JPS6236529U - - Google Patents
Info
- Publication number
- JPS6236529U JPS6236529U JP12679685U JP12679685U JPS6236529U JP S6236529 U JPS6236529 U JP S6236529U JP 12679685 U JP12679685 U JP 12679685U JP 12679685 U JP12679685 U JP 12679685U JP S6236529 U JPS6236529 U JP S6236529U
- Authority
- JP
- Japan
- Prior art keywords
- cylindrical container
- plate
- semiconductor
- anode electrode
- pores
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Description
第１図は本考案の一実施例を示し、ａは断面図
、ｂは平面図である。
１：容器、２：めつき液導管、３：カソードピ
ン、５：アノード電極板、６：フイルタ、７：半
導体板。
FIG. 1 shows an embodiment of the present invention, in which a is a sectional view and b is a plan view. 1: Container, 2: Plating liquid conduit, 3: Cathode pin, 5: Anode electrode plate, 6: Filter, 7: Semiconductor board.
Claims (1)
片面に接触するカソード接触子を、下端にめつき
液噴出口をそれぞれ備え、中間に下方から順に、
穴が開けられたアノード電極板および２５μｍ以
下の径の細孔が開けられた絶縁性フイルタ板がそ
れぞれ水平に配置されたことを特徴とする半導体
板めつき装置。 A semiconductor board is supported horizontally at the upper end of the cylindrical container, and a cathode contactor is provided in contact with one side of the cylindrical container, and a plating liquid spout is provided at the lower end.
A semiconductor plate plating apparatus characterized in that an anode electrode plate with holes and an insulating filter plate with pores with a diameter of 25 μm or less are arranged horizontally.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12679685U JPS6236529U (en) | 1985-08-20 | 1985-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12679685U JPS6236529U (en) | 1985-08-20 | 1985-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6236529U true JPS6236529U (en) | 1987-03-04 |
Family
ID=31020946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12679685U Pending JPS6236529U (en) | 1985-08-20 | 1985-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6236529U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004524436A (en) * | 2000-07-06 | 2004-08-12 | アプライド マテリアルズ インコーポレイテッド | Flow diffuser used in electrochemical plating system |
-
1985
- 1985-08-20 JP JP12679685U patent/JPS6236529U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004524436A (en) * | 2000-07-06 | 2004-08-12 | アプライド マテリアルズ インコーポレイテッド | Flow diffuser used in electrochemical plating system |