JPS6238210B2 - - Google Patents
Info
- Publication number
- JPS6238210B2 JPS6238210B2 JP57035327A JP3532782A JPS6238210B2 JP S6238210 B2 JPS6238210 B2 JP S6238210B2 JP 57035327 A JP57035327 A JP 57035327A JP 3532782 A JP3532782 A JP 3532782A JP S6238210 B2 JPS6238210 B2 JP S6238210B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- electronic components
- holder
- series
- adhesive tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002390 adhesive tape Substances 0.000 claims description 11
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 230000002950 deficient Effects 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000003780 insertion Methods 0.000 description 8
- 230000037431 insertion Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Description
【発明の詳細な説明】
(産業上の利用分野)
この発明は、リード線を有する電子部品をプリ
ント基板等へ自動挿入するに適した形態としての
電子部品連を製造する方法に関する。DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a method of manufacturing an electronic component series having a form suitable for automatically inserting electronic components having lead wires into a printed circuit board or the like.
(従来例)
第1図は、一般的な電子部品連の形状例を示し
たものである。第1図を参照して、たとえば比較
的厚みを有する紙などからなる長尺状の保持体1
の一方面上に、平行リードタイプの電子部品2
が、保持体1の長さ方向に分布して配置される。
電子部品2は、素子本体3とたとえば2本のリー
ド線4を含む。このリード線4を挾んで保持体1
の上には、接着テープ5が接着されている。保持
体1および接着テープ5を貫通して送り孔6が等
間隔に設けられる。(Conventional example) FIG. 1 shows an example of the shape of a general electronic component series. Referring to FIG. 1, a long holding body 1 made of, for example, relatively thick paper, etc.
Parallel lead type electronic component 2 is placed on one side of the
are distributed and arranged in the length direction of the holder 1.
The electronic component 2 includes an element body 3 and two lead wires 4, for example. Holding body 1 holds this lead wire 4 in between.
Adhesive tape 5 is adhered onto the top. Feed holes 6 are provided at equal intervals through the holder 1 and the adhesive tape 5.
このような電子部品連は、この形態のままでプ
リント基板などへの自動挿入機に適用されるが、
その際、プリント基板などへの自動挿入を円滑
に、かつ短時間で行なわせることが望まれてい
る。 This series of electronic components can be applied in this form to automatic insertion machines into printed circuit boards, etc.
At that time, it is desired that automatic insertion into a printed circuit board or the like be carried out smoothly and in a short time.
ところが、保持体1に保持された電子部品であ
つても、その後の検査(電気的特性や外観の検
査)によつて不良品と判断されるものがあり、こ
れらは電子部品連から取り除かれることになる。
この取り除かれた状態が第2図に示される。つま
り電子部品2のリード線4を、保持体1の端部あ
るいはその近傍において切断するのである。 However, even if the electronic components are held in the holder 1, there are some that are determined to be defective after subsequent inspection (inspection of electrical characteristics and appearance), and these may be removed from the electronic component series. become.
This removed state is shown in FIG. In other words, the lead wire 4 of the electronic component 2 is cut at or near the end of the holder 1.
(発明が解決しようとする問題点)
このような歯抜け状態になつた電子部品連を自
動挿入機に適用させると、歯抜けの部分で機械が
空回りするため自動挿入操作に円滑性を欠き、い
たずらに時間をロスしてしまうことになる。(Problems to be Solved by the Invention) When such a series of electronic parts with missing teeth is applied to an automatic insertion machine, the automatic insertion operation lacks smoothness because the machine idles at the missing teeth. You will end up wasting your time unnecessarily.
それゆえこの発明では、自動挿入機に適用して
も、プリント基板等への自動挿入操作を円滑に行
なえ、時間のロスをもなくすことのできる電子部
品連の製造方法を提供する。 Therefore, the present invention provides a method for manufacturing a series of electronic components, which can be applied to an automatic insertion machine and can smoothly perform an automatic insertion operation into a printed circuit board or the like and eliminate time loss.
(問題点を解決するための手段)
この発明の要旨は、複数個の電子部品のリード
線が、長尺状保持体の一平面に等間隔に保持され
た電子部品連であつて、前記電子部品のうち不良
品を、そのリード線を切断することによつて取り
除き、保持体上に残存しているリード線の位置と
対応する保持体の他面に、新な電子部品を、その
リード線を接着テープによつて保持させることを
特徴とする電子部品連の製造方法である。(Means for Solving Problems) The gist of the present invention is to provide an electronic component series in which lead wires of a plurality of electronic components are held at equal intervals on one plane of a long holder, Defective parts are removed by cutting their lead wires, and new electronic components are placed on the other side of the holder corresponding to the position of the remaining lead wires on the holder. This is a method for manufacturing a series of electronic components, characterized in that the electronic components are held together by adhesive tape.
(作 用)
この発明によれば、電子部品連において、取り
除かれた不良品と同じ位置に新な電子部品が固着
されることになるので、歯抜けのない電子部品連
が供給でき、これを自動挿入機に適用しても、機
械が空回りしたりせず、常に安定に連続稼動させ
ることができる。またこの発明では、新な電子部
品は、取り除かれた電子部品の残存するリード線
に対応する保持体の他面に固着するので、残存す
るリード線が邪魔にならず、しかも新な電子部品
の位置決めも容易に行なえる。(Function) According to the present invention, a new electronic component is fixed in the same position as the defective product that was removed in the electronic component series, so a complete electronic component series can be supplied and Even when applied to an automatic insertion machine, the machine will not run idly and can always operate stably and continuously. Furthermore, in this invention, the new electronic component is fixed to the other surface of the holder that corresponds to the remaining lead wires of the removed electronic component, so the remaining lead wires do not get in the way, and moreover, the new electronic component can be installed easily. Positioning is also easy.
(実施例)
第3図はこの発明の一実施例を説明するための
正面図、第4図は裏面図である。これらの図にお
いて、第1図、第2図に示す部分に相当の部分
は、同様の参照付号をもつて示し、説明の重複は
避ける。まず保持体1の一平面上に、接着テープ
5によつて固着された電子部品2のうち、不良品
と判断されたものが、保持体1の端部または端部
近傍において、そのリード線4を切断することに
よつて除去される。次いで、新な電子部品2a
を、そのリード線4aを保持体1の他の平面上に
配置し、接着テープ7によつて接着、保持され
る。この場合、新な電子部品2aは、取り除かれ
た電子部品2の残存しているリード線4と保持体
1を介して正確に対向するように、位置合せする
必要がある。また新な電子部品2aのリード線4
aの長さは、特に定められる必要はないが、接着
テープ7によつて保持され、しかも他の電子部品
2の高さに揃えられるように選ばれる。なお接着
テープ7の貼着位置は、図示のような保持体中央
部である必要はまつたくない。(Embodiment) FIG. 3 is a front view for explaining an embodiment of the present invention, and FIG. 4 is a back view. In these figures, parts corresponding to those shown in FIGS. 1 and 2 are indicated with the same reference numbers to avoid duplication of explanation. First, among the electronic components 2 fixed with adhesive tape 5 on one plane of the holder 1, an electronic component 2 determined to be defective is attached to its lead wire 4 at or near the end of the holder 1. removed by cutting. Next, new electronic component 2a
The lead wire 4a is placed on the other plane of the holder 1, and is adhered and held by the adhesive tape 7. In this case, it is necessary to align the new electronic component 2a so that it accurately faces the remaining lead wires 4 of the removed electronic component 2 via the holder 1. Also, the lead wire 4 of the new electronic component 2a
The length of a does not need to be particularly determined, but is selected so that it can be held by the adhesive tape 7 and is aligned with the height of the other electronic components 2. Note that the adhesive tape 7 does not need to be attached at the center of the holder as shown in the figure.
なお図面ならびに上記の説明は、この発明を具
体化させるためのものであつて、なんらこれらに
限定されるものではない、特に、最初から保持体
1に固着されている電子部品2の保持は、何ら長
尺状接着テープ5を用いなければならないもので
はない。また電子部品の形状、リード線の数、送
り孔の形状等も任意である。 Note that the drawings and the above description are for embodying the present invention, and are not limited to these in any way. In particular, the holding of the electronic component 2 that is fixed to the holding body 1 from the beginning is It is not necessary to use the long adhesive tape 5 at all. Further, the shape of the electronic component, the number of lead wires, the shape of the feed hole, etc. are also arbitrary.
(発明の効果)
以上のように、この発明によれば、不良品を取
り除いた保持体の他平面に、新な電子部品をその
リード線を接着テープによつて固着させるように
したものであり、簡単な作業で、容易に電子部品
連の歯抜けを防止できるものである。またこの発
明では、電子部品の位置合わせが容易で、電子部
品連としての精度を向上でき、自動挿入機などへ
適用しても、操作上なんらの支障も生じず、すぐ
れたものになる等、実用上の効果は大きい。(Effects of the Invention) As described above, according to the present invention, a new electronic component is fixed with its lead wire on the other plane of the holder from which the defective product has been removed using adhesive tape. With simple operations, it is possible to easily prevent the failure of electronic parts. In addition, this invention makes it easy to align the electronic parts, improves the accuracy of the electronic parts assembly, and even when applied to automatic insertion machines, etc., there is no problem in operation, making it an excellent product. The practical effects are significant.
第1図は一般的な電子部品連の正面図、第2図
は従来の電子部品連の正面図、第3図はこの発明
により得られた電子部品連の一実施例を示した正
面図、第4図は同裏面図である。
1……保持体、2,2a……電子部品、7……
接着テープ。
FIG. 1 is a front view of a general electronic component series, FIG. 2 is a front view of a conventional electronic component series, and FIG. 3 is a front view of an embodiment of the electronic component series obtained by the present invention. FIG. 4 is a back view of the same. 1...Holding body, 2, 2a...Electronic component, 7...
adhesive tape.
Claims (1)
体の一平面に等間隔に保持された電子部品連であ
つて、 前記電子部品のうち不良品を、そのリード線を
切断することによつて取り除き、保持体上に残存
しているリード線の位置と対応する保持体の他面
に、新な電子部品を、そのリード線を接着テープ
によつて保持させてなることを特徴とする、電子
部品連の製造方法。[Scope of Claims] 1. A series of electronic components in which lead wires of a plurality of electronic components are held at regular intervals on one plane of a long holding body, and a defective one of the electronic components is connected to the lead wires of the electronic components. The wire is removed by cutting, and a new electronic component is held on the other side of the holder corresponding to the position of the lead wire remaining on the holder using adhesive tape. A method of manufacturing a series of electronic components, characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57035327A JPS58153400A (en) | 1982-03-05 | 1982-03-05 | Method of producing electronic part series |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57035327A JPS58153400A (en) | 1982-03-05 | 1982-03-05 | Method of producing electronic part series |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58153400A JPS58153400A (en) | 1983-09-12 |
| JPS6238210B2 true JPS6238210B2 (en) | 1987-08-17 |
Family
ID=12438721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57035327A Granted JPS58153400A (en) | 1982-03-05 | 1982-03-05 | Method of producing electronic part series |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58153400A (en) |
-
1982
- 1982-03-05 JP JP57035327A patent/JPS58153400A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58153400A (en) | 1983-09-12 |
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