JPS6234418U - - Google Patents
Info
- Publication number
- JPS6234418U JPS6234418U JP12630385U JP12630385U JPS6234418U JP S6234418 U JPS6234418 U JP S6234418U JP 12630385 U JP12630385 U JP 12630385U JP 12630385 U JP12630385 U JP 12630385U JP S6234418 U JPS6234418 U JP S6234418U
- Authority
- JP
- Japan
- Prior art keywords
- metal cap
- hole
- layer
- capacitor element
- chip capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000004804 winding Methods 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000011104 metalized film Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
第１図及び第２図は本考案の一実施例を示し、
第１図はコンデンサ素子の斜視図、第２図は円柱
型チツプコンデンサの斜視図、第３図乃至第５図
は本考案の他の実施例を示し、第３図Ａは金層キ
ヤツプの斜視図、第３図Ｂは第３図Ａの断面図、
第４図は耐熱性導電接着剤を被着した状態を示す
斜視図、第５図は外装を施した断面図であり、第
６図は従来例の断面図である。
１……円柱型チツプコンデンサ、２……円柱型
金属化コンデンサ素子、２ａ……捲芯孔、３……
金属キヤツプ、３ａ……透孔、３ｂ……突起部、
４……外部電極、５……耐熱性導電接着剤、６…
…メツキ層、６ａ……第一の層、６ｂ……第二の
層。
1 and 2 show an embodiment of the present invention,
Fig. 1 is a perspective view of a capacitor element, Fig. 2 is a perspective view of a cylindrical chip capacitor, Figs. 3 to 5 show other embodiments of the present invention, and Fig. 3A is a perspective view of a gold layer cap. Figure 3B is a sectional view of Figure 3A,
FIG. 4 is a perspective view showing a state in which a heat-resistant conductive adhesive is applied, FIG. 5 is a cross-sectional view with an exterior covering applied, and FIG. 6 is a cross-sectional view of a conventional example. 1... Cylindrical chip capacitor, 2... Cylindrical metallized capacitor element, 2a... Winding hole, 3...
Metal cap, 3a...through hole, 3b...protrusion,
4...External electrode, 5...Heat-resistant conductive adhesive, 6...
...Metsuki layer, 6a...first layer, 6b...second layer.
Claims (1)
デンサ素子の両端に、耐熱性導電接着剤によつて
金属キヤツプを接続して、外部電極としたことを
特徴とする円柱型チツプコンデンサ。 (2) 金属キヤツプのコンデンサ素子捲芯孔と対
向する以外の部分に透孔を設けると共に、少なく
ともコンデンサ素子の上記透孔より露出した部分
及び金属キヤツプの上記透孔周辺部分に耐熱性導
電接着剤を被着し、更に上記接着剤及び金属キヤ
ツプ上にメツキ層を形成したことを特徴とする実
用新案登録請求の範囲第１項に記載の円柱型チツ
プコンデンサ。 (3) 金属キヤツプのコンデンサ素子捲芯孔と対
向する部分に、上記捲芯孔に挿入される突起部を
設けたことを特徴とする実用新案登録請求の範囲
第１項又は第２項に記載の円柱型チツプコンデン
サ。 (4) 導電接着剤の導電成分が銀を主体とし、且
つメツキ層が上記接着剤及び金属キヤツプ上に形
成されたニツケル又は銅より成る第一の層及び上
記第一の層上に形成された錫又は半田より成る第
二の層より成ることを特徴とする実用新案登録請
求の範囲第２項又は第３項に記載の円柱型チツプ
コンデンサ。[Claims for Utility Model Registration] (1) A metal cap is connected to both ends of a cylindrical metallized film capacitor element having a winding hole with a heat-resistant conductive adhesive to serve as an external electrode. Cylindrical chip capacitor. (2) A through hole is provided in a portion of the metal cap other than the portion facing the capacitor element winding hole, and a heat-resistant conductive adhesive is applied to at least the portion of the capacitor element exposed from the through hole and the portion of the metal cap surrounding the through hole. 2. The cylindrical chip capacitor according to claim 1, further comprising a plating layer formed on the adhesive and the metal cap. (3) A utility model registered as described in claim 1 or 2, characterized in that a portion of the metal cap facing the capacitor element winding hole is provided with a protrusion that is inserted into the winding hole. Cylindrical chip capacitor. (4) The conductive component of the conductive adhesive is mainly silver, and the plating layer is formed on the adhesive and a first layer made of nickel or copper formed on the metal cap, and on the first layer. The cylindrical chip capacitor according to claim 2 or 3, characterized in that the second layer is made of tin or solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985126303U JPH046198Y2 (en) | 1985-08-19 | 1985-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985126303U JPH046198Y2 (en) | 1985-08-19 | 1985-08-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6234418U true JPS6234418U (en) | 1987-02-28 |
| JPH046198Y2 JPH046198Y2 (en) | 1992-02-20 |
Family
ID=31019980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985126303U Expired JPH046198Y2 (en) | 1985-08-19 | 1985-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH046198Y2 (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS487411U (en) * | 1971-06-07 | 1973-01-27 | ||
| JPS5049642U (en) * | 1973-09-06 | 1975-05-15 | ||
| JPS5632607A (en) * | 1979-08-23 | 1981-04-02 | Hokuriku Elect Ind | Conductive terminal for heat resistant insulator substrate |
| JPS5673402A (en) * | 1979-11-20 | 1981-06-18 | Matsushita Electric Industrial Co Ltd | Method of manufacturing leadless cylindrical chipplike electronic part |
| JPS5755901U (en) * | 1980-09-16 | 1982-04-01 | ||
| JPS5961523U (en) * | 1982-10-18 | 1984-04-23 | 日立コンデンサ株式会社 | Chip type film capacitor |
| JPS59197120A (en) * | 1983-04-22 | 1984-11-08 | 日本電気株式会社 | Ultrafine film condenser |
| JPS6071662A (en) * | 1983-09-28 | 1985-04-23 | Nitto Electric Ind Co Ltd | Conductive silver paste composition |
-
1985
- 1985-08-19 JP JP1985126303U patent/JPH046198Y2/ja not_active Expired
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS487411U (en) * | 1971-06-07 | 1973-01-27 | ||
| JPS5049642U (en) * | 1973-09-06 | 1975-05-15 | ||
| JPS5632607A (en) * | 1979-08-23 | 1981-04-02 | Hokuriku Elect Ind | Conductive terminal for heat resistant insulator substrate |
| JPS5673402A (en) * | 1979-11-20 | 1981-06-18 | Matsushita Electric Industrial Co Ltd | Method of manufacturing leadless cylindrical chipplike electronic part |
| JPS5755901U (en) * | 1980-09-16 | 1982-04-01 | ||
| JPS5961523U (en) * | 1982-10-18 | 1984-04-23 | 日立コンデンサ株式会社 | Chip type film capacitor |
| JPS59197120A (en) * | 1983-04-22 | 1984-11-08 | 日本電気株式会社 | Ultrafine film condenser |
| JPS6071662A (en) * | 1983-09-28 | 1985-04-23 | Nitto Electric Ind Co Ltd | Conductive silver paste composition |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH046198Y2 (en) | 1992-02-20 |
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