wiring board, FIG. 4 is a cross-sectional view taken along the line --- in FIG. 3, and FIG. 5 is an enlarged cross-sectional view of the same main part. 10...Printed wiring board, 14...Land, 1
6... Pattern, 18... Electronic component, 20... Lead terminal, 22... Cut portion, 24... First insulating layer, 26... Second insulating layer.
Claims (1)
ターンの半田付けされるランドを残して他の全面
に第１の絶縁層が形成されたプリント配線板にお
いて、前記ランドに隣接した他の導電パターンの
該ランド近接部分に第２の絶縁層を保護膜として
形成したことを特徴とするプリント配線板。 In a printed wiring board in which a conductive pattern is wired on an insulating substrate and a first insulating layer is formed on the entire surface except for soldered lands of these patterns, the land of another conductive pattern adjacent to the land A printed wiring board characterized in that a second insulating layer is formed as a protective film in an adjacent portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12381985U JPS6232575U (en) | 1985-08-12 | 1985-08-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12381985U JPS6232575U (en) | 1985-08-12 | 1985-08-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6232575U true JPS6232575U (en) | 1987-02-26 |
Family
ID=31015271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12381985U Pending JPS6232575U (en) | 1985-08-12 | 1985-08-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6232575U (en) |
-
1985
- 1985-08-12 JP JP12381985U patent/JPS6232575U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6232575U (en) | ||
| JPS63127171U (en) | ||
| JPS6020163U (en) | printed wiring board | |
| JPS61100178U (en) | ||
| JPS6237969U (en) | ||
| JPH0186263U (en) | ||
| JPS6221569U (en) | ||
| JPS6413171U (en) | ||
| JPS6226074U (en) | ||
| JPS6426880U (en) | ||
| JPS61100168U (en) | ||
| JPH01160898U (en) | ||
| JPS6387869U (en) | ||
| JPS61127671U (en) | ||
| JPS62114474U (en) | ||
| JPS61131871U (en) | ||
| JPH01179460U (en) | ||
| JPH01110495U (en) | ||
| JPS6284975U (en) | ||
| JPH0183361U (en) | ||
| JPH0256476U (en) | ||
| JPS624174U (en) | ||
| JPS6382964U (en) | ||
| JPS63110071U (en) | ||
| JPS60181066U (en) | flexible printed circuit board |