JPS6253575U - - Google Patents
Info
- Publication number
- JPS6253575U JPS6253575U JP1985144854U JP14485485U JPS6253575U JP S6253575 U JPS6253575 U JP S6253575U JP 1985144854 U JP1985144854 U JP 1985144854U JP 14485485 U JP14485485 U JP 14485485U JP S6253575 U JPS6253575 U JP S6253575U
- Authority
- JP
- Japan
- Prior art keywords
- glass
- outer ring
- lead wire
- metal outer
- reinforcing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
第１図は本考案に係る気密端子の一実施例を示
す平面図、第２図は第１図のＡ―Ａ線に沿う拡大
断面図、第３図は本考案の他の実施例を示す拡大
断面図である。第４図は従来の気密端子の平面図
、第５図は第４図のＢ―Ｂ線に沿う断面図である
。 １……金属外環、４……ガラス、９……リード
線、９ａ……内側端部、１０……筒状補強部材、
１１……金属外環、１２……リード線、１２ａ…
…内側端部、１３……ガラス、１４……筒状補強
部材。
す平面図、第２図は第１図のＡ―Ａ線に沿う拡大
断面図、第３図は本考案の他の実施例を示す拡大
断面図である。第４図は従来の気密端子の平面図
、第５図は第４図のＢ―Ｂ線に沿う断面図である
。 １……金属外環、４……ガラス、９……リード
線、９ａ……内側端部、１０……筒状補強部材、
１１……金属外環、１２……リード線、１２ａ…
…内側端部、１３……ガラス、１４……筒状補強
部材。
Claims (1)
- 【実用新案登録請求の範囲】 金属外環にリード線を貫通し、ガラスにて封止
したものにおいて、 前記リード線の金属外環の内面側に突出する内
側端部に、筒状補強部材を嵌挿し、前記ガラスで
固定したことを特徴とする気密端子。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985144854U JPS6253575U (ja) | 1985-09-20 | 1985-09-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985144854U JPS6253575U (ja) | 1985-09-20 | 1985-09-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6253575U true JPS6253575U (ja) | 1987-04-02 |
Family
ID=31055847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985144854U Pending JPS6253575U (ja) | 1985-09-20 | 1985-09-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6253575U (ja) |
-
1985
- 1985-09-20 JP JP1985144854U patent/JPS6253575U/ja active Pending