JPS6236580U - - Google Patents
Info
- Publication number
- JPS6236580U JPS6236580U JP12723185U JP12723185U JPS6236580U JP S6236580 U JPS6236580 U JP S6236580U JP 12723185 U JP12723185 U JP 12723185U JP 12723185 U JP12723185 U JP 12723185U JP S6236580 U JPS6236580 U JP S6236580U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- land
- coating material
- insulating coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案に係る印刷配線板の一実施例を
示す平面図、第２図は第１図のＡ―Ａ線断面図、
第３図は第１図の印刷配線板にチツプ部品を実装
した状態を示す平面図、第４図及び第６図は従来
の印刷配線板を示す平面図、第５図及び第７図は
それぞれ第４図及び第６図の断面図、第８図は第
６図に示す印刷配線板に電子部品を実装した状態
を示す断面図である。
１……基板、２……ランド、４……ソルダレジ
スト、５……チツプ部品、８……非被覆部。
FIG. 1 is a plan view showing an embodiment of a printed wiring board according to the present invention, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1,
Fig. 3 is a plan view showing a state in which chip components are mounted on the printed wiring board shown in Fig. 1, Figs. 4 and 6 are plan views showing conventional printed wiring boards, and Figs. 5 and 7 are respectively 4 and 6, and FIG. 8 is a sectional view showing the state in which electronic components are mounted on the printed wiring board shown in FIG. 6. DESCRIPTION OF SYMBOLS 1... Board, 2... Land, 4... Solder resist, 5... Chip components, 8... Uncovered part.
Claims (1)
ランドを除いた部分に耐熱性絶縁コーテイング材
を被覆した印刷配線板において、前記ランドに連
通して少なくとも１箇所に前記絶縁コーテイング
材の非被覆部を設けたことを特徴とする印刷配線
板。 In a printed wiring board in which at least a portion other than a land to which an electrode of an electronic component is soldered is coated with a heat-resistant insulating coating material, a portion not covered with the insulating coating material is provided in at least one place communicating with the land. A printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12723185U JPS6236580U (en) | 1985-08-22 | 1985-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12723185U JPS6236580U (en) | 1985-08-22 | 1985-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6236580U true JPS6236580U (en) | 1987-03-04 |
Family
ID=31021780
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12723185U Pending JPS6236580U (en) | 1985-08-22 | 1985-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6236580U (en) |
-
1985
- 1985-08-22 JP JP12723185U patent/JPS6236580U/ja active Pending