JPS6242596A - flexible printed circuit board - Google Patents
flexible printed circuit boardInfo
- Publication number
- JPS6242596A JPS6242596A JP60182157A JP18215785A JPS6242596A JP S6242596 A JPS6242596 A JP S6242596A JP 60182157 A JP60182157 A JP 60182157A JP 18215785 A JP18215785 A JP 18215785A JP S6242596 A JPS6242596 A JP S6242596A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- flexible printed
- soldering
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/048—Second PCB mounted on first PCB by inserting in window or holes of the first PCB
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、フレキシブルプリント基板に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to flexible printed circuit boards.
従来の技術
一般に、フレキシブルプリント基板の他のプリント基板
への半田付けは、第７図に示すように。BACKGROUND ART Generally, a flexible printed circuit board is soldered to another printed circuit board as shown in FIG.
相手基板９上の導電パターン１ｏ上に形成された半田層
８の上にフレキシブルプリント基板１の導電パターン２
を重ねて２手作業により半田付けを行なっていた。The conductive pattern 2 of the flexible printed circuit board 1 is placed on the solder layer 8 formed on the conductive pattern 1o on the mating board 9.
Soldering was done by two manual processes, overlapping the steps.
発明が解決しようとする問題点
ところが、このような半田付は方法では、作業工数が多
く１作業の品質も安定しない。そこで、本発明はディッ
プ半田付けを行なうことによって。Problems to be Solved by the Invention However, with this soldering method, the number of work steps is large and the quality of each work is not stable. Therefore, the present invention uses dip soldering.
工数削減と品質の安定化を図ることのできるフレキシブ
ルプリント基板を提供するものである。The present invention provides a flexible printed circuit board that can reduce man-hours and stabilize quality.
問題点を解決するための手段
本発明によるフレキシブルプリント基板は、その先端部
を折曲して半田付は部分の形状を相手基板の取付孔に保
合可能な形とし、保合挿入後にディップにより半田付け
を可能にせんとするものである。Means for Solving the Problems The flexible printed circuit board according to the present invention bends its tip to make the soldering portion into a shape that can be fitted into the mounting hole of the mating board, and after the soldering is inserted, it is soldered by dipping. The purpose is to enable soldering.
作用
上記構成によれば、フレキシブルプリント基板の先端部
は折曲されて剛性が増加しているため。Effect: According to the above configuration, the tip end of the flexible printed circuit board is bent to increase its rigidity.
半田付は時に相手基板の孔へ挿入するだけで仮固定でき
、半田付けがディヮブ半田付けによってできるため、工
数削減及び品質を安定化することができるものである。Soldering can sometimes be done temporarily by simply inserting the board into a hole in the mating board, and soldering can be done by diagonal soldering, which can reduce man-hours and stabilize quality.
実施例
以下、本発明の一実施例について図面を参照しながら説
明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例におけるディップ半田付は対
応のフレキシブルプリント基板の形状を示す斜視図、第
２図はその作製過程を示す斜視図である。第２図に示す
ようにフレキシブルプリント基板１の先端部を折り返し
、位置イからプリント基板１の裏面が互に接合する矢印
口の折り返し方向に折り返し、接着剤等により固定する
。また後述のように相手基板５の挿入孔θに挿入するに
際してフレキシブルプリント基板１の厚みだけでは充分
な剛性が得られない場合は、第３図のように台板４を使
用し厚みをとる。第４図〜第６図は上述の構成よりなる
フレキシブルプリント基板１の相手基板５への取付は状
態を示す。まず第４図に示すように相手基板５の挿入孔
６に相手基板５の部品面７側から挿入する。第５図に挿
入後の状態を示す。この時、フレキシブルプリント基板
１は、その先端部を折返すことにより得た剛性と側縁に
設けた弾性変形可能な係合片部３によって相手基板５に
固定されている。この状態でディップ半田付けを行なえ
ば、第６図のようにフレキシブルプリント基板１の銅箔
２と相手基板６の銅箔２とが半田８により結線される。FIG. 1 is a perspective view showing the shape of a flexible printed circuit board that is compatible with dip soldering in one embodiment of the present invention, and FIG. 2 is a perspective view showing the manufacturing process thereof. As shown in FIG. 2, the tip of the flexible printed circuit board 1 is folded back from position A in the folding direction indicated by the arrow where the back surfaces of the printed circuit board 1 are joined to each other, and fixed with adhesive or the like. Further, as will be described later, when the thickness of the flexible printed circuit board 1 alone does not provide sufficient rigidity when inserting it into the insertion hole θ of the mating board 5, a base plate 4 is used as shown in FIG. 3 to increase the thickness. 4 to 6 show how the flexible printed circuit board 1 having the above-described structure is attached to the mating board 5. FIG. First, as shown in FIG. 4, it is inserted into the insertion hole 6 of the mating board 5 from the component surface 7 side of the mating board 5. FIG. 5 shows the state after insertion. At this time, the flexible printed circuit board 1 is fixed to the mating board 5 by the rigidity obtained by folding back its tip and by the elastically deformable engagement pieces 3 provided on the side edges. If dip soldering is performed in this state, the copper foil 2 of the flexible printed circuit board 1 and the copper foil 2 of the mating board 6 are connected by the solder 8 as shown in FIG.
なお、本実施例では、固定方法として保合片部３を使用
したが、フレキシブルプリント基板１の厚みを利用して
抜は強度をもたせたものでもよい。In the present embodiment, the retaining piece 3 is used as a fixing method, but the thickness of the flexible printed circuit board 1 may be used to provide strength during removal.
発明の効果
以上のように本発明は、フレキシブルプリント基板の半
田付は部分を折曲げることにより剛性を持たせであるた
め、ディップ半田付けができ、そのことによって、工数
削減及び品質を安定化することができ、その実用的効果
は犬なるものがある。Effects of the Invention As described above, the present invention allows soldering of flexible printed circuit boards by bending the parts to give them rigidity, which enables dip soldering, thereby reducing man-hours and stabilizing quality. It is possible to do this, and its practical effects are similar to that of a dog.
第１図は本発明の一実施例におけるフレキシブルプリン
ト基板の斜視図、第２図はその製法過程を示す斜視図、
第３図は本発明の他の実施例におけるフレキシブルプリ
ント基板の側面図、第４図は本発明のフレキシブルプリ
ント基板の他基板への接続作業の過程を示す斜視図、第
６図は同過程のディ・ノブ半田付は前の正面図、第６図
は同ディップ半田付は後の側面図、第７図は従来のフレ
キシブルプリント基板の半田付は過程を示す斜視図であ
る。。
１・・・・・・フレキシブルプリント基板、２・・・・
・・銅箔。
３・・・・・・係合片部、４・・・・・・台板、５・・
・・・・相手基板、６・・・・・・挿入孔、γ・・・・
・・部品面、８・・・・・・半田、９・・・・・・相手
基板半田面、１０・・・・・・導電パターン。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図 １−７Ｌ、”７７−＋＊７”＋７ｙｌｉ□よ
：、：ｓ’；ｚ７ ２
寸 ０稼
稼
裁 −６
＜下FIG. 1 is a perspective view of a flexible printed circuit board according to an embodiment of the present invention, and FIG. 2 is a perspective view showing the manufacturing process thereof.
FIG. 3 is a side view of a flexible printed circuit board according to another embodiment of the present invention, FIG. 4 is a perspective view showing the process of connecting the flexible printed circuit board to another circuit board of the present invention, and FIG. 6 is a side view of the flexible printed circuit board of the present invention. D-knob soldering is a front front view, FIG. 6 is a rear side view of dip soldering, and FIG. 7 is a perspective view showing the process of conventional soldering of flexible printed circuit boards. . 1...Flexible printed circuit board, 2...
··Copper foil. 3... Engagement piece part, 4... Base plate, 5...
...Mating board, 6...Insertion hole, γ...
...Component side, 8... Solder, 9... Solder side of mating board, 10... Conductive pattern. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 1-7L, "77-+*7"+7yli□yo:,:s';z7 2 sun 0 gain
Earnings judgment -6 <lower
Claims (1)
裏面どうしを直接あるいは間接に接合して、他の接合す
べきプリント基板に設けられた係合孔に挿入係合される
半田付け部を形成したフレキシブルプリント基板。The ends of a flexible printed circuit board are bent and the back sides of the boards are directly or indirectly joined to form a soldered part that is inserted into and engaged with an engagement hole provided in another printed circuit board to be joined. Flexible printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60182157A JPS6242596A (en) | 1985-08-20 | 1985-08-20 | flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60182157A JPS6242596A (en) | 1985-08-20 | 1985-08-20 | flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6242596A true JPS6242596A (en) | 1987-02-24 |
Family
ID=16113351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60182157A Pending JPS6242596A (en) | 1985-08-20 | 1985-08-20 | flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6242596A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0353866U (en) * | 1989-09-30 | 1991-05-24 | ||
| JPH0487675U (en) * | 1990-11-30 | 1992-07-30 | ||
| JP2006089564A (en) * | 2004-09-22 | 2006-04-06 | Dainippon Ink & Chem Inc | Adhesive for folding and fixing flexible printed circuit boards |
| WO2017055686A1 (en) | 2015-09-28 | 2017-04-06 | Tactotek Oy | Multilayer structure and related method of manufacture for electronics |
-
1985
- 1985-08-20 JP JP60182157A patent/JPS6242596A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0353866U (en) * | 1989-09-30 | 1991-05-24 | ||
| JPH0487675U (en) * | 1990-11-30 | 1992-07-30 | ||
| JP2006089564A (en) * | 2004-09-22 | 2006-04-06 | Dainippon Ink & Chem Inc | Adhesive for folding and fixing flexible printed circuit boards |
| WO2017055686A1 (en) | 2015-09-28 | 2017-04-06 | Tactotek Oy | Multilayer structure and related method of manufacture for electronics |
| US9801286B2 (en) | 2015-09-28 | 2017-10-24 | Tactotek Oy | Multilayer structure and related method of manufacture for electronics |
| TWI636880B (en) * | 2015-09-28 | 2018-10-01 | 芬蘭商塔克圖科技有限公司 | Multilayer structure for electronic device and related manufacturing method |
| EP3890460A1 (en) | 2015-09-28 | 2021-10-06 | Tactotek Oy | Multilayer structure and related method of manufacture for electronics |
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