JPS6233334Y2 - - Google Patents

Description

[Detailed explanation of the invention] This invention is particularly suitable for the power housed in a single in-line type (hereinafter abbreviated as SIL) package.
This invention relates to a mounting device for a heat sink used in ICs and the like to a printed wiring board.

Heat sinks for SIL-type power ICs are attached to printed wiring boards in the following manner. That is, a tongue piece with an L-shaped cross section is formed at one end of the heat sink, a female thread is cut in that part, the tongue piece is placed on a printed wiring board, and a male screw is attached to the female thread from the back side of the tongue piece. There is a method of fixing the heat sink by screwing it together, and a method of attaching the heat sink to the above-mentioned package of the power IC, holding the heat sink on the printed wiring board using the lead terminals of the IC, and attaching the heat sink as necessary. There is a method of fixing by applying adhesive between them. However, the former method of fixing with screws requires a lot of man-hours, and when soldering the lead terminals of the IC by dipping the back side of the printed wiring board in a solder bath, it is necessary to use the male screws mentioned above. Solder also adheres to the head of the heat sink, making it difficult to remove the heat sink during repairs. On the other hand, the latter method has poor stability against shock and vibration and is not practical.

This idea was developed to eliminate the above-mentioned drawbacks, and its purpose is to provide a heat sink mounting device that can attach and fix a heat sink to a printed wiring board with one touch without using screws or adhesives. It's about doing.

Hereinafter, embodiments of this invention will be described in detail with reference to the accompanying drawings.

As shown in Figure 1, this device:
This is for attaching a heat sink 2 for, for example, a power IC 1 having an SIL type package and a printed wiring board 5 so as to be substantially orthogonal to each other. In this embodiment, the heat sink 2 is a flat plate made of aluminum or the like. A male member is provided on the side, and a female member that cooperates with the male member is formed on the printed wiring board 5 side. That is, the heat dissipation plate 2 is formed with support pieces 3, 3 and the hooks 4, 4 as the above-mentioned male members, while the printed wiring board 5 is formed with female members into which the hooks 4, 4 are fitted. Slit holes 6, 6 and holding holes 7, 7 are bored. The support pieces 3, 3 consist of tongue pieces that are bent into a substantially L-shape along the mounting surface of the printed wiring board 5 at the joining edge 2a of the heat sink 2 to the printed wiring board 5. to ensure installation stability. In this embodiment, two support pieces 3, 3 extending in mutually opposite directions are provided, but the number may be arbitrary. Each of the hooks 4 is attached to a heat sink 2.
It has a substantially L-shaped arm 9 connected to the joining edge 2a, and in this case, the arm 9 has a protrusion 8 protruding toward the joining edge 2a at its distal end. Further, the distance between the arm 9 and the joining edge 2a is formed to be approximately equal to the board thickness of the printed wiring board 5, so that the distance between the protrusion 8 and the joining edge 2a is approximately the same as the thickness of the printed wiring board 5.
The distance therebetween is slightly narrower than the thickness of the printed wiring board 5. Although the arms 9, 9 are bent in the same direction, the direction need not be parallel to the heat sink 2 as shown. On the other hand, the slit holes 6, 6 are substantially larger than the arms 9, 9 so that the hooks 4, 4 can pass through them, and are spaced apart from each other at the same interval as the mounting interval of the hooks 4, 4 on the printed wiring board. 5 is drilled. In addition, the holding holes 7, 7 connect the hooks 4, 4 to the slit holes 6, 6.
and are further drilled at positions where the protrusions 8, 8 are fitted when the heat dissipation plate 2 is slid in the direction in which the arms 9, 9 are bent (see Fig. 2). . In addition, in this embodiment, the support pieces 3, 3 and the hooks 4, 4 are placed on the heat sink 2 side,
The slit holes 6, 6 and the holding holes 7, 7 are provided on the printed wiring board 5 side, but in the opposite manner, that is, the support pieces 3, 3 and the hooks 4,
4 on the printed wiring board 5 side, and the slit holes 6, 6
Also, the holding holes 7, 7 may be provided on the heat sink 2 side, respectively. Further, the heat sink 2 is provided with one through hole 10 for attaching an element such as the SIL type power IC 1 with a screw, and the printed wiring board 5 is provided with a through hole 10 for attaching an element such as the SIL type power IC 1 with a screw. Three through holes 12 are provided to allow the lead terminals 11 to pass through, but the number and arrangement of these through holes 10, 12 are arbitrary to suit the device to which they are applied.

To explain the operation of this invention, first, the slit holes 6, 6 formed in the printed wiring board 5 will be described.
The hooks 4, 4 of the heat sink plate 2 are passed through. next,
Slide the heat sink 2 in the direction in which the arms 9, 9 are bent. At this time, the arms 9, 9 are the projections 8,
When the protrusions 8, 8 are temporarily elastically deformed by 8 and positioned below the holding holes 7, 7, the protrusions 8, 8 are
It is firmly held in the holding holes 7, 7 by the elastic restoring force of the arms 9, 9. In this way, the heat sink 2 can be attached to the printed wiring board 5 very easily. Thereafter, the lead terminal 11 of the SIL type power IC 1 is passed through the through hole 12, and the SIL type power IC 1 is further screwed onto the heat sink 2 with screws.

As is clear from the above description of the embodiment, according to this invention, the heat sink 2 can be attached to the printed wiring board 5 with a single touch without using screws or adhesives, which reduces the number of man-hours and facilitates mass production. Are suitable. In addition, since the structure allows the heat sink 2 to be easily removed from the printed wiring board 5,
This is extremely convenient for repairs, etc. Furthermore, since the heat sink 2 is firmly fixed by the support pieces 3, 3 and the hooks 4, 4, the SIL type power IC mounted on the heat sink 2 can be protected against shock and vibration.
There is also little risk that the lead terminal 11 of No. 1 will be damaged.
Note that this invention can of course be applied not only to power ICs but also to other SIL type elements that generate heat during operation.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view showing a structure for attaching a heat sink and a printed wiring board according to this invention to each other. FIG. 2 is a front view showing the heat sink and printed wiring board attached to each other. In the figure, 1 is a SIL type power IC, 2 is a heat sink, 3 is a support piece, 4 is a hook, 5 is a printed wiring board, and 6
1 is a slit hole, 7 is a holding hole, 8 is a protrusion, 9 is an arm, and 11 is a lead terminal.

Claims (1)

[Claims for Utility Model Registration] (1) A device consisting of a male member and a female member for attaching two members, a flat heat sink made of aluminum or the like and a printed wiring board, so as to be substantially orthogonal to each other. , the male member is a hook piece that is connected in a substantially L-shape at the joining edge of the one member to the other member, and has a tip thereof protruding toward a plane including the joining edge. the female member has an engaging protrusion;
A slit hole drilled in the other member to a size that fits the hook piece, and an engagement recess drilled at a position that can be engaged with the engagement protrusion on an extension of the slit hole. Insert the hook piece into the slit hole,
The heat sink mounting device is characterized in that the heat sink and the printed wiring board are mounted so as to be substantially perpendicular to each other by sliding the protrusions along the projections and engaging the protrusions with the recesses. (2) In claim (1) of the utility model registration, it is stated that the one member is provided with a support piece that is bent from the joint edge along the attached surface of the other member. Features a heat sink mounting device.