JPS6235211B2 - - Google Patents
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- Publication number
- JPS6235211B2 JPS6235211B2 JP54102760A JP10276079A JPS6235211B2 JP S6235211 B2 JPS6235211 B2 JP S6235211B2 JP 54102760 A JP54102760 A JP 54102760A JP 10276079 A JP10276079 A JP 10276079A JP S6235211 B2 JPS6235211 B2 JP S6235211B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- vacuum
- electrode
- resistance
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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- High-Tension Arc-Extinguishing Switches Without Spraying Means (AREA)
Description
本発明は、真空しや断器に係り、特に耐圧性と
耐溶着性を改良し、かつ再点弧発生の少ない真空
しや断器に関する。
従来、高耐圧、大容量真空しや断器においては
溶着防止成分(Bi、Pb、Te等)を5重量%以下
含有するCu合金を電極接点として具備したもの
が知られている。これら従来の真空しや断器が具
備する接点合金の特徴は、Cuに、固溶度が殆ん
どゼロで低融点かつ脆弱な溶着防止成分を高度に
分散した点にありすぐれた耐溶着特性、耐圧特性
及びしや断特性を発揮する。ところで真空しや断
器は小形軽量、メンテナンスフリー、環境調和等
他のしや断器に比べすぐれた特徴を有するため、
年々その適用範囲も拡大され従来一般に使用され
ていた38KV以下の回路から更に高圧(例えば
72KV以上)の回路への適用が要求されている。
上記高圧化にともない接点材料についても更に高
耐圧でかつすぐれた無再点弧特性をもつことが要
求されてきた。接点材料の高耐圧化、及び無再点
弧化を図るには耐圧的に欠陥となる脆弱な溶着防
止成分を極力少なくすること及びガス不純物やピ
ンホール等を極力少なくすることが望ましい。し
かしながら溶着防止成分を少なくして、ガス不純
物やピンホール等の除去のため一方向凝固等を用
いて徐冷してなる合金接点を用いた場合耐溶着性
の低下や、接点の引はずし面の荒れ方の増大、ま
た接点表面に突起を生成する等して高耐圧真空し
や断器の信頼性が損なわれと云う不都合さが認め
られる。
本発明はかかる点に鑑みてなされたもので、そ
の目的とするところは溶着成分の少量化と、ガス
不純物、ピンホールの除去とをかねそなえた優れ
た接点合金を具備し耐溶着性、耐圧性、しや断特
性、特に無再点弧性にすぐれた真空しや断器を提
供するものである。本発明の特徴は、固定電極お
よび可動電極と前記両電極を真空密閉する絶縁容
器とを具備する真空しや断器において、少なくと
も一方の電極接点がBi0.01〜0.5重量%残部Cuか
らなる合金で構成され、かつ粗大化したCu結晶
粒の長手方向を接点接触面と平行になるように配
置した点にある。
以下、本発明を図面を参照して詳細に説明す
る。
第1図は、本発明に係る真空しや断器の一構成
例を示すもので、図において、1はしや断室を示
しこのしや断室1は絶縁材料によりほぼ円筒状に
形成された絶縁容器2と、この両端に密閉機構
3,3′を介して設けた金属製の蓋体4,5とで
真空密に構成されている。しかして前記しや断室
1内には、導電棒6,7の対向する端部に取付け
られた一対の電極8,9が配設され、上部の電極
8を固定電極、下部の電極9を可動電極としてい
る。またこの可動電極9の電極棒7には、ベロー
ズ10が取付けられ、しや断室1内を真空密に保
持しながら電極9の往復動を可能にしている。ま
たこのベローズ10の上部には金属製キヤツプ1
1が被せられ、ベローズ10がアーク蒸気で覆わ
れることを防止している。また12は前記電極
8,9を覆うようにしや断室1内に設けられた円
筒状金属容器で絶縁容器2がアーク蒸気で覆われ
ることを防止している。更に電極9は、第2図に
拡大して構成を示す如く、導電棒7にロウ付部1
3によつて固定されるか、又は、かしめによつて
圧着接続されている。可動側接点14′は可動電
極9に取り付けられCu−0.01〜0.5%Bi合金で形
成されておりCu結晶粒の長手方向は接点接触面
14a,14a′と平行になつている。
第2図は上記電極接点部の断面組織で接点の
Cu結晶粒の長手方向が接点接触面と平行になつ
ていることを示す。
本発明において、上記接点を形成する銅合金で
Biを添加する理由を説明すると、Biは、他の溶着
防止成分であるPb、Teに比べ、少量添加におけ
る耐溶着性が極めて優れており高耐圧化、無再点
弧化に必要な溶着防止成分の少量化に最も適した
材料であるからである。しかしながらBiといえど
も0.01%以下では耐溶着性が不充分なためBiの添
加量の下限は0.01%である。又0.5%以上では再
点弧発生が多くなるため上限は0.5%とする。
次に本発明において電極接点のCu結晶粒の長
手方向を接点接触面と平行にする理由を説明す
る。電極接点はしや断時、アークにさらされる為
できるだけガス不純物を少なくし、しや断特性を
向上させる必要がある。この為接点合金は例えば
真空中で帯溶融精製等によりガス不純物を極力除
去した原料を用い、真空溶解炉にて合金化する。
合金化後更にガス不純物、引け巣等を除去するた
め例えば一方向凝固法等により徐冷して製作す
る。
この際、Biの添加量が少なく、又徐冷されるた
めCu結晶粒は冷却方向に沿つて成長し、例えば
直径数mm長さ10mm以上に粗大化するものもある。
従つてBiの添加量が少ない場合に、Cu結晶粒の
長手方向を接点接触面と直角に使用すると接点が
強固な溶着を起こし、耐溶着性が劣化する。
又、無理に引きはずすと表面に突起を生じた
り、表面荒れが増大し耐圧的に好ましくない。
一方、Cu結晶粒の長手方向を接点接触面と平
行に使用すると、可動側、固定側のCu結晶粒同
志が溶着しても、Cu結晶粒が容易に粒界破壊を
生じ、耐溶着性はそこなわれない。又、接点表面
の荒れも少なく、耐圧的に優れている。
従つて、Biの添加量が少なく、又Cu結晶粒が
粗大化している場合Cu結晶粒の長手方向を接点
接触面と平行になるよう配置する必要がある。こ
のように配置すれば2つの接点両方に同一材料を
使用することに限定されず、一方の電極に例えば
純銅を用いても耐溶着性は十分発揮される。
次に本発明の実施例について説明する。
真空溶解で十分に脱ガスしたCu及びBiを表1
に示す組成比(重量%)に選び、1200℃にて高周
波真空溶解を行ない、一方向凝固にて冷却し、比
較例を含め17種の合金を作製した。このようにし
て得られた各合金からそれぞれ、所定の試験片を
切り出し、それら試料について耐溶着性(引きは
ずし力)と耐圧性を測定し、この結果を表−1に
併せて示した。
なお、耐溶着性の測定は外径25mmφの各円板状
試料に、外径25mmφ、先端が10Rの球面をなす加
圧ロツドとを対向させ100Kgの荷重を加え、10-6
mmHgの真空中において50Hz、30KAの電流を半波
通電し、その時の接点の引きはずし力を持つて耐
溶着性を判断した。表−1に示す測定データは、
5個の試料について測定したときのバラツキ値も
含めて表示した。また耐圧性はパフ研摩により鏡
面研摩したMi針を陽極とし、同様に、鏡面研摩
した各試料を陰極とし、両極間のギヤツプを0.5
mmとし、10-6mmHgの真空中において徐々に電圧
を上げスパークを発生したときの電圧値を測定し
た。この場合もデータは、10回の繰返しテストを
行なつた時のバラツキ値も含めて表示した。
The present invention relates to a vacuum shear breaker, and more particularly to a vacuum sheath breaker that has improved pressure resistance and welding resistance, and less occurrence of restriking. Hitherto, high-voltage, large-capacity vacuum shields and disconnectors have been known that have electrode contacts made of a Cu alloy containing 5% by weight or less of welding prevention components (Bi, Pb, Te, etc.). The characteristics of the contact alloys used in these conventional vacuum shields and disconnectors are that they have excellent welding resistance due to the highly dispersed copper with almost zero solid solubility, low melting point, and brittle welding prevention components. , exhibits pressure resistance and shearing characteristics. By the way, vacuum disconnectors have superior features compared to other disconnectors, such as being small, lightweight, maintenance-free, and environmentally friendly.
The scope of its application has expanded year by year, from circuits of 38KV or less, which were commonly used, to even higher voltage circuits (e.g.
Application to circuits of 72KV or higher) is required.
As the pressure increases, contact materials are required to have even higher voltage resistance and excellent non-re-ignition characteristics. In order to increase the pressure resistance of the contact material and prevent restriking, it is desirable to minimize the amount of fragile welding prevention components that cause defects in pressure resistance, and to minimize gas impurities, pinholes, etc. However, when using alloy contacts made by reducing the amount of welding prevention components and slowly cooling using unidirectional solidification to remove gas impurities, pinholes, etc., the welding resistance may decrease and the tripping surface of the contact may deteriorate. Inconveniences such as increased roughness and the formation of protrusions on the contact surface impair the reliability of high-voltage vacuum shields and disconnectors are recognized. The present invention has been made in view of these points, and its purpose is to provide an excellent contact alloy that can reduce the amount of welding components and eliminate gas impurities and pinholes, and has excellent welding resistance and pressure resistance. The purpose of the present invention is to provide a vacuum shear breaker with excellent heat resistance, shearing characteristics, and especially non-restriking characteristics. A feature of the present invention is that in a vacuum shield breaker comprising a fixed electrode, a movable electrode, and an insulating container for vacuum-sealing both electrodes, at least one electrode contact is made of an alloy consisting of 0.01 to 0.5% by weight of Bi, the balance being Cu. The point is that the longitudinal direction of the coarse Cu crystal grains is arranged parallel to the contact surface. Hereinafter, the present invention will be explained in detail with reference to the drawings. FIG. 1 shows an example of the configuration of a vacuum shield disconnector according to the present invention. In the figure, 1 shows a shield and a disconnection chamber, and the shield and disconnection chamber 1 is formed of an insulating material into a substantially cylindrical shape. The insulating container 2 is vacuum-tightly constructed with metal lids 4 and 5 provided at both ends of the insulating container 2 via sealing mechanisms 3 and 3'. A pair of electrodes 8 and 9 attached to opposite ends of conductive rods 6 and 7 are arranged in the sheath cutting chamber 1, with the upper electrode 8 being a fixed electrode and the lower electrode 9 being a fixed electrode. It is a movable electrode. Further, a bellows 10 is attached to the electrode rod 7 of the movable electrode 9, allowing the electrode 9 to reciprocate while keeping the inside of the sheath cutting chamber 1 vacuum-tight. Also, a metal cap 1 is attached to the top of this bellows 10.
1 to prevent the bellows 10 from being covered with arc vapor. Further, 12 is a cylindrical metal container provided in the cutting chamber 1 to cover the electrodes 8 and 9, and prevents the insulating container 2 from being covered with arc vapor. Further, the electrode 9 has a brazed portion 1 on the conductive rod 7, as shown in an enlarged view in FIG.
3 or crimped by caulking. The movable side contact 14' is attached to the movable electrode 9 and is made of a Cu-0.01 to 0.5% Bi alloy, and the longitudinal direction of the Cu crystal grains is parallel to the contact contact surfaces 14a and 14a'. Figure 2 shows the cross-sectional structure of the electrode contact section.
This shows that the longitudinal direction of the Cu crystal grains is parallel to the contact surface. In the present invention, the copper alloy forming the contact point is
The reason for adding Bi is that compared to other welding prevention ingredients such as Pb and Te, Bi has extremely superior welding resistance when added in small amounts, and is necessary for high pressure resistance and non-restriking. This is because it is the most suitable material for reducing the amount of components. However, even if Bi is less than 0.01%, the welding resistance is insufficient, so the lower limit of the amount of Bi added is 0.01%. Also, if it exceeds 0.5%, restriking will occur frequently, so the upper limit is set at 0.5%. Next, the reason why the longitudinal direction of the Cu crystal grains of the electrode contact is made parallel to the contact surface in the present invention will be explained. Since the electrode contact is exposed to an arc when the electrode contacts break, it is necessary to reduce gas impurities as much as possible to improve the breaking characteristics. For this purpose, the contact alloy is alloyed in a vacuum melting furnace using, for example, raw materials from which gas impurities have been removed as much as possible by belt melting refining in vacuum.
After alloying, in order to remove gas impurities, shrinkage cavities, etc., the alloy is slowly cooled using, for example, a unidirectional solidification method. At this time, since the amount of Bi added is small and the cooling is slow, the Cu crystal grains grow along the cooling direction, and some become coarse, for example, several mm in diameter and 10 mm or more in length.
Therefore, when the amount of Bi added is small, if the longitudinal direction of the Cu crystal grains is used perpendicular to the contact surface of the contact, strong welding will occur at the contact and the welding resistance will deteriorate. In addition, if it is forcibly removed, protrusions may be formed on the surface and surface roughness may increase, which is not desirable in terms of pressure resistance. On the other hand, if the longitudinal direction of the Cu crystal grains is parallel to the contact surface, even if the Cu crystal grains on the movable side and fixed side are welded together, the Cu crystal grains will easily cause intergranular fracture, and the welding resistance will deteriorate. It will not be damaged. In addition, the contact surface has little roughness and is excellent in terms of pressure resistance. Therefore, when the amount of Bi added is small and the Cu crystal grains are coarse, it is necessary to arrange the longitudinal direction of the Cu crystal grains to be parallel to the contact surface. If arranged in this way, it is not limited to using the same material for both the two contacts, and even if one electrode is made of, for example, pure copper, sufficient welding resistance can be achieved. Next, examples of the present invention will be described. Table 1 shows Cu and Bi that have been sufficiently degassed by vacuum melting.
The composition ratios (wt%) shown were selected, high-frequency vacuum melting was performed at 1200°C, and cooling was performed by unidirectional solidification to produce 17 types of alloys, including comparative examples. Predetermined test pieces were cut out from each of the alloys thus obtained, and the welding resistance (stripping force) and pressure resistance of these samples were measured, and the results are also shown in Table 1. The welding resistance was measured by applying a load of 100Kg to each disc-shaped sample with an outer diameter of 25mmφ and a pressurizing rod with an outer diameter of 25mmφ and a spherical tip of 10R.
A half-wave current of 50 Hz and 30 KA was applied in a vacuum of mmHg, and the welding resistance was determined based on the contact tripping force at that time. The measurement data shown in Table-1 is
Dispersion values when measuring five samples are also displayed. In addition, for pressure resistance, the Mi needle mirror-polished by puff polishing is used as the anode, and each mirror-polished sample is used as the cathode, and the gap between the two poles is 0.5.
mm, and the voltage value was measured when a spark was generated by gradually increasing the voltage in a vacuum of 10 -6 mmHg. In this case as well, the data are displayed including the dispersion values obtained when the test was repeated 10 times.
【表】
上表より明らかな如く、本発明に係る接点は、
引はずし力が30Kg以下と優れた耐溶着性を有し、
その上62KV以上の耐圧性を有し、接点材料とし
て優れた特性を有する。
一方、Cu結晶粒の長手方向を接点接触面と直
角に用いた比較例の場合、少量Biの存在にもかか
わらず、耐溶着性は悪い。
次に、第一表中実施例1〜5及び溶着力が80Kg
以下の比較例6〜12の場合と同一組成の合金を接
点とした真空しや断器を作製し72KV、25KAの
しや断試験を行ない再点弧の発生割合を測定し
た。この結果を第2表に併せて示した。
第2表に示すデータは20回のしや断試験に対す
るデータである。
第2表から明らかな如く、本発明に係る接点は
再点弧が無く極めて優れた特性を有していること
がわかつた。
以上説明した如く、本発明に係る真空しや断器
によれば接点材料において0.01〜0.5Bi残Cuと
し、かつ粗大化したCu結晶粒の長手方向を接点
面に平行とすることにより、耐圧特性、耐溶着特
性、しや断特性時に無再点弧性に優れた特性を発
揮することができるものである。[Table] As is clear from the above table, the contacts according to the present invention are:
Has excellent welding resistance with a tripping force of 30 kg or less,
Furthermore, it has a voltage resistance of 62KV or more, and has excellent characteristics as a contact material. On the other hand, in the case of a comparative example in which the longitudinal direction of the Cu crystal grains is perpendicular to the contact surface, the welding resistance is poor despite the presence of a small amount of Bi. Next, Examples 1 to 5 in Table 1 and the welding force of 80 kg
Vacuum breakers using alloys of the same composition as in Comparative Examples 6 to 12 below were fabricated, and a break test of 72 KV and 25 KA was conducted to measure the rate of occurrence of restriking. The results are also shown in Table 2. The data shown in Table 2 is for 20 shear tests. As is clear from Table 2, it was found that the contacts according to the present invention did not cause restriking and had extremely excellent characteristics. As explained above, according to the vacuum shield breaker according to the present invention, by making the contact material have a residual Cu content of 0.01 to 0.5 Bi and making the longitudinal direction of the coarsened Cu crystal grains parallel to the contact surface, the voltage resistance is improved. It can exhibit excellent properties such as anti-re-ignition properties and non-re-ignition properties during welding resistance and shearing properties.
【表】【table】
第1図は本発明に係る真空しや断器の一構成例
を示す断面図、第2図は第1図の接点部の構成を
拡大して示す断面図である。
1……しや断室、2……絶縁容器、8……固定
電極、9……可動電極、6,7……導電軸、10
……ベローズ、14′……可動側電極接点、14
a,14′a……接点の接触面。
FIG. 1 is a sectional view showing an example of the structure of a vacuum shield disconnector according to the present invention, and FIG. 2 is an enlarged sectional view showing the structure of the contact portion of FIG. 1. DESCRIPTION OF SYMBOLS 1... Shiya disconnection chamber, 2... Insulating container, 8... Fixed electrode, 9... Movable electrode, 6, 7... Conductive shaft, 10
...Bellows, 14'...Movable side electrode contact, 14
a, 14'a...Contact surface of contact.
Claims (1)
密閉する絶縁容器とを具備する真空しや断器にお
いて、少なくとも一方の電極接点がBi0.01〜0.5
重量%、残部Cuからなる銅合金で構成され、か
つ銅結晶粒の長手方向を接触面と平行になるよう
に配置したことを特徴とする真空しや断器。1. In a vacuum shield disconnector comprising a fixed electrode, a movable electrode, and an insulating container that vacuum-seals both electrodes, at least one electrode contact has a Bi of 0.01 to 0.5.
% by weight, the balance being Cu, and characterized in that the longitudinal direction of the copper crystal grains is arranged parallel to the contact surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10276079A JPS5628420A (en) | 1979-08-14 | 1979-08-14 | Vacuum breaker |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10276079A JPS5628420A (en) | 1979-08-14 | 1979-08-14 | Vacuum breaker |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5628420A JPS5628420A (en) | 1981-03-20 |
| JPS6235211B2 true JPS6235211B2 (en) | 1987-07-31 |
Family
ID=14336143
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10276079A Granted JPS5628420A (en) | 1979-08-14 | 1979-08-14 | Vacuum breaker |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5628420A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0658779B2 (en) * | 1984-03-19 | 1994-08-03 | 株式会社東芝 | Vacuum valve |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3828347A (en) * | 1973-05-24 | 1974-08-06 | Singer Co | Error correction for an integrating analog to digital converter |
-
1979
- 1979-08-14 JP JP10276079A patent/JPS5628420A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5628420A (en) | 1981-03-20 |
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