JPS6247148U - - Google Patents

Info

Publication number
JPS6247148U
JPS6247148U JP13962385U JP13962385U JPS6247148U JP S6247148 U JPS6247148 U JP S6247148U JP 13962385 U JP13962385 U JP 13962385U JP 13962385 U JP13962385 U JP 13962385U JP S6247148 U JPS6247148 U JP S6247148U
Authority
JP
Japan
Prior art keywords
semiconductor element
semiconductor device
electrodes
semiconductor
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13962385U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13962385U priority Critical patent/JPS6247148U/ja
Publication of JPS6247148U publication Critical patent/JPS6247148U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図は本考案の一実施例による
半導体装置の概略構造図、第3図はその実施例の
半導体装置の等価回路図である。 1……ダイオードチツプ、2,3……導体(電
極)、4……容器、5……開閉器、5a……固定
接点部、5b……形状記憶合金による可動接点部
、6……冷却板、7……アルミ板。
1 and 2 are schematic structural diagrams of a semiconductor device according to an embodiment of the present invention, and FIG. 3 is an equivalent circuit diagram of the semiconductor device of the embodiment. 1... Diode chip, 2, 3... Conductor (electrode), 4... Container, 5... Switch, 5a... Fixed contact part, 5b... Movable contact part made of shape memory alloy, 6... Cooling plate , 7...aluminum plate.

補正 昭61.7.8 図面の簡単な説明を次のように補正する。 明細書第7頁15行の「アルミ板」を「セラミ
ツク絶縁板」と補正する。
Amendment July 8, 1981 The brief description of the drawing is amended as follows. "Aluminum plate" on page 7, line 15 of the specification is corrected to "ceramic insulating plate."

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ダイオードまたはサイリスタチツプなどの半導
体素子を容器内に収容し、この半導体素子に接続
される各々の電極を外部へ引き出してなる外装構
造の半導体装置において、前記半導体素子の2つ
の主電極間に、その電極の少くとも一方に一体に
形成された形状記憶合金による可動接点部を有す
る開閉器を並列に設けたことを特徴とする半導体
装置。
In a semiconductor device having an exterior structure in which a semiconductor element such as a diode or a thyristor chip is housed in a container, and each electrode connected to the semiconductor element is drawn out to the outside, the semiconductor element is placed between two main electrodes of the semiconductor element. 1. A semiconductor device characterized in that a switch having a movable contact portion made of a shape memory alloy integrally formed with at least one of the electrodes is provided in parallel.
JP13962385U 1985-09-12 1985-09-12 Pending JPS6247148U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13962385U JPS6247148U (en) 1985-09-12 1985-09-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13962385U JPS6247148U (en) 1985-09-12 1985-09-12

Publications (1)

Publication Number Publication Date
JPS6247148U true JPS6247148U (en) 1987-03-23

Family

ID=31045702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13962385U Pending JPS6247148U (en) 1985-09-12 1985-09-12

Country Status (1)

Country Link
JP (1) JPS6247148U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012518912A (en) * 2009-04-07 2012-08-16 海立▲爾▼股▲ふん▼有限公司 AC light emitting diode structure with overload protection

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012518912A (en) * 2009-04-07 2012-08-16 海立▲爾▼股▲ふん▼有限公司 AC light emitting diode structure with overload protection

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