JPS6252944U - - Google Patents
Info
- Publication number
- JPS6252944U JPS6252944U JP1985146207U JP14620785U JPS6252944U JP S6252944 U JPS6252944 U JP S6252944U JP 1985146207 U JP1985146207 U JP 1985146207U JP 14620785 U JP14620785 U JP 14620785U JP S6252944 U JPS6252944 U JP S6252944U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- mounting device
- circuit board
- printed circuit
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の実施例に係るヒートシンク
取付け装置組立て工程の一部を示す正面図、第２
図は同装置の一部切欠斜視図、第３図はヒートシ
ンクの組み立てた状態を示す斜視図、第４図は従
来の装置を示す正面図である。
３０……半導体素子、２０……ヒートシンク、
１０……プリント基板、５０……コネクタピン、
２２′……孔。
Fig. 1 is a front view showing a part of the process of assembling the heat sink mounting device according to the embodiment of this invention;
The figure is a partially cutaway perspective view of the same device, FIG. 3 is a perspective view showing the assembled state of the heat sink, and FIG. 4 is a front view showing the conventional device. 30... semiconductor element, 20... heat sink,
10...Printed circuit board, 50...Connector pin,
22'... hole.
Claims (1)
ートシンクをプリント基板上に取り付けるための
ヒートシンク取付け装置であつて、前記プリント
基板の部品組立面上に所定数のコネクタピンを植
立させ、これらのコネクタピンに対応したヒート
シンクの底面に孔を設け、これらの孔に前記コネ
クタピンを挿着することを特徴とするヒートシン
ク取付け装置。 (2) コネクタピンがオクタルピンであることを
特徴とする実用新案登録請求の範囲第１項記載の
ヒートシンク取付け装置。 (3) 側壁にスリツトを設けたことをヒートシン
クの孔であることを特徴とする実用新案登録請求
の範囲第２項記載のヒートシンク取付け装置。[Claims for Utility Model Registration] (1) A heat sink mounting device for mounting a heat sink on a printed circuit board for dissipating heat from a semiconductor element, the device comprising: a predetermined number of connectors on a component assembly surface of the printed circuit board; A heat sink mounting device characterized in that pins are erected, holes are provided in the bottom surface of the heat sink corresponding to these connector pins, and the connector pins are inserted into these holes. (2) The heat sink mounting device according to claim 1, wherein the connector pin is an octal pin. (3) The heat sink mounting device according to claim 2, wherein the slit provided in the side wall is a hole in the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985146207U JPS6252944U (en) | 1985-09-24 | 1985-09-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985146207U JPS6252944U (en) | 1985-09-24 | 1985-09-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6252944U true JPS6252944U (en) | 1987-04-02 |
Family
ID=31058464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985146207U Pending JPS6252944U (en) | 1985-09-24 | 1985-09-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6252944U (en) |
-
1985
- 1985-09-24 JP JP1985146207U patent/JPS6252944U/ja active Pending
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