JPS6236294Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor device in which a plurality of conductors connected to a semiconductor element housed in a substantially rectangular parallelepiped container are disposed as terminals on an insulating lid.

Forming a container for accommodating semiconductor elements of a semiconductor device into a substantially rectangular parallelepiped shape is advantageous in terms of volume utilization when a large number of semiconductor devices are arranged side by side. Such a container is made of an insulating material or a metal and an insulating material, or is made of a synthetic resin molded body in which an element is embedded. Among such semiconductor devices, particularly for power use, there are some in which the end of a conductor drawn out from the element onto the lid is used as a terminal to be connected to an external conductor. In this case, it is desirable that the connection to the external conductor can be made easily. Furthermore, if it were possible to simply drill a hole in a bare conductor strip and use it as an external connection conductor, without using one with a terminal.
You can save on connection costs. However, this means that a semiconductor device is composed of many semiconductor elements,
Difficulties arise when there is also a large number of terminals for connection to external conductors. For example, as shown in FIG. 1, when a large number of terminals are arranged in two columns and multiple rows on an insulating lid 1 of a semiconductor device, if one tries to connect each terminal 2 to a conductor strip 3 indicated by a broken line, For example, insulation distances l and d are required between the conductor strips 3 and between the opposing and adjacent terminals 2, respectively, corresponding to the potential difference that occurs between them during operation of the semiconductor device. In order to keep the distance l to a minimum so as not to increase the dimensions of the semiconductor device, the holes in the conductor strip 3 must be drilled at accurate positions, which requires precision dimensional machining and increases the machining cost.

An object of the present invention is to provide a structure in which a conductor strip can be easily connected as an external conductor to a plurality of terminals provided on the lid of a substantially rectangular parallelepiped container as described at the beginning.

This objective is achieved by arranging each terminal of the semiconductor device in such a way that there is no other terminal on a line parallel to one opposite side of the container which has a different potential during operation.

Embodiments of the present invention will be described below with reference to the drawings. As shown in FIG. 2, the lid body 1 has terminals 21 to 21 connected to the electrodes of the semiconductor elements inside the container, respectively.
27 are arranged. 2 of these terminals
1, 23, 24 and 27 and 22, 25 and 2
6 are located on a line parallel to the side surface 11 of the container. However, except for terminals 24 and 25, there is only one terminal on each line parallel to the other side surface 12 of the container, which is indicated by a chain line.
Therefore, it is not possible to introduce the conductor strip 3 indicated by the dotted line in the direction of the dashed line into these terminals and connect it to the terminals 21 to 23, 26 and 27 through the holes provided in the conductor strip 3 on the same line. Since there are no other terminals or connecting conductors, it can be done very easily, and the conductor strip 3
There is no need to precisely position and drill the holes. Also, like the conductor 31 connected to the terminal 27, it can be drawn out from the terminal in both directions. On the other hand, terminals having the same potential during operation of a semiconductor device, for example, multiple terminals connected to the same electrode of a semiconductor element, may be arranged on the same line parallel to the side surface 12 of the container, as shown in the terminals 24 and 25. No problem. FIG. 3 shows another embodiment, in which a plurality of terminals 2 exist on the dashed-dot line that is not parallel to one side 11 of the container, but only one terminal 2 exists on each dash-dotted line that is parallel to the other side. Therefore, as in the case of FIG. 1, it is easy to introduce conductor strips not drawn in the direction of the parallel lines and connect them to the terminals 2.

FIG. 4 shows the appearance of a semiconductor device according to the present invention. A semiconductor element (not shown) is fixed on a metal substrate 4 via a thermally conductive insulating plate, and a lid 7 covers the upper side of a rectangular insulating frame 6 with a conductor strip 5 connected to the electrode of the element. The terminal 51 is formed by being pulled out through the terminal 51 and bent. The lid body 7 is provided with a partition wall 71 for increasing the insulation distance between the terminals 51. The external conductor can be introduced from the direction of the dashed line and connected to the terminal 51 with the screw 8. The screw 8 is inserted into a suitably shaped recess provided in the lid 7 and screwed into a locking nut.

In the above description, the connecting conductor is a conductor strip, but even when an insulated conductor having a terminal is used for connection, the connection can be easily made to the terminal arranged according to the present invention.

As described above, in the semiconductor device according to the present invention, terminals with different potentials do not exist on a line parallel to the side surface of the container, which is the direction in which the connecting conductor is introduced to the terminal, so that the connection is prevented from shorting between the conductors. This can be done very easily without any fear, and it is also possible to make holes in the conductor strip and use it as a connecting conductor, which reduces the cost required for the connection.

[Brief explanation of the drawing]

FIG. 1 is a plan view showing an example of the arrangement of multiple terminals in a conventional semiconductor device, FIGS. 2 and 3 are plan views showing different examples of the arrangement of multiple terminals according to the present invention, and FIG. 4 is a plan view showing an example of the arrangement of multiple terminals according to the present invention. FIG. 1 is a perspective view showing the appearance of an embodiment of a semiconductor device. 1... Lid, 11, 12... Container side, 2, 2
1 to 27...Terminal, 3...External connection conductor.

Claims (1)

[Scope of utility model registration request] In a device in which a plurality of conductors connected to a semiconductor element housed in a substantially rectangular parallelepiped container are arranged as terminals on an insulating cover plate, on a line parallel to one opposing side of the container, A semiconductor device characterized in that each terminal is arranged so that there are no other terminals having different potentials during operation.