JPS6234443U - - Google Patents

Info

Publication number
JPS6234443U
JPS6234443U JP12617185U JP12617185U JPS6234443U JP S6234443 U JPS6234443 U JP S6234443U JP 12617185 U JP12617185 U JP 12617185U JP 12617185 U JP12617185 U JP 12617185U JP S6234443 U JPS6234443 U JP S6234443U
Authority
JP
Japan
Prior art keywords
plating layer
lead frame
fixing part
lead
pellet fixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12617185U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12617185U priority Critical patent/JPS6234443U/ja
Publication of JPS6234443U publication Critical patent/JPS6234443U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図及び第２図は本考案を説明するための平
面図、第３図イ，ロは従来のリードフレームを示
す平面図である。 主な図番の説明、１は両連結条体、３は内部リ
ード、４は外部リード、７はモールド樹脂、８は
銀メツキ層境界線、９は樹脂バリである。 1 and 2 are plan views for explaining the present invention, and FIGS. 3A and 3B are plan views showing a conventional lead frame. Explanation of the main drawing numbers: 1 is both connecting stripes, 3 is an internal lead, 4 is an external lead, 7 is a mold resin, 8 is a silver plating layer boundary line, and 9 is a resin burr.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ペレツト固着部と複数のリードとを備え、前記
ペレツト固着部及び前記リードの一端を含む主要
部を樹脂モールドし他端を露出するリードフレー
ムにおいて、前記露出するリードのうち、前記樹
脂モールドにより樹脂バリが発生する部分には第
１のメツキ層を、他の部分には第２のメツキ層を
形成することを特徴とするリードフレーム。 In a lead frame comprising a pellet fixing part and a plurality of leads, the main part including the pellet fixing part and one end of the lead is molded with resin, and the other end is exposed. 1. A lead frame characterized in that a first plating layer is formed on a portion where the oxidation occurs, and a second plating layer is formed on the other portion.
JP12617185U 1985-08-19 1985-08-19 Pending JPS6234443U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12617185U JPS6234443U (en) 1985-08-19 1985-08-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12617185U JPS6234443U (en) 1985-08-19 1985-08-19

Publications (1)

Publication Number Publication Date
JPS6234443U true JPS6234443U (en) 1987-02-28

Family

ID=31019722

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12617185U Pending JPS6234443U (en) 1985-08-19 1985-08-19

Country Status (1)

Country Link
JP (1) JPS6234443U (en)

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