JPS6236547U - - Google Patents

Info

Publication number
JPS6236547U
JPS6236547U JP12682985U JP12682985U JPS6236547U JP S6236547 U JPS6236547 U JP S6236547U JP 12682985 U JP12682985 U JP 12682985U JP 12682985 U JP12682985 U JP 12682985U JP S6236547 U JPS6236547 U JP S6236547U
Authority
JP
Japan
Prior art keywords
stage support
taping
semiconductor device
inner lead
support bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12682985U
Other languages
Japanese (ja)
Other versions
JPH0519958Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985126829U priority Critical patent/JPH0519958Y2/ja
Publication of JPS6236547U publication Critical patent/JPS6236547U/ja
Application granted granted Critical
Publication of JPH0519958Y2 publication Critical patent/JPH0519958Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案実施例の平面図、第２図ａ，ｂ
，ｃはＰＬＣＣの平面図、側面図、底面図、第３
図と第４図は従来例の平面図である。 第１図ないし第４図において、１１はＰＬＣＣ
、１２はキヤツプ、１３は本体、１４は外リード
、１５はリードフレーム、１６はステージ、１７
はサポート・バー、１８はインナーリード、１９
はタイバー、２０は封止樹脂、２１はテーピング
である。 Fig. 1 is a plan view of the embodiment of the present invention, Fig. 2 a, b
,c are the top view, side view, and bottom view of PLCC.
This figure and FIG. 4 are plan views of the conventional example. In Figures 1 to 4, 11 is a PLCC.
, 12 is a cap, 13 is a main body, 14 is an outer lead, 15 is a lead frame, 16 is a stage, 17
is support bar, 18 is inner lead, 19
20 is a tie bar, 20 is a sealing resin, and 21 is a taping.

Claims (1)

【実用新案登録請求の範囲】 ステージ１６、ステージの４つの隅から放射状
に延びるステージ・サポート・バー１７、インナ
ーリード１８、外リード１４からなるリードフレ
ーム１５の封止においてステージ・サポート・バ
ー１７とインナーリード１８を支持するテーピン
グ２１を、 ステージ・サポート・バー１７のほぼ中間にお
いてステージ・サポート・バーにほぼ直角に位置
せしめ、 テーピング２１の両先端はインナーリード１８
相互間の空隙部に終る如くに配置して封止した構
造を特徴とする半導体装置。[Claims for Utility Model Registration] Stage support bars 17 and A taping 21 supporting the inner lead 18 is positioned approximately at right angles to the stage support bar 17 at approximately the middle of the stage support bar 17, and both ends of the taping 21 are connected to the inner lead 18.
A semiconductor device characterized by a structure in which the semiconductor device is arranged and sealed so as to end in a gap between them.
JP1985126829U 1985-08-20 1985-08-20 Expired - Lifetime JPH0519958Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985126829U JPH0519958Y2 (en) 1985-08-20 1985-08-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985126829U JPH0519958Y2 (en) 1985-08-20 1985-08-20

Publications (2)

Publication Number Publication Date
JPS6236547U true JPS6236547U (en) 1987-03-04
JPH0519958Y2 JPH0519958Y2 (en) 1993-05-25

Family

ID=31021007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985126829U Expired - Lifetime JPH0519958Y2 (en) 1985-08-20 1985-08-20

Country Status (1)

Country Link
JP (1) JPH0519958Y2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6356948A (en) * 1986-08-27 1988-03-11 Mitsui Haitetsuku:Kk Lead frame
JPS6461939A (en) * 1987-09-02 1989-03-08 Dainippon Printing Co Ltd Taping of lead frame
JPH03232257A (en) * 1990-02-07 1991-10-16 Toshiba Corp Resin-sealed semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5488268U (en) * 1977-12-05 1979-06-22
JPS5691455A (en) * 1979-12-26 1981-07-24 Fujitsu Ltd Lead frame for manufacturing of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5488268U (en) * 1977-12-05 1979-06-22
JPS5691455A (en) * 1979-12-26 1981-07-24 Fujitsu Ltd Lead frame for manufacturing of semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6356948A (en) * 1986-08-27 1988-03-11 Mitsui Haitetsuku:Kk Lead frame
JPS6461939A (en) * 1987-09-02 1989-03-08 Dainippon Printing Co Ltd Taping of lead frame
JPH03232257A (en) * 1990-02-07 1991-10-16 Toshiba Corp Resin-sealed semiconductor device

Also Published As

Publication number Publication date
JPH0519958Y2 (en) 1993-05-25

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