JPS6232576U - - Google Patents
Info
- Publication number
- JPS6232576U JPS6232576U JP12397185U JP12397185U JPS6232576U JP S6232576 U JPS6232576 U JP S6232576U JP 12397185 U JP12397185 U JP 12397185U JP 12397185 U JP12397185 U JP 12397185U JP S6232576 U JPS6232576 U JP S6232576U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- conductor lands
- receiving part
- light
- temporarily fixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000001514 detection method Methods 0.000 claims 1
- 238000007599 discharging Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案に係わる電子部品の仮止用接着
剤の塗布エラー検知装置の一実施例を示す概略図
、第２図は同上装置における接着剤の塗布エラー
検知状態を示す概略図、第３図及び第４図は他の
実施例を示す図で、夫々Ａは平面図、Ｂは正面図
、第５図Ａ，Ｂは夫々従来例を示す概略図である
。
１……プリント配線基板、２……電子部品、３
……導体ランド、４……接着剤、５……注入装置
、７……吐出ヘツド、８……光源、９……受光部
、１１，１２……比較器、１３……ＯＲ回路、１
４……増幅器。
FIG. 1 is a schematic diagram showing an embodiment of the device for detecting an error in applying adhesive for temporary fixing of electronic components according to the present invention; FIG. 3 and 4 are views showing other embodiments, where A is a plan view, B is a front view, and FIGS. 5A and 5 are schematic diagrams showing conventional examples. 1...Printed wiring board, 2...Electronic components, 3
... Conductor land, 4 ... Adhesive, 5 ... Injection device, 7 ... Discharge head, 8 ... Light source, 9 ... Light receiving section, 11, 12 ... Comparator, 13 ... OR circuit, 1
4...Amplifier.
Claims (1)
に仮止するための接着剤を塗布する装置の接着剤
吐出ヘツドに、前記導体ランドに光を照射する光
源と該導体ランドからの反射光が入光される受光
部とを一体に設け、前記受光部からの出力に基づ
いて接着剤による導体ランドの汚れの有無を判定
する判定手段を設けたことを特徴とする電子部品
の仮止用接着剤の塗布エラー検知装置。 A light source that irradiates light onto the conductor lands and reflected light from the conductor lands enter an adhesive discharging head of an adhesive dispensing head of an adhesive dispensing device for temporarily fixing electronic components between conductor lands on a printed wiring board. An adhesive for temporarily fixing electronic parts, characterized in that the adhesive is integrated with a light receiving part, and is provided with a determining means for determining whether or not a conductive land is contaminated by the adhesive based on the output from the light receiving part. Coating error detection device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12397185U JPS6232576U (en) | 1985-08-14 | 1985-08-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12397185U JPS6232576U (en) | 1985-08-14 | 1985-08-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6232576U true JPS6232576U (en) | 1987-02-26 |
Family
ID=31015559
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12397185U Pending JPS6232576U (en) | 1985-08-14 | 1985-08-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6232576U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0217205U (en) * | 1988-07-13 | 1990-02-05 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6156500A (en) * | 1984-08-28 | 1986-03-22 | 株式会社東芝 | Device for attaching electronic part |
-
1985
- 1985-08-14 JP JP12397185U patent/JPS6232576U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6156500A (en) * | 1984-08-28 | 1986-03-22 | 株式会社東芝 | Device for attaching electronic part |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0217205U (en) * | 1988-07-13 | 1990-02-05 |
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