JPS6238866B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a semiconductor device in which a semiconductor element is sealed in a case with a resin and sealed with a lid.

Generally, when an element is sealed with resin inside a case, electrodes must be taken out from the element for connection to the outside, but these electrodes are led to the outside through holes provided in the lid of the molding case. Therefore, it is important to maintain airtightness between the electrode and the hole so that the device is not adversely affected by the external atmosphere.

Conventional methods for maintaining this airtightness include applying various sealants from the outside to the hole through which the electrode passes through the lid, or providing a protrusion surrounding the hole on the back of the lid so that the protrusion bites into the resin. In this way, the outside atmosphere was blocked off. However, the former method requires an extra step, resulting in poor workability.Also, in both cases, the gap between the electrode and the hole is narrow, making it difficult for the sealant or resin to enter, resulting in poor reliability.

The present invention has been made in view of the above, and its gist is that a convex portion having an outwardly tapered hole is provided in the electrode penetration portion of the lid of the molding case, and an uncured By pushing the convex portion into the resin and causing the resin to creep up into the upper part of the hole, the airtightness of the device is improved and the element is protected from the outside.

The principle of the present invention will be explained below with reference to FIG. 1, which shows an enlarged cross-sectional view of a convex portion provided in the electrode penetration portion of the lid and having an outwardly tapered hole.

Immediately after sealing the semiconductor element, the resin 1 is in a softened state with appropriate viscosity, so when the convex part 3 of the lid body 2 having an outwardly tapered hole is pushed into it, the inside of the convex part 3 is pressed. Since the hole 5 has a wide opening, the resin 1a penetrates into the hole along the electrode 4 relatively easily. At this time, since the inner hole 5 is formed so that its diameter becomes gradually narrower, the resin 1a that has entered the inner hole 5
is a height corresponding to the volume corresponding to the inner portion 3b (indicated by the two-dot chain line) of the convex portion surrounded by the boundary line A between the resin 1 and the space 6 and the perpendicular line B passing through the inner tip 3a of the convex portion 3. Crawling up in the direction. Therefore, the contact area between the electrode 4 and the resin 1a becomes large, and the gap created by the difference in diameter between the inner hole 5 and the electrode 4 is sufficiently filled with the resin 1a, and airtightness is maintained. Inner hole 5 of convex portion 3
Since the hole is wide, the resin 1a easily enters the hole, and the present invention improves the airtightness of the device.

Next, an embodiment of the present invention will be described with reference to a cross-sectional view of a semiconductor device shown in FIG.

Reference numeral 2 denotes a lid body having a hole 7 as a penetration part for the electrode 4, and a protrusion 3 surrounding the hole 7 is provided on the back surface of the lid body 2. is formed so that it becomes gradually narrower from its tip. Reference numeral 8 denotes a semiconductor element mounted on a substrate 9 and connected to an electrode 4. A frame 10 is attached to the substrate so as to surround the element 8, and together with the lid 2 constitutes a molding case. Immediately after this case is filled with resin 1, the curing reaction of resin 1 proceeds.

In this embodiment, when the injected resin is in a softened state and still has viscosity before hardening, the convex portion 3
into the resin 1, and place the lid 2 on the frame 1.
0, the resin 1 is inserted into the inner hole 5 of the convex portion 3.
The cover body 2 seals the case, and at the same time, the gap between the inner hole 5 and the electrode 4 is made airtight.

FIGS. 3 and 4 are enlarged cross-sectional views of the convex portion of the lid body for explaining modified examples of the present invention, and each shows that the inner hole shape of the convex portion is not limited to the embodiment shown in FIG. 2. . That is, in FIG. 3, the tip of the convex part 3 is made at an acute angle, and the inclined part provided in the inner hole 11 is made with the resin 1.
Figure 4 shows the convex portion 3.
By configuring the inclined portion provided in the inner hole 12 in a curved shape, the gap within the hole is made as small as possible to allow the resin to enter, thereby increasing the creeping up of the resin and improving airtightness.

FIG. 5 is a perspective view showing an example of the semiconductor device according to the present invention, in which a plurality of semiconductor elements are housed in the same case, and the electrode 4 is bent at a position protruding from the lid 2. There is. When a plurality of elements are housed in this manner, the number of holes 7 in the lid body 2 equal to the number of elements is required, and airtightness is required accordingly.However, according to the present invention, the resin is used as a protection means for the elements. Since the lid body is used as an airtight means at the same time as sealing the case, it is possible to achieve uniform sealing regardless of the number of holes and without requiring any special process.

Furthermore, the wide inner hole 5 of the convex portion 3, which is a feature of the present invention, allows the electrode 4 to be inserted when the lid body 2 is fixed to the frame body 10.
It has an accompanying effect as a guide means for guiding the material to the outside. This has a great effect in terms of workability when a plurality of electrodes 4 are protruded from the lid 2.

As is clear from the above description, according to the present invention,
Since the resin can easily penetrate into the lid hole through which the electrode penetrates and its airtightness has been improved, it becomes possible to easily obtain a highly reliable semiconductor device that is not affected by the external atmosphere.

[Brief explanation of the drawing]

FIG. 1 is an enlarged sectional view of a convex portion of a lid body to explain the principle of the present invention, FIG. 2 is a sectional view of a semiconductor device to explain an embodiment of the present invention, and FIGS. 3 and 4 are An enlarged cross-sectional view of a convex portion of a lid body for explaining a modified example,
FIG. 5 is a perspective view showing an example of a semiconductor device according to the present invention. 1...Resin, 2...Lid, 3...Protrusion, 4...
Electrode, 5... Inner hole, 7... Hole, 8... Semiconductor element, 9... Substrate, 10... Frame.

Claims (1)

[Claims] 1. A convex part with an outwardly tapered hole is provided in the electrode penetration part of the lid of the mold case, and the convex part is pushed into the uncured resin to cause the resin to creep up to the upper part of the hole. A method of manufacturing a semiconductor device, characterized in that: