JPS6234005U - - Google Patents
Info
- Publication number
- JPS6234005U JPS6234005U JP12589985U JP12589985U JPS6234005U JP S6234005 U JPS6234005 U JP S6234005U JP 12589985 U JP12589985 U JP 12589985U JP 12589985 U JP12589985 U JP 12589985U JP S6234005 U JPS6234005 U JP S6234005U
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- resin foam
- heat insulating
- recess
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009413 insulation Methods 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 2
- 239000006260 foam Substances 0.000 claims 3
- 229920003002 synthetic resin Polymers 0.000 claims 3
- 239000000057 synthetic resin Substances 0.000 claims 3
- 239000000463 material Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Building Environments (AREA)
- Laminated Bodies (AREA)
Description
第１図は本考案の建築用断熱板の一実施例の裏
面の状態を示す斜視図、第２図は第１図のＡ―Ａ
断面の端面図である。第３図は本考案の他の実施
例の部分斜視図を示す。第４図は本考案の断熱板
を用いて直貼り工法で張付け施工した状態を示す
断面図である。
Fig. 1 is a perspective view showing the back side of an embodiment of the thermal insulation board for construction of the present invention, and Fig. 2 is an A-A of Fig. 1.
FIG. 3 is a cross-sectional end view. FIG. 3 shows a partial perspective view of another embodiment of the invention. FIG. 4 is a cross-sectional view showing a state in which the heat insulating board of the present invention is attached using a direct attachment method.
Claims (1)
を貼着一体に形成した断熱複合板において、合成
樹脂系発泡体２の露出面側に、下地材１に達しな
い深さの凹部３を該裏面全体に、実質的に均一に
多数分布させた建築用断熱板。 (2) 凹部３の内側面４が粗面で形成されている
、実用新案登録請求の範囲第１項に記載の建築用
断熱板。 (3) 凹部３の底面５に接着剤が施されている、
実用新案登録請求の範囲第１項に記載の建築用断
熱板。[Scope of claims for utility model registration] (1) Synthetic resin foam 2 on the back side of the hard base material 1
In the heat insulating composite board formed by bonding and integrating the synthetic resin foam 2, a large number of recesses 3 with a depth that does not reach the base material 1 are substantially uniformly distributed over the entire back surface on the exposed surface side of the synthetic resin foam 2. Architectural insulation board. (2) The architectural heat insulating board according to claim 1, wherein the inner surface 4 of the recess 3 is formed with a rough surface. (3) Adhesive is applied to the bottom surface 5 of the recess 3;
A thermal insulation board for construction according to claim 1 of the utility model registration claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12589985U JPS6234005U (en) | 1985-08-17 | 1985-08-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12589985U JPS6234005U (en) | 1985-08-17 | 1985-08-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6234005U true JPS6234005U (en) | 1987-02-28 |
Family
ID=31019197
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12589985U Pending JPS6234005U (en) | 1985-08-17 | 1985-08-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6234005U (en) |
-
1985
- 1985-08-17 JP JP12589985U patent/JPS6234005U/ja active Pending
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