JPS6237196A - Integrated circuit card - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Summary] The present invention relates to the structure of an IC card with anti-static measures provided inside the card so that the electrode terminals are not directly touched by a person's finger or the like from the outside.

[Industrial application field]

The present invention relates to an IC card, and more specifically, to the structure of an IC card provided with anti-static measures to protect the IC.

[Conventional technology]

The IC card shown in FIG. 4 is a known one, and in the figure, 21 is an IC card body, 22 is an electrode terminal,
23 is an IC chip, and the electrode terminal 22 and the IC chip 2
It is connected to the pad (electrode) No. 3 by a wire. Conventional magnetic cards had limited storage capacity, but I
C cards have advantages such as being able to record and read information, have a large storage capacity, have excellent security and information storage ability, and allow information to be rewritten.

[Problem that the invention seeks to solve]

The only weak point of the above-mentioned IC card is that the electrode terminals are exposed on the card surface, so if a person's finger directly touches the electrode terminal, there is a risk that the IC will be destroyed by static electricity.

The present invention was created in view of these points, and an object of the present invention is to provide an IC card having a mechanism that prevents destruction of the IC due to static electricity.

[Means for solving problems]

The attached drawings show an embodiment of the present invention, in which Fig. 1 is a partially cutaway perspective view of the same embodiment, Fig. 2 is a plan view, and Fig. 3 is a front view with the front and back sides of Fig. 2 reversed. In these figures, 11 is the card body, lla is the front side, llb is the back side, 12 is a module, which includes a semiconductor chip 13,
The pads of the semiconductor chip are connected to electrode terminals 1 by wires 15.
6.

In the embodiment of the present invention, the semiconductor chip 13, the electrode terminal 1
6. The module 12 consisting of the wire 15 is attached to the card body 1
It is arranged in the recess provided in 1.

[Effect]

In the embodiment of the present invention described above, the electrode terminals are completely shielded from the outside, so that human fingers and the like cannot touch them, and the influence of static electricity can be avoided.

〔Example〕

Embodiments of the present invention will be described in detail below with reference to the drawings.

In the embodiment of the present invention, a semiconductor chip 13 on which an integrated circuit is formed is bonded onto an insulating module substrate 17 made by laminating glass fibers, for example, and pads 14 of the semiconductor chip are attached to the module substrate 17. Wires 15 are connected to some electrode terminals 16 formed at intervals from the edge 17a.
One module 12 is made by connecting the two modules.

Note that the module board 17 can be made of insulating materials other than those described above.

The module 12 has the semiconductor chip 13 on top, and
The module board is attached to the front surface 11a so that the edge 17a matches the edge of the card body, and then the back surface 11b and the front surface 11a are integrated to form the card body 11. As shown in FIG. 1, the thickness of the module board 17 is set to 0.5 fl, the thickness of the back surface 11b is set to 0.5 mm, and a plug-shaped electrode of an IC card reader/writer, for example, which contacts the electrode terminal 16 is inserted. A recess with a height of 1 dragon was formed to make the entire IC card 2 cranes thick.

The height of the recess is <1 m as described above, and since the electrode terminal is separated from the module board edge 17a, it is completely prevented that a person's finger enters there and contacts the electrode terminal 16. . The IC card body 11 is made of, for example, ABS resin, but the material is not limited thereto. Further, although the electrode terminals 16 can be formed on the module substrate 17 by conventional printing techniques, they can also be formed by other techniques such as etching.

C. Effects of the Invention] As described above, according to the present invention, the electrode terminals of the IC card are completely disposed within the recess of the card body and are shielded from the outside, so that the IC cannot be damaged by static electricity when touched by a human finger. This eliminates the risk of destruction and is effective in increasing the usage and reliability of the IC card.

[Brief explanation of drawings]

Fig. 1 is a perspective view of the embodiment of the present invention with the surface facing down, Fig. 2 is a front view of the embodiment of the invention with its surface facing down, and Fig. 3 is a top view of the embodiment of the invention. FIG. 4 is a plan view of a conventional IC card. 11 is a card body, 11a is a front surface, 11b is a back surface, 12 is a module, 13 is a semiconductor chip, 14 is a pad, 15 is a wire, 16 is an electrode terminal, and 17 is a module board. Vice, > 4, θ, Moon, 11, and FIJ # Naked prisoner 1
Figure 2: Example of IC card thousand-faced circle Figure 4

Claims (1)

[Claims] An IC card characterized in that a recess is provided in the side surface of a card base on which a semiconductor element is mounted, and electrode terminals electrically connected to the semiconductor element are arranged inside the recess.