JPS623600B2 - - Google Patents

Info

Publication number
JPS623600B2
JPS623600B2 JP54168870A JP16887079A JPS623600B2 JP S623600 B2 JPS623600 B2 JP S623600B2 JP 54168870 A JP54168870 A JP 54168870A JP 16887079 A JP16887079 A JP 16887079A JP S623600 B2 JPS623600 B2 JP S623600B2
Authority
JP
Japan
Prior art keywords
magazine
circuit element
circuit elements
wiring board
cylindrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54168870A
Other languages
Japanese (ja)
Other versions
JPS5588400A (en
Inventor
Satoru Kuwano
Shunichi Yabusaki
Satoshi Kitaichi
Seiichi Takezawa
Satoru Mitsunabe
Hisashi Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP16887079A priority Critical patent/JPS5588400A/en
Publication of JPS5588400A publication Critical patent/JPS5588400A/en
Publication of JPS623600B2 publication Critical patent/JPS623600B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Packaging Frangible Articles (AREA)
  • De-Stacking Of Articles (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Description

【発明の詳細な説明】 本発明は印刷配線基板の所定の位置にチツプタ
イプの抵抗素子などの回路素子を取付けるための
電子機器回路の組立装置に使用して有効な回路素
子供給用マガジンに関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a magazine for supplying circuit elements that is effective for use in an electronic equipment circuit assembly device for mounting circuit elements such as chip-type resistive elements at predetermined positions on a printed wiring board. be.

従来よりチツプタイプの回路素子は混成集積回
路などに多く用いられているが、そのようなチツ
プタイプの回路素子を印刷配線基板に取付ける場
合、従来では数値制御装置(以下、NC装置と略
称する)などにより印刷配線基板との相対位置を
定め、このNC装置の制御によりチツプタイプの
回路素子を1個づつ保持して印刷配線基板の所定
位置に設けた接着剤によつて取付け、その後半田
付けして実装する方法が用いられていた。
Chip-type circuit elements have traditionally been widely used in hybrid integrated circuits, etc., but when mounting such chip-type circuit elements on a printed wiring board, it has traditionally been necessary to use a numerical control device (hereinafter abbreviated as an NC device). The relative position with respect to the printed wiring board is determined, and the chip-type circuit elements are held one by one under the control of this NC device and attached to the printed wiring board with adhesive provided at predetermined positions, and then soldered and mounted. method was used.

そのようなNC装置を用いて取付けを行なう
と、取付け速度はパルスモータの速度などにより
制約を受けるため、あまり高速にすることができ
なく、稼動率が悪かつた。また、NC装置は、か
なり高価なものであるため、装置全体が非常に高
価となつていた。
When mounting using such an NC device, the mounting speed is limited by the speed of the pulse motor, etc., so it cannot be made very high, resulting in poor operating efficiency. Further, since the NC device is quite expensive, the entire device has become very expensive.

そこで、より一層高速に、しかも、より一層安
価な構造で、チツプタイプの回路素子を印刷配線
基板に取付ける装置の実現が切望されていた。そ
のような要望を満たしうる装置を効果的に実現し
うる方法として、複数の回路素子を同じ向きに揃
えて移動可能に収納した複数のマガジンを準備し
ておき、上記マガジンの後方開口より挿入したロ
ツドにて上記マガジンの前方開口より回路素子を
打ち出し、印刷配線基板の所定位置に設けた接着
剤にて上記マガジンより打ち出した回路素子を一
度に印刷配線基板に装着し、その後半田付けする
ことが試みられるようになつてきた。
Therefore, there has been a strong desire to realize an apparatus for attaching chip-type circuit elements to a printed wiring board at higher speed and with a lower cost structure. As a method for effectively realizing a device that can meet such demands, a plurality of magazines in which a plurality of circuit elements are arranged in the same direction and movably stored are prepared, and the magazine is inserted through the rear opening of the magazine. The circuit elements are ejected from the front opening of the magazine using a rod, and the circuit elements ejected from the magazine are mounted on the printed wiring board at once using an adhesive provided at a predetermined position on the printed wiring board, and then soldered afterwards. It is starting to be tried.

しかしながら、上述した印刷配線基板に一度に
回路素子を装着する場合には、一応、印刷配線基
板に対する複数のマガジンの配列位置によつて回
路素子の取付位置が決定されるものの、回路素子
はマガジン内で移動可能とするためのクリアラン
スをもつて収納されている関係で、印刷配線基板
の回路素子取付位置との間に若干のずれを生ずる
場合があり、印刷配線基板に対する回路素子の取
付位置精度が悪いという欠点を有していた。
However, when mounting circuit elements on the above-mentioned printed wiring board at once, although the mounting position of the circuit elements is determined by the arrangement position of multiple magazines with respect to the printed wiring board, the circuit elements are mounted inside the magazine. Due to the fact that the circuit elements are housed with clearance to allow movement, there may be a slight deviation between the mounting position of the circuit elements on the printed wiring board, and the accuracy of the mounting position of the circuit elements on the printed wiring board may be affected. It had the disadvantage of being bad.

本発明の目的は、マガジンより打ち出された回
路素子を印刷配線基板に一度に装着する電子機器
回路の組立装置において、印刷配線基板に対する
回路素子の取付位置精度を高めることができる回
路素子供給用マガジンを提供することにある。
An object of the present invention is to provide a magazine for supplying circuit elements that can improve the precision of the mounting position of circuit elements on a printed wiring board in an electronic device circuit assembly apparatus in which circuit elements punched out from a magazine are mounted on a printed wiring board at once. Our goal is to provide the following.

上記の目的を達成するため、本発明の回路素子
供給用マガジンは、両端が開口された筒体の一方
の開口端近傍の隣り合う2つの側面に、その筒体
の内部に収納された複数の回路素子が前記隣り合
う2つの側面とは反対側の筒体の内壁に圧接され
るように弾性部材を設けたことを特長とするもの
である。かかる構成によれば、筒体の開口端近傍
の側面に設けた弾性部材が上記筒体の内部に収納
した複数の回路素子のうちの最先端のものを弾性
的に保持することができるため、後方から上記筒
体内部の複数の回路素子の最後端を押すことによ
り、開口端より順次1個ずつ回路素子を取り出す
ことができる。したがつて、本発明の回路素子供
給用マガジンを複数本使用し、例えば数10個にも
及ぶチツプタイプの回路素子を一度に印刷配線基
板に装着する場合、上記マガジンをその弾性部材
を設けた側面に対向する側面を基準面として印刷
配線基板に対向させることにより、印刷配線基板
に対する回路素子の取付位置精度を向上させるこ
とができる。もつて信類性のある電子機器回路の
組立てを実現することができる。
In order to achieve the above object, the circuit element feeding magazine of the present invention has a cylindrical body which is open at both ends, and a plurality of cylindrical elements stored inside the cylindrical body on two adjacent sides near one open end of the cylindrical body. The present invention is characterized in that an elastic member is provided so that the circuit element is pressed against the inner wall of the cylindrical body on the side opposite to the two adjacent side surfaces. According to this configuration, the elastic member provided on the side surface near the open end of the cylinder can elastically hold the most advanced circuit element among the plurality of circuit elements housed inside the cylinder. By pushing the rear end of the plurality of circuit elements inside the cylinder from the rear, the circuit elements can be taken out one by one from the open end. Therefore, when a plurality of magazines for supplying circuit elements of the present invention are used to mount, for example, several dozen chip-type circuit elements on a printed wiring board at once, the magazine is attached to the side surface provided with the elastic member. By using the side surface facing the printed wiring board as a reference surface and facing the printed wiring board, it is possible to improve the accuracy of the mounting position of the circuit element with respect to the printed wiring board. It is possible to assemble electronic device circuits with high reliability.

以下、本発明の回路素子供給用マガジンについ
て実施例の図面と共に説明する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The magazine for supplying circuit elements of the present invention will be described below with reference to drawings of embodiments.

第1図及至第3図は本発明の一実施例を示す。
第1図及至第3図において、四角形状の孔を有す
る両端が開口された筒形マガジン4の内部には同
形状で同種の複数個のチツプタイプの回路素子9
が特定の向き、すなわち電極が装着された端面が
側面となるように一例に上下に積み重ねて収容さ
れており、さらに最後部(または最下部)の回路
素子の下方には上記筒形マガジン4内の回路素子
を、該回路素子の自重に抗して筒形マガジン4内
の所要の位置で支持すべく上記筒形マガジン4の
内壁20に所要の圧接力をもつて摺動自在に圧接
する回路素子受け部材19が配置されている。ま
た、上記筒形マガジン4は上記印刷配線基板1の
下方において、マガジン保持機構を構成するとこ
ろの上側および下側の2つの格子状案内板7を具
備したマガジン保持器の特定の箇所に、先端開口
部5を上に向けて植設されている。上記筒形マガ
ジン4の外壁21には上記格子状案内板7によつ
て案内される平面部が設けられ、かつ、該平面部
は上記格子状案内板7に嵌合されているので、上
記筒形マガジン4はマガジン保持器に正確に位置
決めされる。前記印刷配線基板1の下面の前記筒
形マガジン4の先端開口部5と対向する箇所には
回路素子9の両端の電極を半田付けするための導
電箔1aが所定の間隔をおいて設けられており、
その導電箔1aの間に回路素子9を装着(本実施
例では仮止め)するための熱硬化性の接着剤10
が付着されている。前記格子状案内板7の各格子
の中心と合致するように配置したピン13の先端
部13aは前記各筒形マガジン4の下端部を受け
止める受け板16に設けられた孔16aに挿通さ
れており、前記筒形マガジン4内にその後端開口
部6から出入り自在となつている。
1 to 3 show an embodiment of the present invention.
In FIGS. 1 to 3, a plurality of chip-type circuit elements 9 of the same shape and type are inside a cylindrical magazine 4 having square holes and open at both ends.
For example, they are stacked one above the other in a particular direction, that is, with the end surface with the electrode attached facing the side surface, and further below the rearmost (or lowest) circuit element is the inside of the cylindrical magazine 4. A circuit that is slidably pressed against the inner wall 20 of the cylindrical magazine 4 with a required pressure contact force in order to support the circuit element at a desired position in the cylindrical magazine 4 against the weight of the circuit element. An element receiving member 19 is arranged. Further, the cylindrical magazine 4 is provided with a tip at a specific location of a magazine holder which is provided with two upper and lower lattice-shaped guide plates 7 that constitute a magazine holding mechanism below the printed wiring board 1. It is planted with the opening 5 facing upward. The outer wall 21 of the cylindrical magazine 4 is provided with a flat part that is guided by the lattice-shaped guide plate 7, and the flat part is fitted into the lattice-shaped guide plate 7, so that the cylindrical magazine 4 The shaped magazine 4 is precisely positioned in the magazine holder. Conductive foils 1a for soldering the electrodes at both ends of the circuit element 9 are provided at a predetermined interval on the lower surface of the printed wiring board 1 at a location facing the tip opening 5 of the cylindrical magazine 4. Ori,
A thermosetting adhesive 10 for attaching (temporarily fixing in this example) the circuit element 9 between the conductive foils 1a.
is attached. The tips 13a of the pins 13 arranged so as to coincide with the centers of the respective grids of the lattice-shaped guide plate 7 are inserted into holes 16a provided in the receiving plate 16 that receives the lower end of each of the cylindrical magazines 4. , can be freely moved in and out of the cylindrical magazine 4 through the rear end opening 6.

前記筒形マガジン4は第1図に示すように外壁
21の一部に設けた突出部24を格子状案内板7
に図示のごとく係合させることにより、筒形マガ
ジン4をマガジン保持器に対して該筒形マガジン
4の長手方向に正確に位置決めし、しかも筒形マ
ガジン4の不要な離脱をも防止している。したが
つて、筒形マガジン4の全長および後端開口部6
から突出部24までの距離を精度よく加工するこ
とにより、印刷配線基板1と先端開口部5との離
間距離を精度良く出せる。この場合、上記突出部
24は格子状案内板7の格子の板厚と同程度に突
出させれば十分であり、複数個の筒形マガジン4
を格子状案内板7に隣接して並設する場合の妨げ
になるようなことはない。また、筒形マガジン4
の内部の四角形状の孔寸法は回路素子9のマガジ
ン内での詰まりを防止するために十分なクリアラ
ンスを設けてある。そのために第2図に示すよう
に筒形マガジン4の先端開口部5の隣り合う2つ
の側面に回路素子9の2つの側面を筒形マガジン
4の内壁20に押し付けるように板ばね22,2
3を設けている。この板ばね22,23により回
路素子9は常に一定の箇所に位置決めされるの
で、回路素子9を印刷配線基板1の所定の位置に
精度良く取付けることができる。また、そのよう
な板ばね22,23を設けると、筒形マガジン4
の先端開口部5が下になつた場合でも回路素子9
が筒形マガジン9から不要に脱落するようなこと
はないので、印刷配線基板1を筒形マガジン4の
下方に配設して回路素子9の取付けを行なわすよ
うにした構造の装置を容易に実現することも可能
である。またチツプタイプの回路素子9は例えば
数mm程度で極めて小型,軽量であるため、回路素
子9が印刷配線基板1に押付けられた場合に、回
路素子9のわずかな汚れや塵埃などによつて、2
個以上の回路素子がくつついて印刷配線基板1に
取付けられてしまうことがある。このため、第3
図に示すように、筒形マガジン4内に収容された
回路素子9の最先端の回路素子9′が印刷配線基
板1に押付けられた時に、第2図で説明した板ば
ね22,23の押圧力が最先端の回路素子9′の
直後の回路素子9″に加わるようにしてある。こ
れにより、印刷配線基板1の所定の位置に常にY
個の回路素子だけを取付けることが可能となる。
As shown in FIG.
By engaging as shown in the figure, the cylindrical magazine 4 is accurately positioned in the longitudinal direction of the cylindrical magazine 4 with respect to the magazine holder, and unnecessary detachment of the cylindrical magazine 4 is also prevented. . Therefore, the entire length of the cylindrical magazine 4 and the rear end opening 6
By accurately machining the distance from to the protrusion 24, the distance between the printed wiring board 1 and the tip opening 5 can be determined accurately. In this case, it is sufficient that the protrusions 24 protrude to the same extent as the thickness of the lattice of the lattice-shaped guide plate 7, and the plurality of cylindrical magazines 4
There is no problem in arranging them adjacent to the lattice-shaped guide plate 7. In addition, cylindrical magazine 4
The internal square hole size is provided with sufficient clearance to prevent the circuit element 9 from clogging in the magazine. To this end, as shown in FIG.
There are 3. Since the circuit element 9 is always positioned at a fixed position by the leaf springs 22 and 23, the circuit element 9 can be mounted at a predetermined position on the printed wiring board 1 with high precision. Moreover, if such leaf springs 22 and 23 are provided, the cylindrical magazine 4
Even when the tip opening 5 of the circuit element 9 is on the bottom, the circuit element 9
Since the printed wiring board 1 is not unnecessarily dropped from the cylindrical magazine 9, it is possible to easily create an apparatus in which the printed circuit board 1 is disposed below the cylindrical magazine 4 and the circuit elements 9 are attached. It is also possible to realize this. In addition, since the chip type circuit element 9 is extremely small and lightweight, for example on the order of several millimeters, when the circuit element 9 is pressed against the printed wiring board 1, slight dirt or dust on the circuit element 9 may cause damage to the circuit element 9.
In some cases, more than one circuit element is attached to the printed wiring board 1 in a pinched manner. For this reason, the third
As shown in the figure, when the most advanced circuit element 9' of the circuit elements 9 housed in the cylindrical magazine 4 is pressed against the printed circuit board 1, the leaf springs 22 and 23 described in FIG. The pressure is applied to the circuit element 9'' immediately after the most advanced circuit element 9'.
This makes it possible to install only one circuit element.

尚、他に第4図に例示するように、筒形マガジ
ン4の内壁20に圧接する回路素子受け部材19
の一部に凸部25を設け、かつ筒形マガジン4の
内壁20に上記凸部25を移動可能に嵌めうる凹
溝26を回路素子9の移送方向に沿つて設けれ
ば、上記回路素子受け部材19は前記凹溝26に
案内されて筒形マガジン4内を直接的に移動する
ことになる。したがつて、例えば回路素子受け部
材19として回路素子9の長さLよりも小なる幅
Wの帯板状ばねを図示のように楔状に折曲するこ
とで形成し、かつ、例えば板ばね22が設けられ
ていない側の筒形マガジン4の内壁20に回路素
子受け部材19が適度の圧接力をもつて圧接する
ように配した場合には筒形マガジン4内における
回路素子9の残りが少なくなつても、板ばね22
が回路素子受け部材19によつて不要に外方向へ
押しやられることがないので、回路素子9の位置
ずれが生じることを防止することができる。
In addition, as illustrated in FIG.
If a convex portion 25 is provided in a part of the cylindrical magazine 4, and a groove 26 into which the convex portion 25 can be movably fitted is provided in the inner wall 20 of the cylindrical magazine 4 along the transfer direction of the circuit element 9, the circuit element holder can be The member 19 is guided by the groove 26 and moves directly within the cylindrical magazine 4. Therefore, for example, the circuit element receiving member 19 may be formed by bending a strip spring having a width W smaller than the length L of the circuit element 9 into a wedge shape as shown in the figure, and, for example, the plate spring 22 When the circuit element receiving member 19 is placed in pressure contact with the inner wall 20 of the cylindrical magazine 4 on the side where the cylindrical magazine 4 is not provided, there are few remaining circuit elements 9 in the cylindrical magazine 4. Even if it gets old, the leaf spring 22
Since the circuit element 9 is not unnecessarily pushed outward by the circuit element receiving member 19, it is possible to prevent the circuit element 9 from being displaced.

以上詳述したように本発明によれば、両端が開
口された筒体の一方の開口端近傍の隣り合う2つ
の側面に設けた弾性部材は、その筒体の内部に収
容された複数の回路素子のうちの最先のもののみ
を前記弾性部材を設けた隣り合う2つ側面とは反
対側の筒体の内壁に圧接させるものであり、この
弾性部材によつて上記筒体内に収納した複数の回
路素子のうちの最先のもののみを弾性的に保持し
得るため、筒体の他方の開口端側より内部に収納
された複数の回路素子を押すことにより、一方の
開口端より順次1個ずつ回路素子を確実に取り出
すことができる。そして、筒体の他方の開口端側
より複数の回路素子を押す力も小さくて済む利点
を有する。しかも、筒体は四角形状の孔を有する
ものであるため、この筒体の開口端近傍の隣り合
う2つの側面に設けた弾性部材によつて圧接され
る回路素子は上記四角形状の孔の弾性部材を設け
た内壁面と対向する内壁面を基準面として印刷配
線基板に対応させることができ、もつて印刷配線
基板の所定位置に回路素子を位置ずれを少なくし
て確実に装着することができる利点を有する。
As described in detail above, according to the present invention, the elastic members provided on the two adjacent side surfaces near one open end of the cylindrical body with both ends open are connected to the plurality of circuits housed inside the cylindrical body. Only the foremost element among the elements is brought into pressure contact with the inner wall of the cylindrical body on the opposite side to the two adjacent side surfaces provided with the elastic member, and the plurality of elements housed in the cylindrical body are brought into contact by this elastic member. By pushing the plurality of circuit elements housed inside from the other open end side of the cylindrical body, it is possible to elastically hold only the first circuit element among the circuit elements of the cylindrical body. Circuit elements can be reliably taken out one by one. Further, there is an advantage that the force for pushing the plurality of circuit elements from the other open end side of the cylindrical body can be small. Moreover, since the cylindrical body has a square-shaped hole, the circuit element that is pressed by the elastic members provided on the two adjacent side surfaces near the open end of the cylindrical body is affected by the elasticity of the square-shaped hole. The inner wall surface opposite to the inner wall surface on which the member is provided can be used as a reference surface to correspond to the printed wiring board, thereby making it possible to reliably mount the circuit element at a predetermined position on the printed wiring board with less misalignment. has advantages.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例におけるマガジンの
要部縦断面図、第2図は同マガジンの要部拡大斜
視図、第3図は同マガジンの要部拡大縦断面図、
第4図は本発明の他の実施例を示す一部切欠要部
拡大斜視図である。 4……筒形マガジン、5……先端開口部、6…
…後端開口部、9,9′,9″……回路素子、20
……内壁、22,23……板ばね。
FIG. 1 is a vertical cross-sectional view of a main part of a magazine according to an embodiment of the present invention, FIG. 2 is an enlarged perspective view of a main part of the magazine, and FIG. 3 is an enlarged longitudinal cross-sectional view of a main part of the magazine.
FIG. 4 is a partially cutaway enlarged perspective view of another embodiment of the present invention. 4... Cylindrical magazine, 5... Tip opening, 6...
...Rear end opening, 9, 9', 9''...Circuit element, 20
...Inner wall, 22, 23... Leaf spring.

Claims (1)

【特許請求の範囲】[Claims] 1 四角形状の孔を有する両端が開口された筒体
の一方の開口端近傍の隣り合う2つの側面に、そ
の筒体の孔内部に収納された複数の回路素子のう
ち最先のものが前記隣り合う2つの側面とは反対
側の筒体の孔内壁に圧接されるように弾性部材を
設けたことを特徴とする回路素子供給用マガジ
ン。
1. On two adjacent side surfaces near one open end of a cylindrical body having a rectangular hole and open at both ends, the first one of the plurality of circuit elements housed inside the hole of the cylindrical body is A magazine for supplying circuit elements, characterized in that an elastic member is provided so as to be pressed against the inner wall of a hole in a cylindrical body on the side opposite to two adjacent side surfaces.
JP16887079A 1979-12-24 1979-12-24 Magazine for supplying circuit element Granted JPS5588400A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16887079A JPS5588400A (en) 1979-12-24 1979-12-24 Magazine for supplying circuit element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16887079A JPS5588400A (en) 1979-12-24 1979-12-24 Magazine for supplying circuit element

Publications (2)

Publication Number Publication Date
JPS5588400A JPS5588400A (en) 1980-07-04
JPS623600B2 true JPS623600B2 (en) 1987-01-26

Family

ID=15876083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16887079A Granted JPS5588400A (en) 1979-12-24 1979-12-24 Magazine for supplying circuit element

Country Status (1)

Country Link
JP (1) JPS5588400A (en)

Also Published As

Publication number Publication date
JPS5588400A (en) 1980-07-04

Similar Documents

Publication Publication Date Title
US4166667A (en) Circuit board connector
US12113243B2 (en) Connection module
CN117996364A (en) Flexible printed circuit board and connection module
USRE38089E1 (en) Card connector
CN112997355B (en) Connection module
JP2003115354A (en) Card connector
JP4403458B2 (en) Chip tray
US4093330A (en) Circuit chip receptacle
JP2741865B2 (en) Electrical connector
JPS623600B2 (en)
US4144430A (en) Cantilever spring contact having integral support pin
EP1628364A1 (en) Connector having an elastic connecting member held by a base insulator and a frame member
JPS6214665Y2 (en)
JPH02144869A (en) Fitting structure for circuit board device
JPH0887992A (en) Storage battery fixing clip
JP3072688B2 (en) Electronic parts cover sheet assembly equipment
US6626519B1 (en) Connector assembly for printer ink cartridge
JPS6144480Y2 (en)
JPH0110882Y2 (en)
EP0795932A2 (en) Connector
JPH0528776Y2 (en)
JPH0611511Y2 (en) IC socket for testing
JPH0231427Y2 (en)
JPS6333824Y2 (en)
JPH11339903A (en) Substrate mount connector