JPS6247148U - - Google Patents
Info
- Publication number
- JPS6247148U JPS6247148U JP13962385U JP13962385U JPS6247148U JP S6247148 U JPS6247148 U JP S6247148U JP 13962385 U JP13962385 U JP 13962385U JP 13962385 U JP13962385 U JP 13962385U JP S6247148 U JPS6247148 U JP S6247148U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor device
- electrodes
- semiconductor
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
Landscapes
- Breakers (AREA)
Description
第1図および第2図は本考案の一実施例による
半導体装置の概略構造図、第3図はその実施例の
半導体装置の等価回路図である。
1……ダイオードチツプ、2,3……導体(電
極)、4……容器、5……開閉器、5a……固定
接点部、5b……形状記憶合金による可動接点部
、6……冷却板、7……アルミ板。
1 and 2 are schematic structural diagrams of a semiconductor device according to an embodiment of the present invention, and FIG. 3 is an equivalent circuit diagram of the semiconductor device of the embodiment. 1... Diode chip, 2, 3... Conductor (electrode), 4... Container, 5... Switch, 5a... Fixed contact part, 5b... Movable contact part made of shape memory alloy, 6... Cooling plate , 7...aluminum plate.
補正 昭61.7.8
図面の簡単な説明を次のように補正する。
明細書第7頁15行の「アルミ板」を「セラミ
ツク絶縁板」と補正する。Amendment July 8, 1981 The brief description of the drawing is amended as follows. "Aluminum plate" on page 7, line 15 of the specification is corrected to "ceramic insulating plate."
Claims (1)
体素子を容器内に収容し、この半導体素子に接続
される各々の電極を外部へ引き出してなる外装構
造の半導体装置において、前記半導体素子の2つ
の主電極間に、その電極の少くとも一方に一体に
形成された形状記憶合金による可動接点部を有す
る開閉器を並列に設けたことを特徴とする半導体
装置。 In a semiconductor device having an exterior structure in which a semiconductor element such as a diode or a thyristor chip is housed in a container, and each electrode connected to the semiconductor element is drawn out to the outside, the semiconductor element is placed between two main electrodes of the semiconductor element. 1. A semiconductor device characterized in that a switch having a movable contact portion made of a shape memory alloy integrally formed with at least one of the electrodes is provided in parallel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13962385U JPS6247148U (en) | 1985-09-12 | 1985-09-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13962385U JPS6247148U (en) | 1985-09-12 | 1985-09-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6247148U true JPS6247148U (en) | 1987-03-23 |
Family
ID=31045702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13962385U Pending JPS6247148U (en) | 1985-09-12 | 1985-09-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6247148U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012518912A (en) * | 2009-04-07 | 2012-08-16 | 海立▲爾▼股▲ふん▼有限公司 | AC light emitting diode structure with overload protection |
-
1985
- 1985-09-12 JP JP13962385U patent/JPS6247148U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012518912A (en) * | 2009-04-07 | 2012-08-16 | 海立▲爾▼股▲ふん▼有限公司 | AC light emitting diode structure with overload protection |
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