JPS6238088B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the production of hard materials or metal cutting bands for cutting hard materials such as granite, marble, glass, cemented carbide, pottery, tiles, semiconductors, ceramics, and various metals. It is about the method.

Conventional band saws, which are mainly used for cutting hard materials, have slits at equal intervals in a strip plate made of steel plate, etc., cutouts are provided between the slits, and diamonds are inserted into the cutouts. A three-dimensional rectangular chip made of a sintered alloy containing abrasive grains was embedded so that about half of the chip protruded, and then the chips were bonded together by silver soldering.

However, such conventional band saws have
Since the chip and the strip plate are bonded together by silver brazing, the chip has a weak holding power and cannot be used for heavy cutting.

The present invention was made to eliminate the drawbacks of the conventional band saw, and its configuration will be described below with reference to the drawings.

In this invention, slits 2 of arbitrary shape are bored in a strip plate 1 at equal intervals, and a notch 3 is bored between the slits 2. When adhering a chip 4 made of a material harder than the material of the workpiece, the chip 4 formed thicker than the thickness of the strip 1 is inserted into the notch 3 of the strip 1, and then the chip 4 is attached. While heating the chip 4, pressure is applied to crush it from both sides so that the peripheral edge of the chip 4 covers the outer peripheral edge 5 of the notch 3 of the strip plate 1, and that part is sintered. This method of manufacturing a band for cutting a hard material or metal is characterized in that the band is bonded together by the following methods.

In the above configuration, the chips 4 can be formed from a mixture using a metal powder containing diamond abrasive grains as a binder.

In this case, a band saw suitable for cutting hard materials such as granite, marble, glass, cemented carbide, pottery, tiles, semiconductors, and ceramics can be obtained, and the binder The metal powder sinters the chip itself and also the periphery of the chip and the outer periphery of the notch in the strip, thereby achieving complete bonding.

In the above structure, the chip 4 can be formed from a mixture using a metal powder containing cubic boron nitride abrasive grains as a binder.

In this case, a band saw suitable mainly for cutting various metals can be obtained, and the effect of the metal powder as a binder is as described above.

In the above configuration, the chips 4 can be formed from a mixture using a polymeric material containing diamond abrasive grains as a binder.

Furthermore, the chip 4 can be formed from a mixture of a polymeric material containing cubic boron nitride abrasive grains as a binder.

Furthermore, the chip 4 can be formed from a ceramic-bonded mixture containing diamond or cubic boron nitride abrasive grains.

Further, the chip 4 can be formed from a mixture using a mixture of two or three of metal powder containing abrasive grains of diamond or cubic boron nitride, a polymer material, and ceramics as a binder.

In these embodiments, when diamond abrasive grains are included, a band saw suitable for mainly cutting hard materials can be obtained, and when cubic boron nitride abrasive grains are included, a band saw suitable for mainly cutting various types of material can be obtained. You can get a bandsaw suitable for cutting metal.

In the above configuration, the cutout portion 3 can be formed in a dovetail groove shape.

In this case, the action and effect of the dovetail groove can prevent the tip inserted into the notch of the strip plate from trying to pull out upwards, so that the tip and the strip can be prevented from coming out upward. The sintering bond with the strip can be maintained even more completely.

Hereinafter, an embodiment will be described with reference to the drawings. Reference numeral 1 denotes a strip plate made of a steel plate or the like, and the strip plate 1 is formed to have a desired length in an endless or continuous shape.

Reference numeral 2 denotes slits formed at equal intervals on one side end of the strip plate 1, and the slits 2 have a U-shape to allow good flow of cutting fluid, cutting oil, etc. during cutting. It is something to do.

3 is a notch provided between the slits 2, respectively.

Reference numeral 4 denotes a chip made of a mixture using a metal powder containing diamond abrasive grains as a binder. It protrudes about half way above 3, and the insertion part is in the notch 3.
It is formed to approximately match the .

Then, a chip 4 inserted into this notch 3
By pressurizing and heating the chip 4 from both sides in the thickness direction, the chip 4 becomes thinner than the initial thickness and the outer peripheral edge 5 of the notch 3
The notch 3 and tip 4
The material is sintered and bonded at the contact area with the material.

Note that this heating and pressurization may be performed using any method.
For example, resistance welding with a pressurizing device using air pressure may be used.

As explained above, according to this method of manufacturing a band for cutting hard materials or metals of the present invention, the chips 4
When binding to the notch 3 of the strip plate 1,
After inserting a chip 4 formed thicker than the thickness of the strip plate 1 into the notch 3 of the strip plate 1, pressurize the chip 4 from both sides while heating it so as to crush it. The peripheral edge of is the notch 3 of the strip plate 1.
Since the chip is covered with the outer peripheral edge 5 of the chip and is bound together by sintering or gluing that part, the chip has a strong holding power and can sufficiently withstand heavy cutting and repeated cutting. You can obtain a band saw for cutting.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing a band saw obtained by this method of manufacturing a band for cutting hard materials or metal according to the present invention, FIG. 2 is a side view thereof, and FIG. The A-line sectional view and FIGS. 4 to 7 show an embodiment of this method for manufacturing a band for cutting hard materials or metals according to the present invention, and FIG. 4 shows the state before the chip is heated and pressurized. FIG. 5 is a plan view of the main part in the state shown in FIG. 4, FIG. 6 is a plan view of the main part in the state where the chip is heated and pressurized, and FIG. 7 is a plan view of the main part in the state shown in FIG. 6. FIG. In the drawing, 1 is a strip plate, 2 is a slit, and 3 is a strip plate.
4 indicates a notch, 5 indicates a tip, and 5 indicates an outer peripheral edge of the notch 3.

Claims (1)

[Scope of Claims] 1. Slits 2 of any shape are made at equal intervals in the strip plate 1, and a notch 3 is made between the slits 2, and the above-mentioned strip is inserted into the notch 3. When bonding chips 4 made of a material harder than the strip 1 and the material to be cut, insert the chips 4 formed thicker than the thickness of the strip 1 into the notch 3 of the strip 1. After fitting, the chip 4 is heated and pressurized from both sides to crush it, so that the peripheral edge of the chip 4 covers the outer peripheral edge 5 of the notch 3 of the strip plate 1, and that part is removed. This method of manufacturing a band for cutting a hard material or metal, characterized in that the band is bonded together by sintering. 2. The method for manufacturing a band for cutting a hard material or metal according to claim 1, wherein the chips 4 are a mixture of metal powder containing diamond abrasive grains as a binder. 3. The method for producing a band for cutting hard materials or metals according to claim 1, wherein the chips 4 are a mixture containing a metal powder containing cubic boron nitride abrasive grains as a binder. 4. The method for manufacturing a band for cutting hard materials or metals according to claim 1, wherein the chips 4 are a mixture of a polymeric material containing diamond abrasive grains as a binder. 5. This method for producing a band for cutting a hard material or metal according to claim 1, wherein the chips 4 are a mixture using a polymeric material containing cubic boron nitride abrasive grains as a binder. . 6. The method for manufacturing a band for cutting a hard material or metal according to claim 1, wherein the chips 4 are a mixture of ceramics containing diamond abrasive grains as a binder. 7. The method for producing a band for cutting hard materials or metals according to claim 1, wherein the chips 4 are a mixture of ceramics containing cubic boron nitride abrasive grains as a binder. 8. The chip 4 according to claim 1, characterized in that the chip 4 is a mixture using as a binder a mixture of two or three of metal powder containing diamond abrasive grains, a polymer material, and ceramics. This method of manufacturing a strip for cutting hard materials or metals. 9 Chip 4 is made of metal powder, polymer material, or ceramics containing cubic boron nitride abrasive grains.
2. The method of manufacturing a band for cutting hard materials or metals according to claim 1, wherein the mixture is a mixture of different kinds of materials as a binder. 10 Claims 1 to 9, characterized in that the notch 3 is formed in a dovetail groove shape.
This method for producing a band for cutting hard materials or metals according to any one of paragraphs.