JPS6234435U - - Google Patents
Info
- Publication number
- JPS6234435U JPS6234435U JP12658385U JP12658385U JPS6234435U JP S6234435 U JPS6234435 U JP S6234435U JP 12658385 U JP12658385 U JP 12658385U JP 12658385 U JP12658385 U JP 12658385U JP S6234435 U JPS6234435 U JP S6234435U
- Authority
- JP
- Japan
- Prior art keywords
- radius
- glass
- holds
- chip
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 claims description 4
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Volatile Memory (AREA)
Description
第１図は本考案に係るＩＣ用ガラスパツケージ
の平面図、第２図は同パツケージの分解縦断面図
、第３図及び第４図はパツケージのコーナ部及び
周縁部のアールの半径とガラス欠ケ発生確率との
関係を示したグラフである。
尚、図面中１はＩＣ用ガラスパツケージ、２，
３は上下の半体、４はＩＣチツプ、７はコネクタ
ー、８はリードフレーム、９はコーナ部、１０は
周縁部、Ｒ―１，Ｒ―２はアールである。
Fig. 1 is a plan view of a glass package for IC according to the present invention, Fig. 2 is an exploded longitudinal sectional view of the same package, and Figs. This is a graph showing the relationship with the probability of occurrence. In addition, 1 in the drawing is a glass package for IC, 2,
3 is the upper and lower halves, 4 is an IC chip, 7 is a connector, 8 is a lead frame, 9 is a corner portion, 10 is a peripheral portion, and R-1 and R-2 are radiuses.
Claims (1)
収納し、周囲からＩＣチツプに接続するリードフ
レームを食み出させるように保持する少なくとも
上側半体をガラスで構成するＩＣパツケージにお
いて、ガラスで構成される半体の厚み、コーナー
部のアールの半径および周縁部のアールの半径を
それぞれ１mm〜３mm、０．５mm〜１．５mm、０．
３５mm〜１．２７mmとしたことを特徴とするＩＣ
パツケージ。 (2) 該コーナー部のアールおよび周縁部のアー
ルがプレス成形により得られたものである実用新
案登録請求の範囲第１項記載のＩＣパツケージ。[Scope of Claim for Utility Model Registration] (1) At least the upper half, which is made up of upper and lower halves and holds an IC chip inside and holds a lead frame connected to the IC chip from the periphery, is made of glass. In the IC package, the thickness of the half body made of glass, the radius of the corner radius, and the radius of the peripheral edge radius are 1 mm to 3 mm, 0.5 mm to 1.5 mm, and 0.5 mm, respectively.
IC characterized by having a diameter of 35 mm to 1.27 mm
Packaging. (2) The IC package according to claim 1, wherein the radius of the corner portion and the radius of the peripheral portion are obtained by press molding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12658385U JPH0337233Y2 (en) | 1985-08-20 | 1985-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12658385U JPH0337233Y2 (en) | 1985-08-20 | 1985-08-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6234435U true JPS6234435U (en) | 1987-02-28 |
| JPH0337233Y2 JPH0337233Y2 (en) | 1991-08-07 |
Family
ID=31020522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12658385U Expired JPH0337233Y2 (en) | 1985-08-20 | 1985-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0337233Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6447645U (en) * | 1987-09-10 | 1989-03-23 |
-
1985
- 1985-08-20 JP JP12658385U patent/JPH0337233Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6447645U (en) * | 1987-09-10 | 1989-03-23 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0337233Y2 (en) | 1991-08-07 |
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