JPS6242550Y2 - - Google Patents

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Publication number
JPS6242550Y2
JPS6242550Y2 JP1982041894U JP4189482U JPS6242550Y2 JP S6242550 Y2 JPS6242550 Y2 JP S6242550Y2 JP 1982041894 U JP1982041894 U JP 1982041894U JP 4189482 U JP4189482 U JP 4189482U JP S6242550 Y2 JPS6242550 Y2 JP S6242550Y2
Authority
JP
Japan
Prior art keywords
base
holding
wiring board
receiving surface
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982041894U
Other languages
Japanese (ja)
Other versions
JPS58144874U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4189482U priority Critical patent/JPS58144874U/en
Publication of JPS58144874U publication Critical patent/JPS58144874U/en
Application granted granted Critical
Publication of JPS6242550Y2 publication Critical patent/JPS6242550Y2/ja
Granted legal-status Critical Current

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  • Hand Tools For Fitting Together And Separating, Or Other Hand Tools (AREA)
  • Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【考案の詳細な説明】 この考案は印刷配線板にある孔にリード線の先
端部の被覆を剥した芯線を挿入し、半田槽を通過
させて基板の裏に突出した芯線の先端に半田を付
着し、配線板の回路に電気的に接続固定する際、
リード線を配線板に対し固定すると共に、その先
端部の芯線を配線板の孔に挿入した状態に支持す
るリード線の固定支持具に関する。
[Detailed explanation of the invention] This invention involves inserting a core wire with the tip of the lead wire stripped of its coating into a hole in a printed wiring board, passing it through a solder bath, and applying solder to the tip of the core wire that protrudes from the back of the board. When attaching and fixing electrically to the wiring board circuit,
The present invention relates to a lead wire fixing support that fixes the lead wire to a wiring board and supports the lead wire in a state where the core wire at the tip thereof is inserted into a hole in the wiring board.

この様に被覆リード線の先端部にある裸にした
芯線を印刷配線板の所定の孔に挿入し、配線板の
裏面に突出した芯線の先端に半田を付けてリード
線を印刷配線板に電気的に接続固定するにはリー
ド線を一本宛手で持つて行うか、嵌込み式のコネ
クタを使用するか、各種のリード端子を使用する
かして行つているが、手で持つて行うことは印刷
配線板に接続固定すべきリード線の数が多い場合
に作業性が極めて悪く、手数がかゝつて能率が上
らず、又、コネクターを使用する場合はコストが
高くなり、リード端子を使用する場合は端子を配
線板の孔に一本宛入れるのに手数がかゝると共
に、半田付けするまでに抜ける虞れがある等の欠
点がある。
In this way, insert the bare core wire at the tip of the covered lead wire into the specified hole of the printed wiring board, apply solder to the tip of the core wire that protrudes from the back of the wiring board, and connect the lead wire to the printed wiring board. To securely connect and fix the wire, you can either hold one lead wire in your hand, use a snap-in connector, or use various lead terminals. This means that when there are a large number of lead wires to be connected and fixed to the printed wiring board, the work efficiency is extremely poor and the work is time consuming and efficiency cannot be improved.Furthermore, when using connectors, the cost is high and the lead terminals are difficult to work with. When using a terminal, there are drawbacks such as it takes time to insert each terminal into the hole in the wiring board, and there is a risk that the terminal may come out before soldering.

そこで本案は基板に接続固定すべきリード線が
複数本であつてもその全部を配線板の孔と整合し
た状態に保持し、各リード線の先端部の芯線を配
線板の各孔に抜ける虞なく同時に挿入し、一度に
半田付けできる様にして従来の問題点を解消し、
印刷配線板へのリード線の半田付け作業を能率化
することを目的とするもので、以下、図示の一実
施例を参照して本考案を説明する。
Therefore, even if there are multiple lead wires to be connected and fixed to the board, this proposal maintains all of them in a state aligned with the holes in the wiring board, and eliminates the risk of the core wire at the tip of each lead wire passing through each hole in the wiring board. By making it possible to insert and solder at the same time without any problems, we solved the problems of the conventional method.
The present invention is intended to streamline the work of soldering lead wires to a printed wiring board, and will be described below with reference to an embodiment shown in the drawings.

1は印刷配線板で、リード線2の芯線2′を挿
入して固定すべき配線孔1′を所定の配置で複数
個有する。
Reference numeral 1 denotes a printed wiring board, which has a plurality of wiring holes 1' arranged in a predetermined manner into which core wires 2' of lead wires 2 are inserted and fixed.

本案の固定支持具は上記配線孔1′と同配置の
保持孔3を上下方向に有し、下面には基板5に対
して固定するためのクリツプ脚4を下向きに一体
に備えた基体5と、基体5の両端一側5aから突
出した突出部5′,5′に薄肉のヒンジ片6,6で
一体に連接し、ヒンジ片6,6を撓めて保持孔3
の上端が開口した基体5の上面上を横切つて移動
可能な抑え片7からなるプラスチツクの成形品で
あり、基体5の上面上には保持孔3の縁に沿つて
起立した受止面8を有する段8′が隆設されてい
る。
The fixing support of the present invention has a holding hole 3 in the vertical direction with the same arrangement as the wiring hole 1', and a base 5 integrally provided with clip legs 4 facing downward for fixing to the board 5 on the lower surface. , are integrally connected to protrusions 5', 5' protruding from both ends 5a of the base body 5 by thin hinge pieces 6, 6, and the retaining hole 3 is connected by bending the hinge pieces 6, 6.
It is a plastic molded product consisting of a holding piece 7 that is movable across the top surface of a base 5 with an open top end, and a receiving surface 8 that stands up along the edge of the holding hole 3 on the top surface of the base 5. A raised step 8' is provided.

成形の際はヒンジ片6,6を一直線状に延ば
し、抑え片7を基体5の他側5bとの間に間隔を
保つて沿わせる。勿論、ヒンジ片6,6も基体の
各端面との間に間隔を保たせる(第2,3図)。
そして、使用する際にヒンジ片6,6を上向きに
曲げると共に少し引張り、第3図に矢印で示した
様に抑え片7を段8′の上を無理に越えて旋動さ
せ抑え片7の受止面8と対向する面の下部7′を
受止面8の上部に当接し、第1図の状態に保つ。
During molding, the hinge pieces 6, 6 are extended in a straight line, and the holding piece 7 is placed along the other side 5b of the base 5 while keeping a distance therebetween. Of course, the hinge pieces 6, 6 are also kept at a distance from each end face of the base body (FIGS. 2 and 3).
When in use, the hinge pieces 6, 6 are bent upward and pulled slightly, and the holding piece 7 is forced to swing over the top of the step 8' as shown by the arrow in FIG. The lower part 7' of the surface facing the receiving surface 8 is brought into contact with the upper part of the receiving surface 8, and the state shown in FIG. 1 is maintained.

リード線2を取付けるには、上述の様に抑え片
7を更に旋動して受止め面8から離し、指でその
状態に抑え片を保持し、抑え片7と段8′の受止
面8の間から各保持孔3中に上からリード線2を
入れ(第4図)、必要なリード線を入れ終つたら
抑え片から指を離す。これによりヒンジ片6,6
が元に戻ろうとする弾力で抑え片7は受止面8と
喰い違い状に全部のリード線を受止面8に向かつ
て押付け、リード線を保持する(第4図)。この
場合、各リード線の保持孔3中に突入した先端は
被覆を剥して芯線2′を出して置くが、芯線の先
端は基体の下面から必要量突出させて置いてもよ
いし、基体の下面から突出させなくてもよい。
To attach the lead wire 2, as described above, rotate the holding piece 7 further to separate it from the receiving surface 8, hold the holding piece in this state with your fingers, and press the holding piece 7 and the receiving surface of the step 8'. Insert the lead wire 2 from above into each holding hole 3 between the holes 8 (FIG. 4), and when the necessary lead wires have been inserted, release your finger from the holding piece. As a result, the hinge pieces 6, 6
Due to the elasticity of the wires trying to return to their original positions, the holding piece 7 presses all the lead wires toward the receiving surface 8 in a manner that is offset from the receiving surface 8, thereby holding the lead wires (FIG. 4). In this case, the tip of each lead wire that has protruded into the holding hole 3 is peeled off to expose the core wire 2', but the tip of the core wire may be placed so as to protrude the required amount from the bottom surface of the base, or It does not have to protrude from the bottom surface.

次にクリツプ脚4を印刷配線板1に明けてある
取付孔9に押込んで基体5を配線板上に固定す
る。基体の下面からリード線の芯線が夫々必要量
突出しているときは芯線を夫々配線孔1′に貫通
させながらクリツプ脚を取付孔に押込んで配線板
に固定する。又、芯線が基体下面から突出してい
ないときはクリツプ脚で基体を印刷配線板上に固
定すると各保持孔3の下端は配線孔1′に連通す
るので、再び指で抑え片7をヒンジ片6,6の弾
力に抗して旋動し、各リード線を保持孔中に下向
きに押込み、芯線を基体下面から突出させて配線
孔中に貫通させればよい。
Next, the clip legs 4 are pushed into the mounting holes 9 formed in the printed wiring board 1 to fix the base body 5 on the wiring board. When the core wires of the lead wires protrude by the required amount from the lower surface of the base, the core wires are passed through the wiring holes 1' and the clip legs are pushed into the mounting holes and fixed to the wiring board. In addition, when the core wire does not protrude from the bottom surface of the base, if the base is fixed on the printed wiring board using the clip legs, the lower end of each holding hole 3 will communicate with the wiring hole 1', so press the holding piece 7 with your fingers again to the hinge piece 6. , 6, and push each lead wire downward into the holding hole, causing the core wire to protrude from the lower surface of the base and pass through into the wiring hole.

こうして先端の芯線2′を夫々配線孔1′中に貫
通したリード線の全部はクリツプ脚4により配線
板1上に固定された基体の段8′の受止面8と抑
え片7との間に挾まれ、配線板に対して抜けるこ
となく固定される。従つて配線板の下面を半田溶
解槽の半田液の液面に浸すことにより配線板下面
から突出するリード線の各芯線の先端に半田が付
着し、リード線は配線板に対して電気的に固定さ
れる。
In this way, all of the lead wires that have passed through the core wires 2' at the tips into the wiring holes 1' are between the receiving surface 8 of the step 8' of the base body fixed on the wiring board 1 by the clip leg 4 and the holding piece 7. It is held in place and fixed to the wiring board without coming off. Therefore, by immersing the bottom surface of the wiring board in the liquid level of the solder solution in the solder melting tank, solder adheres to the tip of each core wire of the lead wire that protrudes from the bottom surface of the wiring board, and the lead wire is electrically connected to the wiring board. Fixed.

リード線を突入させる基体の保持孔3は図示の
様に上半部が上向きに拡径したテーパ孔3a、下
半部3bは芯線2′が丁度通れる小径孔であるた
め、リード線の挿入が容易であると共に、リード
線を押込む場合に被覆の下端部は下半部3bの直
上に受止められて止まるのでリード線の押込みは
自動的に制御され且つ基体の下面からの芯線の突
出長さを一定に揃えることができる。
As shown in the figure, the holding hole 3 of the base body into which the lead wire is inserted is a tapered hole 3a whose diameter expands upward in the upper half, and the lower half 3b is a small diameter hole through which the core wire 2' can just pass, making it easy to insert the lead wire. Not only is it easy to push in the lead wire, but the lower end of the sheath is received and stopped just above the lower half 3b, so the pushing of the lead wire is automatically controlled and the protrusion length of the core wire from the bottom surface of the base is controlled automatically. It is possible to maintain a constant level.

又、受止面8と、これにすれ違い状に対向する
抑え片7の前面には各保持孔3に対応した位置に
縦方向の窪み10,11を設け、リード線の一部
を受入れる様にしてある。この窪みは受止面と抑
え片の前面の双方に設けず、どちらか一方に設け
るだけでもよいが、この様に窪みを設けることに
よつて受止面と抑え片の前面の間で挾んだリード
線が上記両面に沿つてずれ動くことを確実に防止
できる。
In addition, vertical depressions 10 and 11 are provided in the front surface of the receiving surface 8 and the holding piece 7 that faces the receiving surface 8 so as to cross each other, at positions corresponding to the respective holding holes 3, so as to receive part of the lead wire. There is. This depression may not be provided on both the receiving surface and the front surface of the holding piece, but may be provided on either one of them, but by providing the depression in this way, it can be sandwiched between the receiving surface and the front surface of the holding piece. It is possible to reliably prevent the lead wire from shifting along both surfaces.

尚、クリツプ脚4はこの実施例ではアンカー形
のものを示したが、身を細めて取付孔9に押込ま
れ、基体の下面が配線板上面に当接したときは元
の状態に膨張しようとして配線板上に基体を固定
することができればどの様な構造のものでもよ
い。
Although the clip leg 4 is shown as an anchor type in this embodiment, when it is narrowed and pushed into the mounting hole 9 and the bottom surface of the base comes into contact with the top surface of the wiring board, it tries to expand to its original state. Any structure may be used as long as the base can be fixed onto the wiring board.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本案の一実施例を示すもので、第1図は
使用状態の斜面図、第2図は成形状態の平面図、
第3図は同上の−線に沿う断面図、第4図は
リード線を取付ける状態の斜面図、第5図はリー
ド線の取付け終つた状態の斜面図、第6図は配線
板上に固定した状態の側面図、第7図はリード線
の芯線を配線板の配線孔に押込んでいる状態の側
面図で、図中、1は印刷配線板、1′は配線孔、
2はリード線、2′はその芯線、3は保持孔、4
はクリツプ脚、5は基体、6はヒンジ片、7は抑
え片、8は受止面を示す。
The drawings show one embodiment of the present invention; Fig. 1 is a perspective view of the used state, Fig. 2 is a plan view of the molded state;
Figure 3 is a sectional view taken along the same line as above, Figure 4 is a slope view with the lead wire attached, Figure 5 is a slope view with the lead wire installed, and Figure 6 is a perspective view of the lead wire fixed on the wiring board. Figure 7 is a side view of the state in which the core wire of the lead wire is pushed into the wiring hole of the wiring board. In the figure, 1 is the printed wiring board, 1' is the wiring hole,
2 is a lead wire, 2' is its core wire, 3 is a holding hole, 4
5 is a clip leg, 5 is a base body, 6 is a hinge piece, 7 is a holding piece, and 8 is a receiving surface.

Claims (1)

【実用新案登録請求の範囲】 印刷配線板にある配線孔と同配置で、上下方向
に貫通してリード線を収容する保持孔が両端間に
列設され、下面からは前記印刷配線板にある取付
孔に押込んで取付けられるクリツプ脚が突出した
基体と、 上記基体の各端一側からの突出部に連らなり、
基体の他側を越えて延長する一対のヒンジ片と、 上記一対のヒンジ片の先端間を連結する抑え片
とを備え、 前記基体は上面に保持孔の縁に近接し、且つ基
体の一側に向いて起立する受止面を有し、 前記抑え片は対のヒンジ片を上向きに曲げ、基
体の上を横切つて移動することにより上記受止面
と対向することができる様になつている共に、前
記基体の両端間に列設された各保持孔の下半部
は、リード線の先端部の被覆を剥した芯線を通す
ように径が小さくなつており、且つ前記基体の受
止面と、この受止面に対向する抑え片の面の一方
又は、双方には各保持孔に挿通するリード線の一
部を受入れる縦方向の窪みが該保持孔と同じ配置
で列設されていることを特徴とするリード線の固
定支持具。
[Claims for Utility Model Registration] Holding holes that penetrate in the vertical direction and accommodate lead wires are arranged in a row between both ends in the same arrangement as the wiring holes in the printed wiring board, and are visible from the bottom side of the printed wiring board. A clip leg that is attached by being pushed into the mounting hole is connected to a protruding base, and a protrusion from one side of each end of the base,
a pair of hinge pieces extending beyond the other side of the base; and a holding piece connecting the tips of the pair of hinge pieces; The retaining piece has a receiving surface that stands upright facing toward the base, and the holding piece can bend the pair of hinge pieces upward and move across the top of the base so that it can face the receiving surface. At the same time, the lower half of each holding hole arranged in a row between both ends of the base has a small diameter so as to pass through the core wire with the sheath removed from the tip of the lead wire. On one or both of the surface and the surface of the holding piece facing this receiving surface, vertical recesses for receiving part of the lead wires to be inserted into each holding hole are arranged in rows in the same arrangement as the holding holes. A fixed support for lead wires.
JP4189482U 1982-03-26 1982-03-26 Fixed support for lead wire Granted JPS58144874U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4189482U JPS58144874U (en) 1982-03-26 1982-03-26 Fixed support for lead wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4189482U JPS58144874U (en) 1982-03-26 1982-03-26 Fixed support for lead wire

Publications (2)

Publication Number Publication Date
JPS58144874U JPS58144874U (en) 1983-09-29
JPS6242550Y2 true JPS6242550Y2 (en) 1987-10-31

Family

ID=30053064

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4189482U Granted JPS58144874U (en) 1982-03-26 1982-03-26 Fixed support for lead wire

Country Status (1)

Country Link
JP (1) JPS58144874U (en)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6011649Y2 (en) * 1979-08-30 1985-04-17 日本電信電話株式会社 Case for mounting LSI chip

Also Published As

Publication number Publication date
JPS58144874U (en) 1983-09-29

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