JPS6235844U - - Google Patents
Info
- Publication number
- JPS6235844U JPS6235844U JP1985128473U JP12847385U JPS6235844U JP S6235844 U JPS6235844 U JP S6235844U JP 1985128473 U JP1985128473 U JP 1985128473U JP 12847385 U JP12847385 U JP 12847385U JP S6235844 U JPS6235844 U JP S6235844U
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- thermal head
- bonding wire
- heat
- narrow angle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000020169 heat generation Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electronic Switches (AREA)
Description
第１図は、本考案の実施例を示す平面図、第２
図は上記実施例におけるボンデイングワイヤの配
置及びボンデイング距離を示す説明図、第３図は
本考案の実施例の他例を示す平面図、第４図は従
来のサーマルヘツドを示す平面図、第５図は第４
図に示すサーマルヘツドにおけるボンデイングワ
イヤの配置及びボンデイング距離を示す説明図で
ある。
１……基板、２……発熱体部、３……ドライバ
ーＩＣ、４……ボンデイングワイヤ。
FIG. 1 is a plan view showing an embodiment of the present invention, and FIG.
The figures are explanatory diagrams showing the arrangement of bonding wires and bonding distances in the above embodiment, FIG. 3 is a plan view showing another example of the embodiment of the present invention, FIG. 4 is a plan view showing a conventional thermal head, and FIG. The figure is number 4
FIG. 3 is an explanatory diagram showing the arrangement of bonding wires and bonding distances in the thermal head shown in the figure. 1... Board, 2... Heating element section, 3... Driver IC, 4... Bonding wire.
Claims (1)
発熱抵抗体を一列又はマトリクス状に配置してな
る発熱体部と、この発熱体部に通電を行なう発熱
体駆動用ＩＣとを有し、ボンデイングワイヤによ
りこれらの間を接続したサーマルヘツドにおいて
、前記ボンデイングワイヤが発熱体部に対し狭角
を持つように配置されていることを特徴とするサ
ーマルヘツド。 (2) 前記狭角は、４０°乃至５０°である実用
新案登録請求の範囲第(1)項記載のサーマルヘツ
ド。[Scope of Claim for Utility Model Registration] (1) A heating element formed by arranging heating resistors made of minute heat-resistant resistive material in a row or in a matrix, and heat generation by energizing this heating element. 1. A thermal head having a heat generating IC and a heat generating IC connected therebetween by a bonding wire, wherein the bonding wire is arranged at a narrow angle with respect to the heating element. (2) The thermal head according to claim (1), wherein the narrow angle is between 40° and 50°.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985128473U JPS6235844U (en) | 1985-08-23 | 1985-08-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985128473U JPS6235844U (en) | 1985-08-23 | 1985-08-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6235844U true JPS6235844U (en) | 1987-03-03 |
Family
ID=31024176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985128473U Pending JPS6235844U (en) | 1985-08-23 | 1985-08-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6235844U (en) |
-
1985
- 1985-08-23 JP JP1985128473U patent/JPS6235844U/ja active Pending